1. A Study on Subarray Microwave Boards Interconnected by BGA
- Author
-
Ling Tianqing, Cui Wenyao, and Zheng Yu
- Subjects
Interconnection ,Computer science ,Manufacturing process ,business.industry ,Ball grid array ,Hardware_INTEGRATEDCIRCUITS ,Electrical engineering ,Microwave technology ,Layer (object-oriented design) ,business ,Manufacturing cost ,Microwave - Abstract
The connection between different layers is usually realized through vertical metallized holes. When the number of PCB layers increases, the interconnection between different layers are complex. Any layer interconnection processing technology is required. The processing technology is complex and has high cost. This paper presents a new method to achieve arbitrary layer interconnection. The transition of quasi-coaxial between two composite boards is realized by BGA. This method simplifies the interconnection between microwave boards of any layer. The test of sub-array microwave boards connected by BGA proves that the interconnection meets the engineering requirements. simplifies the manufacturing process and reduces the manufacturing cost.
- Published
- 2020