21 results on '"Huang, Shaowu"'
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2. Techniques for improving system-in-package integration and electrical performance
3. Using Broadband Green's function method to model interconnects of traces and vias
4. Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits
5. Novel de-embedding method with look-up table for characterization of interconnects
6. New broadband equalizer optimization technique for digital system designs
7. Analysis of radiated emissions from PCB using broadband Green's function method
8. Novel characterization technique with short and open standards
9. Improve electrical performance of interconnects using inkjet printing
10. Probe with absorbing materials
11. Novel de-embedding method with Look-Up Table for characterization of interconnects
12. New broadband equalizer optimization technique for digital system designs
13. Broadband Green's function and applications to fast electromagnetic modeling of high speed interconnects
14. Suppression of Cavity Resonant Edge Effects and PDN impedance using absorbing material
15. Rigorous one-port measurement method for the characterization of on-chip pad response
16. Integrated power supply packaging technique with reduced parasitic inductance for on-die voltage regulator design and application
17. Technique to improve the accuracy of mixed-mode S-parameters derived from single-ended results and application to shorter test coupon design
18. Subwavelength imaging of plasmon superlens with 3-dimensional small surface roughness
19. Soil moisture retrieval over low-vegetation surfaces using time-series radar observations and a lookup table representation of forward scattering
20. Bistatic scattering, backscattering and emissivities of randomly rough soil surfaces at L band based on numerical solutions of Maxwell equations of 3 Dimensional simulations
21. Broadband Green's function and applications to fast electromagnetic modeling of high speed interconnects.
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