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Start Over Author "Hakamata T" Publication Type Conference Materials
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1. Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

Author

Chew, S-A., primary, Yu, H., additional, Schaekers, M., additional, Demuynck, S., additional, Mannaert, G., additional, Kunnen, E., additional, Rosseel, E., additional, Hikavyy, A., additional, Dangol, A., additional, Meyer, K. De, additional, Mocuta, D., additional, Horiguchi, N., additional, Leusink, G., additional, Wajda, C., additional, Hakamata, T., additional, Hasegawa, T., additional, Tapily, K., additional, and Clark, R., additional

Published
2017
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