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This paper presents the characteristics of signal transmission between a printed circuit board and an integrated circuit, which were obtained using a flip-chip bump process. To minimize signal loss occurring in an interconnection, a Sn-Au alloy soft bump having a diameter of 65 μm was used as the solder bump in the flip-chip process. The measurement result showed a return loss of less than 15 dB from DC to 43.5 GHz, and an insertion loss of 3.82 dB at 28 GHz. The measurements confirmed that it was very small within the measurement error range generated in the measurement environment of the insertion loss generated by the interconnection. This confirms good signal transfer performance across the DC to 43.5 GHz frequency band. Additionally, the study confirmed through meas- urement that all mm-Wave circuits developed in the Ka-band frequency range can be measured easily and accurately using a bound connector without a probe station requiring sophisticated control. [ABSTRACT FROM AUTHOR]