120 results on '"Moreau, S."'
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2. New Method to Perform TDDB Tests for Hybrid Bonding Interconnects
3. 3D interconnection using copper direct hybrid bonding for GaN on silicon wafer
4. Impact of Process Variations on the Capacitance and Electrical Resistance down to $1.44\ \mu\mathrm{m}$ Hybrid Bonding Interconnects
5. 28nm FDSOI CMOS Technology (FEOL and BEOL) Thermal Stability for 3D Sequential Integration: Yield and Reliability Analysis
6. Robustness and reliability achievements for direct hybrid bonding integration: a review
7. Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
8. Study of Combustion Noise Generation in a Realistic Turbine Stage Configuration
9. Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability
10. 3D Si interposer & WLP for small power devices for harsh conditions
11. Deuxième journée de conférence de l’AKPI sur le thème : différentes approches de la verticalité chez l’enfant en rééducation
12. Making Synchrotron Tomography a Routine Tool for 3D Integration Failure Analysis through a Limited Number of Projections, an Adapted Sample Preparation Scheme, and a Fully-Automated Post-Processing
13. Electrical Performance of High Density 10 µm Diameter 20 µm Pitch Cu-Pillar with Chip to Wafer Assembly
14. Effect of passivation annealing on the electromigration properties of hybrid bonding stack
15. ITAC: A complete 3D integration test platform
16. Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
17. Electromigration in hybrid bonding interconnects for 3-D IC impact of the diffusion barrier
18. Aeroacoustic Analysis of a Low-Subsonic Axial Fan
19. Uncertainty Quantification of Thermoacoustic Instabilities in a Swirled Stabilized Combustor
20. Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding
21. On the material depletion rate due to electromigration in a copper TSV structure
22. Low temperature metal bonding for 3D and power device packaging
23. Fast and easy sample preparation with reduced curtaining artifacts using a P-FIB
24. Design and hardware implementation of PMSM sliding mode control in SISO and MIMO cases
25. Mass transport-induced failure in direct copper (Cu) bonding interconnects for 3-D integration
26. Bearing Fault diagnosis using a pre-filtering and a spectral identification algorithm
27. Reliability of Dual Damascene TSV for high density integration: The electromigration issue
28. Real time implementation of a robust controller for PMSM drive system using H∞ norm
29. Rapid prototyping of a multivariable control with pole placement by state feedback of a PMSM: LMI approach
30. Innovative Project for In-situ Geophysical Instrumentation of Bioreactor Landfill: Short and Long Term Monitoring
31. Estimation of Electrical Resistivity Error using Numerical Model for Waste Landfill Characterisation
32. 3D Numerical Analysis of Heat Transfer in a Low Reynolds Number Microturbine Cascade
33. Enabling technologies for advanced wafer level camera integration
34. Experimental study of acoustic streaming in a high level standing wave guide: Influence of mean temperature and higher harmonics distribution
35. 200°C direct bonding copper interconnects : Electrical results and reliability
36. Investigation of stress induced voiding and electromigration phenomena on direct copper bonding interconnects for 3D integration
37. Process optimization and performance analysis of an electrostatically actuated varifocal liquid lens
38. Reliability study of 3D-WLP through silicon via with innovative polymer filling integration
39. Resistance increase due to electromigration induced depletion under TSV
40. DIRECT SIMULATION OF TRAILING-EDGE NOISE GENERATED BY A CONTROLLED DIFFUSION AIRFOIL USING A LATTICE-BOLTZMANN METHOD
41. Effects of stress in polysilicon VIA - first TSV technology
42. Identification and compensation of torque ripples of a PMSM in a haptic context
43. Speed control by RST with load observer of a Permanent Magnet Synchronous Motor
44. Through Silicon Via polymer filling for 3D-WLP applications
45. Influence of speed estimation methods and encoder resolutions on the stiffness of a haptic interface
46. Speed estimation comparison between full order state observer & Kalman filter for a haptic interface
47. Speed estimation improvement using full order state observer for a haptic interface
48. Impact of the CMP Process on the Multilevel Stack Mechanical Reliability
49. 300 mm Multi Level Air Gap Integration for Edge Interconnect Technologies and Specific High Performance Applications
50. Speed Controller Using Time Constrained Output Feedback for Permanent Magnet DC Motor
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