1. 3D sequential integration with Si CMOS stacked on 28nm industrial FDSOI with Cu-ULK iBEOL featuring RO and HDR pixel
- Author
-
Mota-Frutuoso, T., primary, Lapras, V., additional, Brunet, L., additional, Basset, L., additional, Lugo, J., additional, Fenouillet-Beranger, C., additional, Vinet, M., additional, Lattard, D., additional, Boulard, F., additional, Exbraya, Y., additional, Boutry, D., additional, Billoint, O., additional, Bosch, D., additional, Maneglia, Y., additional, Peizerat, A., additional, Dumas, S., additional, Sicard, G., additional, Kerdiles, S., additional, Kanyandekwe, J., additional, Sideris, P., additional, Mazzocchi, V., additional, Sarrazin, A., additional, Loup, V., additional, Mauguen, G., additional, Morales, C., additional, Alba, P. Acosta, additional, Balan, V., additional, Perrot, C., additional, Sturm, J., additional, Euvrard, C., additional, Aussenac, F., additional, Janaud, A., additional, Chapon, J-D., additional, Guillermet, M., additional, Guglieri, S., additional, Bailly, F., additional, Toresani, P., additional, Fournel, F., additional, Mouhdach, M., additional, Berthoud, A., additional, Chapelon, L-L., additional, Ribotta, M., additional, Ponthenier, F., additional, Magalhaes, A., additional, Maitrejean, S., additional, Moulin, C., additional, Michailos, J., additional, Arnaud, F., additional, Cathelin, A., additional, Arcamone, J., additional, Andrieu, F., additional, Garros, X., additional, Gaillard, F., additional, and Batude., P., additional
- Published
- 2023
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