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Mg-doped, graded AlGaN films showed the formation of an impurity band and high, temperature-invariant p-conductivity even for doping levels well below the Mott transition. However, compensating point defects disrupted the impurity band, resulting in an Anderson transition from the impurity band to valence band conduction and a more than tenfold reduction in room-temperature conductivity. This is the first demonstration of Anderson-like localization in AlGaN films. [ABSTRACT FROM AUTHOR]

We report here an optically pumped deep UV edge emitting laser with AlGaN multiple quantum wells (MQWs) active region grown on AlN substrate by low pressure organometallic vapor phase epitaxy (LP-OMVPE) in a high-temperature reactor. The 21 period Al0.53Ga0.47N/Al0.7Ga0.3N MQWs laser structure was optically pumped using 193 nm deep UV excimer laser source. A laser peak was achieved from the cleaved facets at 280.3 nm with linewidth of 0.08 nm at room temperature with threshold power density of 320 kW/cm2. The emission is completely TE polarized and the side mode suppression ratio (SMSR) is measured to be around 14 dB at 450 kW/cm2.

In this study, the Raman biaxial stress coefficients KII and strain-free phonon frequencies ω0 have been determined for the E2 (low), E2 (high), and A1 (LO) phonon modes of aluminum nitride, AlN, using both experimental and theoretical approaches. The E2 (high) mode of AlN is recommended for the residual stress analysis of AlN due to its high sensitivity and the largest signal-to-noise ratio among the studied modes. The E2 (high) Raman biaxial stress coefficient of −3.8 cm−1/GPa and strain-free phonon frequency of 656.68 cm−1 were then applied to perform both macroscopic and microscopic stress mappings. For macroscopic stress evaluation, the spatial variation of residual stress was measured across an AlN-on-Si wafer prepared by sputter deposition. A cross-wafer variation in residual stress of ∼150 MPa was observed regardless of the average stress state of the film. Microscopic stress evaluation was performed on AlN piezoelectric micromachined ultrasonic transducers (pMUTs) with submicrometer spatial resolution. These measurements were used to assess the effect of device fabrication on residual stress distribution in an individual pMUT and the effect of residual stress on the resonance frequency. At ∼20 μm directly outside the outer edge of the pMUT electrode, a large lateral spatial variation in residual stress of ∼100 MPa was measured, highlighting the impact of metallization structures on residual stress in the AlN film. [ABSTRACT FROM AUTHOR]

High p-conductivity (0.7 Ω−1 cm−1) was achieved in high-Al content AlGaN via Mg doping and compositional grading. A clear transition between the valence band and impurity band conduction mechanisms was observed. The transition temperature depended strongly on the compositional gradient and to some degree on the Mg doping level. A model is proposed to explain the role of the polarization field in enhancing the conductivity in Mg-doped graded AlGaN films and the transition between the two conduction types. This study offers a viable path to technologically useful p-conductivity in AlGaN. [ABSTRACT FROM AUTHOR]

The influence of the polarization field on the emission properties of the AlGaN-based quantum structures grown on AlN substrates was investigated as a function of well width, barrier width, and barrier height. A thin AlGaN well and a thin AlN barrier design reduced the polarization field to ∼0.5 MV/cm, resulting in an ultralow laser threshold of 3 kW/cm2 in an optically pumped configuration. These experimental results were used to validate the simulation. In the next step, a structure with Al0.7Ga0.3N barriers was designed to support carrier injection with a minimal loss in optical performance. This structure showed a threshold of 7 kW/cm2 under optical pumping and an estimated threshold current of 8 kA/cm2 for the electric injection. [ABSTRACT FROM AUTHOR]

Record-low p-type resistivities of 9.7 and 37 Ω cm were achieved in Al0.7Ga0.3N and Al0.8Ga0.2N films, respectively, grown on single-crystal AlN substrate by metalorganic chemical vapor deposition. A two-band conduction model was introduced to explain the anomalous thermal behavior of resistivity and the Hall coefficient. Relatively heavy Mg doping (5 × 1019 cm−3), in conjunction with compensation control, enabled the formation of an impurity band exhibiting a shallow activation energy of ∼30 meV for a wide temperature range. Valence band conduction associated with a large Mg ionization energy was dominant above 500 K. The apparently anomalous results deviating from the classical semiconductor physics were attributed to fundamentally different Hall scattering factors for impurity and valence band conduction. This work demonstrates the utility of impurity band conduction to achieve technologically relevant p-type conductivity in Al-rich AlGaN. [ABSTRACT FROM AUTHOR]

