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The article focuses on the Electronic Device Failure Analysis Society's 2018 International Symposium for Testing and Failure Analysis in the U.S. The event gathered failure analysts from around the world for a unique chance to learn from peers, resolve FA challenges together, and build lasting networking connections through tutorials, workshops, and panel discussion, as well as an expo floor featuring 118 exhibits with experts providing live demonstrations.

The article presents case studies related to the indent-and cleaving method developed by LatticeGear LLC, cleaving solutions provider for semiconductor industry. Topics discussed include effectiveness of the method as compare to manual cleaving, factors related to the scribe-and-cleaving method and sample-preparation success through the indent-and-cleaving technique. Several tables are also presented related to the comparison of the methods.

The article offers information on the 44th International Symposium for Testing and Failure Analysis (ISTFA) in Phoenix, Arizona on October 28 to November 1, 2018.