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Thin-disk multipass amplifiers represent one of the most powerful approaches to scale the average and peak powers of ultrafast laser systems. The present paper presents the amplification of picosecond and femtosecond pulses to average powers exceeding 2 and 1 kW, respectively. Second-harmonic generation in lithium-triborate crystals with powers higher than 1.4 kW and 400 W at a wavelength of 515 nm with picosecond and femtosecond pulse durations, respectively, are also reported. Furthermore, third-harmonic generation was demonstrated with output powers exceeding 250 W at a wavelength of 343 nm. Finally, processing of silicon, metals, and polycrystalline diamond with fs pulses at an average power of 1 kW is presented to demonstrate removal rates that are improved by orders of magnitude as compared to state-of-the-art techniques. [ABSTRACT FROM AUTHOR]

With the average power of commercial ultrafast lasers reaching the kW-level, process parallelization is required to avoid detrimental quality issues, such as caused by heat accumulation. This is especially relevant in the case of helical drilling, as the processing strategy is only employed when precise geometry, high-quality surface finish, tight tolerances, and high reproducibility are a priority. We illustrate that parallelization by means of a multipass process is conceptually attractive for pulsed drilling processes, but also challenging due to limitations imposed by the properties of appropriate beam-steering devices. While paraxial beam propagation methods applied to the suggested setup predict no aberrations, deviations from the idealized solution are a concern. Our experimental proof-of-principle investigations show that parallelization by means of a deflector preceding the helical drilling optics is possible while ensuring nearly identical processing parameters for all parallelly processed boreholes. [ABSTRACT FROM AUTHOR]

Process planning in manufacturing today focuses on optimizing the conflicting targets of cost, quality, and time. Due to increasing social awareness and subsequent governmental regulation, environmental impact becomes a fourth major aspect. Eventually, sustainability in manufacturing ensures future competitiveness. In this paper, a framework for the planning of sustainable manufacturing is proposed. It is based on the abstraction and generalization of manufacturing resources and part descriptions, which are matched and ranked using a multi-criteria decision analysis method. Manufacturing resources provide values for cost, quality, time and environmental impacts, which multiply with their usage within a manufacturing task for a specific part. The framework is validated with a detailed modeling of a laser machine as a resource revealing benefits and optimization potential of the underlying data model. Finally, the framework is applied to a use case of a flange part with two different manufacturing strategies, i.e., laser metal-wire deposition and conventional milling. The most influential parameters regarding the environmental impacts are the raw material input, the manufacturing energy consumption and the machine production itself. In general, the framework enabled the identification of non-predetermined manufacturing possibilities and the comprehensive comparison of production resources. [ABSTRACT FROM AUTHOR]

Laser materials processing with ultra-short pulses allows very precise and high quality results with a minimum extent of the thermally affected zone. However, with increasing average laser power and repetition rates the so-called heat accumulation effect becomes a considerable issue. The following discussion presents a comprehensive analytical treatment of multi-pulse processing and reveals the basic mechanisms of heat accumulation and its consequence for the resulting processing quality. The theoretical findings can explain the experimental results achieved when drilling microholes in CrNi-steel and for cutting of CFRP. As a consequence of the presented considerations, an estimate for the maximum applicable average power for ultra-shorts pulsed laser materials processing for a given pulse repetition rate is derived.