A two-band transport model is proposed to explain electrical conduction in graded aluminum gallium nitride layers, where the free hole conduction in the valence band is favored at high temperatures and hopping conduction in the impurity band dominates at low temperatures. The model simultaneously explains the significantly lowered activation energy for p-type conduction (∼10 meV), a nearly constant sheet conductivity at lower temperatures (200–330 K), and the anomalous reversal of the Hall coefficient caused by the negative sign of the Hall scattering factor in the hopping conduction process. A comparison between the uniform and graded samples suggests that compositional grading significantly enhances the probability of phonon-assisted hopping transitions between the Mg atoms. [ABSTRACT FROM AUTHOR]

Herein, Al‐rich AlGaN‐based avalanche photodiodes (APDs) grown on single crystal AlN substrates high ultraviolet‐C sensitivity for λ < 200 nm are fabricated, while exhibiting blindness to λ > 250 nm. A maximum quantum efficiency of 68% and peak gain of 320 000 are estimated resulting in a figure of merit of ≈220 000 in devices with ϕ = 100 μm. As expected, a decrease in gain with increase in device size is observed and a gain of ≈20 000 is estimated in devices with ϕ = 400 μm. Overall, two orders of magnitude higher performance are observed in APDs on single crystal AlN substrates compared to those on sapphire. [ABSTRACT FROM AUTHOR]

The interaction between the itinerant carriers, lattice dynamics, and defects is a problem of long-standing fundamental interest for developing quantum theory of transport. Here, we study this interaction in the compositionally and strain-graded AlGaN heterostructures grown on AlN substrates. The results provide direct evidence that a dimensional crossover (2D–3D) occurs with increasing temperature as the dephasing scattering events reduce the coherence length. These heterostructures show a robust polarization-induced 3D electron gas and a metallic-like behavior down to liquid helium temperature. Using magnetoresistance measurements, we analyze the evolution of the interaction between charge carriers, lattice dynamics, and defects as a function of temperature. A negative longitudinal magnetoresistance emerges at low temperatures, in line with the theory of weak localization. A weak localization fit to near zero-field magneto-conductance indicates a coherence length that is larger than the elastic mean free path and film thickness ( l φ > t > l e l ), suggesting a 2D weak localization in a three-dimensional electron gas. Our observations allow for a clear and detailed picture of two distinct localization mechanisms that affect carrier transport at low temperature. [ABSTRACT FROM AUTHOR]

We demonstrate large area (25 000 μm2) Al-rich AlGaN-based avalanche photodiodes (APDs) grown on single crystal AlN substrates operating with differential (the difference in photocurrent and dark current) signal gain of 100 000 at 90 pW (<1 μW cm−2) illumination with very low dark currents <0.1 pA at room temperature under ambient light. The high gain in large area AlGaN APDs is attributed to a high breakdown voltage at 340 V, corresponding to very high breakdown fields ∼9 MV cm−1 as a consequence of low threading and screw dislocation densities < 103 cm−2. The maximum charge collection efficiency of 30% was determined at 255 nm, corresponding to the bandgap of Al0.65Ga0.35N, with a response of 0.06 A/W. No response was detected for λ > 280 nm, establishing solar blindness of the device. [ABSTRACT FROM AUTHOR]

We investigated two types of threading dislocations in high Al-composition Al0.55Ga0.45N/AlN multiple quantum well (MQW) structures grown on AlN substrate for electrically injected deep ultraviolet light-emitting diodes (LEDs). The surface morphology and defects electrical characteristics of the MQW LED structures were examined via conductive atomic force microscopy (CAFM). We found that the disparity between photoluminescence (PL) and electroluminescence (EL) spectra in terms of light emission output and wavelength shift are attributed to the existence of the surface hillocks, especially to the ones that have open-core dislocations. The open-core dislocations form current leakage paths through their defect states and the composition inhomogeneity (i.e., Ga rich) at the dislocation sites are responsible for the light emission at longer wavelengths. [ABSTRACT FROM AUTHOR]

