109 results on '"Perdu, P."'
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2. Integrating pulsed laser for a galvo mirror based SEE scanning microscope with optical failure analysis capabilities
3. Automatic defect localization in VLSI circuits: A fusion approach based on the Dempster-Shafer theory
4. Automatic processing scheme for low laser invasiveness electro optical frequency mapping mode
5. Fast 3D electro-optical frequency mapping and probing in frequency domain
6. Signal and image processing techniques for VLSI failure analysis
7. Automatic Emission Spots Identification in Static and Dynamic Imaging by Research of Local Maxima
8. Spatial correction in dynamic photon emission by affine transformation matrix estimation
9. Cluster matching in time resolved imaging for VLSI analysis
10. Temperature effect on reflected laser probing signal of multiple elementary substructures
11. Comparison of C.W. Electro Optical Probing and Light Emission Techniques
12. How to Interpret the Reflected Laser Probe Signal of Multiple Elementary Substructures in Very Deep Submicron Technologies
13. Analysis of short-term NBTI effect on the Single-Event Upset sensitivity of a 65nm SRAM using two-photon absorption
14. Optical probing (EOFM / TRI): A large set of complementary applications for ultimate VLSI
15. New statistical post processing approach for precise fault and defect localization in TRI database acquired on complex VLSI
16. Electron temperature - The parameter to be extracted from backside spectral photon emission
17. Time Resolved Imaging Solving FPGA Logic Fault Localization by Pattern Matching Technique
18. Filtering and Emission Area Identification in the Time Resolved Imaging Data
19. Time Resolved Imaging at low power supply on 45nm technology
20. 3D current path in stacked devices: Metrics and challenges
21. Dynamic Power Analysis under Laser Stimulation: A New Dynamic Laser Simulation Approach
22. Infrared and Visible—Near Infrared Electroluminescence Developments for FA in AlGaN/GaN HEMTS on SiC
23. Facing more than moore, is magnetic microscopy the new Swiss knife for 3D defect localization in SiP?
24. From Static to Full Dynamic Laser Stimulation
25. UV Emission Microscopy Development for High Band Gap Components
26. Full Dynamic Laser simulation set up
27. A new Methodology for Short Circuit Localization on Integrated Circuits using Magnetic Microscopy Technique Coupled with Simulations
28. Best test pattern failure analysis flow for functional logic failure localization by IR-OBIRCH technique
29. Fault localization by Dynamic Laser Stimulation extended testing
30. Improved integrated circuits qualification using Dynamic Laser Stimulation techniques
31. Differentiation between Artifacts and True Defects in 45 nm BEOL Structures in M-TLS Technique
32. Dynamic Laser Stimulation Technique for Device Qualification Process
33. Backside Failure Analysis by Electroluminescence on Microwave Devices
34. Novel Application of the OBIRCh Amplifier for Timing Failure Localization
35. Improved image processing to enhance thermal laser stimulation signal
36. Scan-based ATPG diagnostic and optical techniques combination: A new approach to improve accuracy of defect isolation in functional logic failure
37. 3-D Defect Localization by Measurement and Modeling of the Dynamics of Heat Transport in Deep Sub-Micron Devices
38. Jitter Improvement of Time-Resolved Photoelectric Laser Stimulation for Dynamic Imaging of Integrated Circuits
39. Phase Variation Mapping, a Dynamic Laser Stimulation Technique with Picosecond Timing Resolution
40. Picosecond Timing Analysis in Integrated Circuits with Pulsed Laser Stimulation
41. Analysis of short-term NBTI effect on the Single-Event Upset sensitivity of a 65nm SRAM using two-photon absorption.
42. Guideline for Interpreting IR Laser Stimulation Signal on Semiconductors for Materials and for Improving Failure Analysis Flow
43. Influence of Laser Pulse Duration in Single Event Upset Testing
44. Electrical modeling for laser testing with different pulse durations
45. Silicon Thinning using Ultra-Short Pulse Laser Ablation
46. ESD induced latent defects in CMOS ICs and reliability impact
47. 3D current path in stacked devices: Metrics and challenges.
48. Multi variation mapping for Dynamic Laser Stimulation analysis.
49. Time Resolved Imaging at low power supply on 45nm technology.
50. Magnetic Emission Mapping for Passive Integrated Components Characterisation
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