Author: "Muniandy K" / Publication Type: Conference Materials - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Muniandy K"' showing total 4 results

Start Over Author "Muniandy K" Publication Type Conference Materials

4 results on '"Muniandy K"'

1. Thermosonic vs thermocompression flip chip bonding for low cost system in package

Author: Lim, M. R., primary, Sauli, Z., additional, Aris, H., additional, Retnasamy, V., additional, Lo, C., additional, Muniandy, K., additional, Khan, N., additional, and Foong, C. S., additional
Published: 2018
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2. The optimization of ultrasonic power and bonding time for thermosonic flip chip bonding

Author: Lim, M. R., primary, Sauli, Z., additional, Aris, H., additional, Retnasamy, V., additional, Lo, C., additional, Muniandy, K., additional, Khan, N., additional, and Foong, C. S., additional
Published: 2018
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3. First level interconnection based on optimization of Cu stud bump for chip to chip package

Author: Lim, M. R., primary, Sauli, Z., additional, Aris, H., additional, Retnasamy, V., additional, Lo, C., additional, Muniandy, K., additional, Khan, N., additional, and Foong, C. S., additional
Published: 2018
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4. Top-Gate Molding Process Development of Cavity Down TBGA for High Density Wire Bonding and Low K Dielectric Wafer Technology Application.

Author: Muniandy, K., Ruzaini, I., and Shim Kar Wei
Published: 2006
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