1. Early Failure Detection in Fatigue Tests of BGA Packages.
- Author
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Jabłoński, Ryszard, Turkowski, Mateusz, Szewczyk, Roman, Wrona, R., and Drozd, Z.
- Abstract
The latest results of lead-free BGA solder joints investigations, performed in frame of GreenRoSE Project financed by EC, are presented. In our investigations were used test specimens BGA256r, developed in Warsaw University of Technology (WUT), and TopLine dummy components. Lead - free and lead - containing components were compared. Mechanical tests were performed by cyclic bending on mechanical stand developed in WUT. Thermal shocks are performed according to standards IPC 9701A and EN 62137. In this paper are presented the results of mechanical tests. [ABSTRACT FROM AUTHOR]
- Published
- 2007
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