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Through macro inspection, chemical composition analysis, hardness test, tensile performance test, microstructure inspection and scanning electron microscope analysis, the causes of clamp crack on TA equipment in the 500kV AC filter field of the ± 800kV converter station were analyzed. The results show that improper selection of the manufacturing process of the equipment clamps will cause more micro-defects inside it, leading to poor mechanical properties and excessive internal stress, which are the main causes of cracking. Corresponding measures are put forward to improve the manufacturing quality of equipment clamps, which can avoid similar failures from happening again.

Recently, aptamer-based surface plasmon resonance (SPR) sensors have become increasingly popular due to their high specificity, high sensitivity, real-time detection capabilities, and label-free features. The core component of an aptamer-based SPR sensor is a chip. This paper presents the modification steps and the characterization results of a sensor chip for the construction of a 2, 4, 6-trinitrotoluene-targeted, aptamer-based, SPR sensor. After cleaning the aptamer-based SPR sensor chip, polyethylene glycol (PEG) with functional thiol groups at one end was added to the chip surface by Au-S covalent bonds to form a self-assembled film. Then, the carboxyl groups at the other end of PEG and the carboxyl groups of trinitrophenyl-glycine (TNP-Gly) were activated and connected via ethylenediamine (EDA). This effectively completed the chip’s modification. During the modification process, relevant experimental conditions were optimized. The chip’s surface elements, as well as their chemical states, were characterized by X-ray photoelectron spectroscopy (XPS). The results, outlined in the following study, demonstrate that this modification of an aptamer-based SPR sensor chip adhered to normative expectations. Thus, the modification process proposed here establishes an important foundation for subsequent study of TNT detection.

By sensing the output powers of two channels with MEMS microwave power sensors, a wideband 8-12GHz dual channel microwave phase detector is presented. In order to detect phase difference between reference signal and testing signal in entire 0-360° at X-band, artificial 45° phase lead and 45° phase lag are introduced in two channels, additionally. The proposed phase detector is composed of power dividers, power combiners, 45° (at 10GHz) coplanar waveguide (CPW) transmission delay lines, MEMS capacitive power sensors and thermoelectric power sensors. The two CPW transmission lines result in 45° phase lead and 45° phase lag at 10GHz, and the two different kinds of power sensors are used to detect the combined powers. The fabrication of the phase detector is compatible with GaAs Microwave Monolithic Integrated Circuit (MMIC) technology. The phase detection measurement is accomplished at 10GHz with 0-180° phase shift between testing signals generated by a tunable analog phase shifter. Phase detection results in two channels show that the normalization of the measured results fit the calculated results well, though the results of phase lead have a little of deviation.

Experimental approaches used for architecture exploration and validation are often based on configurable logic device such as FPGA. NoC architectures require multi-FPGA platforms as the resources of a single FPGA are not big enough. Partitionning a NoC on multi-FPGA requires special techniques for allocating communication channels, physical links and suitable resource allocation scheme. We present a scalable emulation platform and its associated design flow based on a multi FPGA approach that allows quick exploration, evaluation and comparison of NoC solutions. The efficiency of our approach is illustrated through the deployment of the Hermes NoC and its exploration on several FPGA platforms.