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2. Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding.

3. Chemical bonding dictates drastic critical temperature difference in two seemingly identical superconductors.

4. Effect of bonding techniques on thermal insulation and biodegradation of banana fiber/recycled polyester nonwovens.

5. Geometries, Electronic Structures, Bonding Properties, and Stability Strategy of Endohedral Metallofullerenes TM@C 28 (TM = Sc − , Y − , La − , Ti, Zr, Hf, V + , Nb + , Ta +).