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In this study, the coupled solid piezoelectric and shell inverse-piezoelectric analysis method for a thin piezoelectric bimorph with metal layers is proposed. The piezoelectric bimorph is usually thin and includes the metal layers such as the electrode and the shim plate. In the proposed method, the solid and shell elements are used for the piezoelectric and inverse-piezoelectric analyses, respectively, since the solid elements can describe the various types of the distributions of the electric potential along the thickness, and the shell elements are suitable for analyzing the thin structure. The block Gauss-Seidel method is used to couple the solid piezoelectric and shell inverse-piezoelectric analyses. In the iterative passing of the solution variables, the transformation method is used between the solid and shell elements. The rules of mixture for the bending rigidity and the mass are used for modeling the single shell structure in the inverse-piezoelectric analysis. A pseudo-piezoelectric modeling for the conductor is proposed to consider the metal layers in the piezoelectric analysis. This modeling allows us to reuse existing programs of the piezoelectric analysis without any modification.

ESL TFT backplane with solution type metal oxide semiconductor was completely processed on mass-production ready equipment. High mobility TFTs with excellent uniformity were obtained over the complete Gen1 glass substrate (320 mm × 352 mm), with good TFT bias stress reliability. An 85 ppi QVGA AMOLED display is demonstrated.

Electric and Fluid-Structure interaction (EFSI) is a complex coupled multi-physics phenomenon appears in microelectromechanical system (MEMS) when these microdevices are operated in a fluid media. In this study, the EFSI phenomena refer to a combination of electromechanical (electric-structure interaction) coupling and fluid-structure interaction coupling. Both the electromechanical coupling and the fluid-structure interaction can be simulated in a monolithic way or in a partitioned iteration way. In the proposed method the electromechanical coupling is simulated in a partitioned iterative way with separate solvers for the electrical and mechanical equations using block Gauss-Seidel (BGS) iteration method, while the fluidstructure interaction is simulated in a monolithic way by solving the fluid and structure equations simultaneously using a projection method. The proposed algorithm combines these two methods to analyze the strongly coupled EFSI in MEMS. The proposed method is applied to a flexible flap made of piezoelectric bimorph actuator in a converging channel. The EFSI analysis results show a good agreement with FSI results when a very low input bias voltage is applied to the actuator., ECCM-ECFD 2018 ,6th European Conference on Computational Mechanics (Solids, Structures and Coupled Problems: ECCM 6), 7th European Conference on Computational Fluid Dynamics (ECFD 7), 11-15 June 2018, Glasgow, UK