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Continuous development of high-performance microelectronic chips requires efficient cooling systems to dissipate large amount of heat produced over a small footprint. Pool boiling is capable of dissipating large heat fluxes while maintaining low wall superheat and is receiving renewed interest. Porous surfaces have been investigated extensively for pool boiling enhancement. This paper presents a review of different manufacturing techniques employed to manufacture porous surfaces in pool boiling application. Different types of surfaces developed using these techniques are reviewed and their pool boiling performance is discussed. [ABSTRACT FROM PUBLISHER]