The ineffective p-type doping of nitrides using magnesium (Mg), the best available dopant, has limited the development and performance of all III-nitride-based devices, including bipolar junction transistors and light emitting diodes (LEDs). For nitride-based ultraviolet (UV) LEDs, as the Al composition increases for achieving shorter wavelengths (e.g. <280 nm) into the UVC spectral range, the p-type doping issue, which causes very inefficient hole injection, becomes more severe than ever. In this work, we report the detailed study of using p-type Si as a hole supplier for high-Al composition UVC LEDs. We first describe the method of Si/GaN junction formation, where the lattice-mismatch challenge between Si and GaN is overcome by using a 0.5 nm thick Al2O3 layer at the interface. This serves as a physical separation layer between the two materials as well as a passivation, tunneling, and thermal buffer layer. High-resolution transmission electron microscope image illustrates the high-quality interface between Si and GaN. We further detail the hole transport mechanism of the p–p Si/GaN isotype junction through both simulations and experiments. The enhanced hole concentration in the AlGaN/AlN multiple quantum wells (MQWs) due to the use of p-type Si as the hole supplier is verified through comparison with conventional UVC LEDs. Finally, high-performance UVC LEDs made with AlN/AlGaN (Al: 72%) MQWs employing p-type Si as their hole suppliers are demonstrated experimentally to serve as an example of the novel hole injector strategy. [ABSTRACT FROM AUTHOR]

Deep ultraviolet (UV) light-emitting diodes (LEDs) at a wavelength of 226 nm based on AlGaN/AlN multiple quantum wells using p-type Si as both the hole supplier and the reflective layer are demonstrated. In addition to the description of the hole transport mechanism that allows hole injection from p-type Si into the wide bandgap device, the details of the LED structure which take advantage of the p-type Si layer as a reflective layer to enhance light extraction efficiency (LEE) are elaborated. Fabricated LEDs were characterized both electrically and optically. Owing to the efficient hole injection and enhanced LEE using the p-type Si nanomembranes (NMs), an optical output power of 225 μW was observed at 20 mA continuous current operation (equivalent current density of 15 A/cm2) without external thermal management. The corresponding external quantum efficiency is 0.2%, higher than any UV LEDs with emission wavelength below 230 nm in the continuous current drive mode. The study demonstrates that adopting p-type Si NMs as both the hole injector and the reflective mirror can enable high-performance UV LEDs with emission wavelengths, output power levels, and efficiencies that were previously inaccessible using conventional p-i-n structures. [ABSTRACT FROM AUTHOR]

Co-doping AlN crystals with Si is found to suppress the unwanted 4.7 eV (265 nm) deep ultraviolet absorption associated with isolated carbon acceptors common in materials grown by physical vapor transport. Density functional theory calculations with hybrid functionals demonstrate that silicon forms a stable nearest-neighbor defect complex with carbon. This complex is predicted to absorb at 5.5 eV and emit at or above 4.3 eV. Absorption and photoluminescence measurements of co-doped samples confirm the presence of the predicted CN-SiAl complex absorption and emission peaks and significant reduction of the 4.7 eV absorption. Other sources of deep ultraviolet absorption in AlN are also discussed. [ABSTRACT FROM AUTHOR]

To unambiguously distinguish lasing from super luminescence, key elements of lasing such as longitudinal cavity modes with narrow line-width, polarized emission, and elliptically shaped far-field pattern, need to be demonstrated at the same time. Here, we show transverse electric polarized lasing at 280.8 nm and 263.9 nm for AlGaN based multi-quantum-wells and double heterojunction structures fabricated on single crystalline AlN substrates. An elliptically shaped far-field pattern was recorded when pumped above threshold. With cavities shorter than 200 μm, well-defined, equally spaced longitudinal modes with line widths as narrow as 0.014 nm were observed. The low threshold pumping density of 84 kW/cm2 suggests that the electrically pumped sub-300 nm ultraviolet laser diodes are imminent. [ABSTRACT FROM AUTHOR]

Single crystal AlN provides a native substrate for Al-rich AlGaN that is needed for the development of efficient deep ultraviolet light emitting and laser diodes. An absorption band centered around 4.7 eV (∼265 nm) with an absorption coefficient above 1000 cm-1 is observed in these substrates. Based on density functional theory calculations, substitutional carbon on the nitrogen site introduces absorption at this energy. A series of single crystalline wafers were used to demonstrate that this absorption band linearly increased with carbon, strongly supporting the model that CN- is the predominant state for carbon in AlN. [ABSTRACT FROM AUTHOR]

The authors present optical and electrical data for long wavelength (573–601 nm) InGaN/GaN multiple quantum well light emitting diodes (LEDs) grown by metal organic chemical vapor deposition. These results are achieved by optimizing the active layer growth temperature and the quantum well width. Also, the p-GaN is grown at low temperature to avoid the disintegration of the InGaN quantum wells with high InN content. A redshift is observed for both the green and yellow LEDs upon decreasing the injection current at low current regime. In the case of the yellow LED, this shift is enough to push emission into the amber (601 nm). [ABSTRACT FROM AUTHOR]

