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Reliable p-doped hexagonal boron nitride (h-BN) could enable wide bandgap optoelectronic devices such as deep ultra-violet light emitting diodes (UV LEDs), solar blind photodiodes and neutron detectors. We report the study of Mg in h-BN layers as well as Mg h-BN/AlGaN heterostructures. Mg incorporation in h-BN was studied under different biscyclopentadienyl-magnesium (Cp2Mg) molar flow rates. 2θ-ω x-ray diffraction scans clearly evidence a single peak, corresponding to the (002) reflection plane of h-BN with a full-width half maximum increasing with Mg incorporation in h-BN. For a large range of Cp2Mg molar flow rates, the surface of Mg doped h-BN layers exhibited characteristic pleats, confirming that Mg doped h-BN remains layered. Secondary ion mass spectrometry analysis showed Mg incorporation, up to 4 × 1018 /cm3 in h-BN. Electrical conductivity of Mg h-BN increased with increased Mg-doping. Heterostructures of Mg h-BN grown on n-type Al rich AlGaN (58% Al content) were made with the intent of forming a p-n heterojunction. The I-V characteristics revealed rectifying behavior for temperatures from 123 to 423 K. Under ultraviolet illumination, photocurrent was generated, as is typical for p-n diodes. C-V measurements evidence a built-in potential of 3.89 V. These encouraging results can indicate p-type behavior, opening a pathway for a new class of wide bandgap p-type layers. [ABSTRACT FROM AUTHOR]

Hexagonal boron nitride (h‐BN) is a promising 2D template that decouples substrate effects from the layer above it by van der Waals epitaxy, because there are only weak forces out of the h‐BN. It also permits convenient mechanical transfer of devices grown on their surface to an appropriate substrate. Here, van der Waals epitaxial growth resulting in the formation of self‐organized GaN nanorods on h‐BN templates is demonstrated. This approach to the growth of III‐N nanostructures avoids transfer processes and scaling issues seen with other 2D materials, since both the 1D (GaN nanorods) and 2D (h‐BN) are grown at the wafer‐scale and in one growth run. Further, this process is used to grow vertical core–shell p‐GaN/InGaN/n‐GaN nano‐PIN device structures on wafer‐scale 2D h‐BN on sapphire and silicon substrates. The high quality of the core–shell nanostructures is confirmed by detailed electron microscopy study, which gives more insight into the nanorod formation mechanism on 2D material. Mechanical transfer of nanostructures on sapphire substrates to copper tape is then demonstrated, with no resulting damage of nanorods. Use of MOVPE grown large‐area h‐BN to realize nanostructures is a significant advancement and can lead to new nanodevice architectures needed for next‐generation optoelectronic devices. [ABSTRACT FROM AUTHOR]