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This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints' wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples' depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints' average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart. [ABSTRACT FROM AUTHOR]

The electron transfer layer (ETL) plays a vital role in achieving high-performance perovskite solar cells (PSCs). Titanium dioxide (TiO2) is primarily utilised as the ETL since it is low-cost, chemically stable, and has the simplest thin-film preparation methods. However, TiO2 is not an ideal ETL because it leads to low conductivity, conduction band mismatch, and unfavourable electron mobility. In addition, the exposure of TiO2 to ultraviolet light induces the formation of oxygen vacancies at the surface. To overcome these issues, doping TiO2 with various metal ions is favourable to improve the surface structure properties and electronic properties. This review focuses on the bulk modification of TiO2 via doping with various metal ions concentrations to improve electrical and optical properties, charge carrier density, and interfacial electron–hole recombination, thus contributing to enhancing the power conversion efficiency (PCE) of the PSCs. [ABSTRACT FROM AUTHOR]

This paper focused on the effect of deposition conditions on the microstructural and mechanical properties of the ceramic coating. In this study, Al2O3 – 13%TiO2 coated mild steel were prepared by using atmospheric plasma spray technology with different plasma power ranging from 25 kW to 40 kW. The as-sprayed coatings consist of γ-Al2O3 phase as the major phase and small amount of the titania phase existed in the coating structure. High degree of fully melted region was observed in the surface morphology for the coating sprayed with high plasma power, which lead to the high hardness and low percentage of porosity. In this study, nanoindentation test was carried out to investigate mechanical properties of the coating and the results showed that the coatings possess high elastic behaviour, which beneficial in engineering practice.

Purpose – The purpose of this paper is to make people aware of the increase usage of laser system in surface texturing process. Design/methodology/approach – As it is a brief review paper, no particular method was used. Findings – It has been found that most of the surface texturing methods used mas laser beam machining using Nd:YAG laser. It shows that the realization of the textured surface helps to reduce friction and wear which can increase the life span of a material. Research limitations/implications – Most of the texturing is done on the substrates directly, and few research were conducted on coated surface of the material, which coating is also known as an excellent method to improve tribological properties. Originality/value – The paper shows details on the recent development of surface texturing and its contribution to friction and wear reduction. [ABSTRACT FROM AUTHOR]

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints' wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples' depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints' average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.