Search

In this paper, hexamethyltetramine is introduced into the electroplating bath to improve the surface morphology of electrodeposited copper. The cyclic voltammetry (CV) and dynamic polarization curves are used to study the effect of Cu(Ⅰ) and hexamethyltetramine on the electrochemical behaviors of electroplating solution. After implementing the electrodeposited copper experiment, scanning electron microscope (SEM) and X-ray diffraction (XRD) are used to explore the influence of Cu(Ⅰ) and hexamethyltetramine on the Surface morphology and crystal plane orientation of the electrodeposited copper. The results show that 5ppm hexamethyltetramine and 7.5ppm hexamethyltetramine can solve the problem of the loose and uneven surface of the electroplated copper layer caused by Cu(Ⅰ).