1. Effect of Deformation Induced Microstructure Faults on the Elastic Mechanical Parameters of Micro-Scale Copper
- Author
-
Wenzhu Liu, Jia Haiyou, Jiasheng Dong, Wang Sufang, Y.H. Feng, H.C. Wang, Yong Huan, and Chen Bo
- Subjects
Materials science ,Scale (ratio) ,Mechanical Engineering ,020208 electrical & electronic engineering ,Modulus ,chemistry.chemical_element ,Young's modulus ,02 engineering and technology ,Microstructure ,01 natural sciences ,Copper ,Computer Science::Other ,010309 optics ,Condensed Matter::Materials Science ,symbols.namesake ,chemistry ,Mechanics of Materials ,Indentation ,0103 physical sciences ,0202 electrical engineering, electronic engineering, information engineering ,symbols ,Composite material ,Deformation (engineering) ,Elastic modulus - Abstract
The elastic mechanical parameters of initial and pre-twisted copper wires were investigated with the aid of a self-developed micro-torsion tester. It was found that the apparent elastic shear modulus and the apparent Young tensile modulus of the copper wires decrease by 13.3 and 8.4% after pre-twist deformation, respectively. In addition, the indentation modulus also decreases as the deformation is increased. When the deformation is more than 30%, the indentation modulus of pre-twisted copper wires is smaller than that of initial copper wires. Microstructural analyses show that the elastic modulus decreases with the proportion of faults.
- Published
- 2018