AlGaN based 229 nm light emitting diodes (LEDs), employing p-type Si to significantly increase hole injection, were fabricated on single crystal bulk aluminum nitride (AlN) substrates. Nitride heterostructures were epitaxially deposited by organometallic vapor phase epitaxy and inherit the low dislocation density of the native substrate. Following epitaxy, a p-Si layer is bonded to the heterostructure. LEDs were characterized both electrically and optically. Owing to the low defect density films, large concentration of holes from p-Si, and efficient hole injection, no efficiency droop was observed up to a current density of 76 A/cm2 under continuous wave operation and without external thermal management. An optical output power of 160 μW was obtained with the corresponding external quantum efficiency of 0.03%. This study demonstrates that by adopting p-type Si nanomembrane contacts as a hole injector, practical levels of hole injection can be realized in UV light-emitting diodes with very high Al composition AlGaN quantum wells, enabling emission wavelengths and power levels that were previously inaccessible using traditional p-i-n structures with poor hole injection efficiency. [ABSTRACT FROM AUTHOR]

A prominent 2.8 eV emission peak is identified in bulk AlN substrates grown by physical vapor transport. This peak is shown to be related to the carbon concentration in the samples. Density functional theory calculations predict that this emission is caused by a donor-acceptor pair (DAP) recombination between substitutional carbon on the nitrogen site and a nitrogen vacancy. Photoluminescence and photoluminescence-excitation spectroscopy are used to confirm the model and indicate the DAP character of the emission. The interaction between defects provides a pathway to creating ultraviolet-transparent AlN substrates for optoelectronics applications. [ABSTRACT FROM AUTHOR]

The reliability and output power of AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs) fabricated on AlN substrates prepared by hydride vapor phase epitaxy are reported. TEM analysis revealed that dislocation density in LED layers, except the p-GaN layer, was below 106 cm-2. DUV-LEDs emitting at 261 nm exhibited an output power of 10.8 mW at 150 mA. The lifetime of these LEDs was estimated to be over 10,000 h for cw operation at 50 mA. No significant acceleration of output power decay at higher operation currents was observed. The estimated lifetime at the operation current of 150 mA was over 5,000 h. [ABSTRACT FROM AUTHOR]

AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs) were fabricated on AlN substrates. The AlN substrates were prepared by growing thick hydride vapor phase epitaxy (HVPE)-AlN layers on bulk AlN substrates prepared by physical vapor transport (PVT). After growing an LED structure, the PVT-AlN substrates were removed by mechanical polishing. This process allowed the fabrication of DUV-LEDs on HVPE-AlN substrates with high crystalline quality and DUV optical transparency. The DUV-LEDs exhibited a single emission peaking at 268 nm through the HVPE-AlN substrates. The output power as high as 28 mW was obtained at an injection current of 250 mA. [ABSTRACT FROM AUTHOR]

The structural and optical quality of a freestanding AlN substrate prepared from a thick AlN layer grown by hydride vapor phase epitaxy (HVPE) on a bulk (0001)AlN substrate prepared by physical vapor transport (PVT) were investigated. The prepared HVPE-AlN substrate was crack- and stress-free. High-resolution X-ray diffraction ω-rocking curves of symmetric (0002) and skew-symmetric (1011) reflections had small full widths at half maximum (FWHMs) of 31 and 32 arcsec, respectively. Deep-ultraviolet optical transparency of the HVPE-AlN substrate was higher than that of the PVT-AlN substrate, which was related to lower concentrations of C, O impurities, and Al vacancy. [ABSTRACT FROM AUTHOR]

Understanding the band bending at the interface of GaN/dielectric under different surface treatment conditions is critically important for device design, device performance, and device reliability. The effects of ultraviolet/ozone (UV/O 3 ) treatment of the GaN surface on the energy band bending of atomic-layer-deposition (ALD) Al 2 O 3 coated Ga-polar GaN were studied. The UV/O 3 treatment and post-ALD anneal can be used to effectively vary the band bending, the valence band offset, conduction band offset, and the interface dipole at the Al 2 O 3 /GaN interfaces. The UV/O 3 treatment increases the surface energy of the Ga-polar GaN, improves the uniformity of Al 2 O 3 deposition, and changes the amount of trapped charges in the ALD layer. The positively charged surface states formed by the UV/O 3 treatment-induced surface factors externally screen the effect of polarization charges in the GaN, in effect, determining the eventual energy band bending at the Al 2 O 3 /GaN interfaces. An optimal UV/O 3 treatment condition also exists for realizing the "best" interface conditions. The study of UV/O 3 treatment effect on the band alignments at the dielectric/III-nitride interfaces will be valuable for applications of transistors, light-emitting diodes, and photovoltaics.