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Optimizing thermal anneals of Si-implanted β-Ga2O3 is critical for low resistance contacts and selective area doping. We report the impact of annealing ambient, temperature, and time on the activation of room temperature ion-implanted Si in β-Ga2O3 at concentrations from 5 × 1018 to 1 × 1020 cm−3, demonstrating full activation (>80% activation, mobilities >70 cm2/V s) with contact resistances below 0.29 Ω mm. Homoepitaxial β-Ga2O3 films, grown by plasma-assisted molecular beam epitaxy on Fe-doped (010) substrates, were implanted at multiple energies to yield 100 nm box profiles of 5 × 1018, 5 × 1019, and 1 × 1020 cm−3. Anneals were performed in an ultra-high vacuum-compatible quartz furnace at 1 bar with well-controlled gas compositions. To maintain β-Ga2O3 stability, pO2 must be greater than 10−9 bar. Anneals up to pO2 = 1 bar achieve full activation at 5 × 1018 cm−3, while 5 × 1019 cm−3 must be annealed with pO2 ≤ 10−4 bar, and 1 × 1020 cm−3 requires pO2 < 10−6 bar. Water vapor prevents activation and must be maintained below 10−8 bar. Activation is achieved for anneal temperatures as low as 850 °C with mobility increasing with anneal temperatures up to 1050 °C, though Si diffusion has been reported above 950 °C. At 950 °C, activation is maximized between 5 and 20 min with longer times resulting in decreased carrier activation (over-annealing). This over-annealing is significant for concentrations above 5 × 1019 cm−3 and occurs rapidly at 1 × 1020 cm−3. Rutherford backscattering spectrometry (channeling) suggests that damage recovery is seeded from remnant aligned β-Ga2O3 that remains after implantation; this conclusion is also supported by scanning transmission electron microscopy showing retention of the β-phase with inclusions that resemble the γ-phase. [ABSTRACT FROM AUTHOR]

We report the growth of AlBN/β‐Nb2N nitride epitaxial heterostructures in which the AlBN is ferroelectric, and β‐Nb2N with metallic resistivity ≈40 μΩ cm$$ \text{&amp;amp;mu;&amp;amp;Omega;\hspace{0.17em}cm}$$ at 300 K becomes superconducting below TC ≈ 0.5 K. Using nitrogen plasma molecular beam epitaxy, we grow hexagonal β‐Nb2N films on c‐plane Al2O3 substrates, followed by wurtzite AlBN. The AlBN is in epitaxial registry and rotationally aligned with the β‐Nb2N, and the hexagonal lattices of both nitride layers make angles of 30° with the hexagonal lattice of the Al2O3 substrate. The B composition of the AlBN layer is varied from 0 to 14.7%. It is found to depend weakly on the B flux, but increases strongly with decreasing growth temperature, indicating a reaction rate‐controlled growth. The increase in B content causes a non‐monotonic change in the a‐lattice constant and a monotonic decrease in the c‐lattice constant of AlBN. Sharp, abrupt epitaxial AlBN/β‐Nb2N/Al2O3 heterojunction interfaces and close symmetry matching are observed by transmission electron microscopy. The observation of ferroelectricity and superconductivity in epitaxial nitride heterostructures opens avenues for novel electronic and quantum devices. [ABSTRACT FROM AUTHOR]

We report the properties of molecular beam epitaxy deposited AlBN thin films on a recently developed epitaxial nitride metal electrode, Nb2N. While a control AlN thin film exhibits standard capacitive behavior, distinct ferroelectric switching is observed in the AlBN films with increasing Boron mole fraction. The measured remnant polarization P r ∼ 15 μC/cm2 and coercive field E c ∼ 1.45 MV/cm in these films are smaller than those recently reported on films deposited by sputtering, due to incomplete wake-up, limited by current leakage. Because AlBN preserves the ultrawide energy bandgap of AlN compared to other nitride hi-K dielectrics and ferroelectrics, and it can be epitaxially integrated with GaN and AlN semiconductors, its development will enable several opportunities for unique electronic, photonic, and memory devices. [ABSTRACT FROM AUTHOR]

This document is a collection of research papers on wide- and ultrawide-bandgap electronic semiconductor devices. It focuses on the progress and challenges in developing devices made from wide-bandgap materials like GaN, AlGaN, AlN, Ga2O3, BN, and diamond for power, rf, and photonic applications. The papers cover topics such as improving GaN power devices, exploring new wide bandgap materials, and investigating gate insulator properties. Additionally, there are papers on defect detection, new concepts for wide bandgap devices, and the growth and properties of different materials. The research provides valuable insights for researchers interested in using these materials in electronic devices. [Extracted from the article]

While the properties of β-Ga2O3 continue to be extensively studied for high-power applications, the effects of strong electric fields on the Ga2O3 microstructure and, in particular, the impact of electrically active native point defects have been relatively unexplored. We used cathodoluminescence point spectra and hyperspectral imaging to explore possible nanoscale movements of electrically charged defects in Ga2O3 vertical trench power diodes and observed the spatial rearrangement of optically active defects under strong reverse bias. These observations suggest an unequal migration of donor-related defects in β-Ga2O3 due to the applied electric field. The atomic rearrangement and possible local doping changes under extreme electric fields in β-Ga2O3 demonstrate the potential impact of nanoscale device geometry in other high-power semiconductor devices. [ABSTRACT FROM AUTHOR]

Using epitaxial aluminum nitride (AlN) developed for ultraviolet photonics and high-speed electronics, we demonstrate suspended AlN thin-film bulk acoustic resonators (FBARs) at 9.2 GHz in the X-band (8–12 GHz) of the microwave spectrum. The resonators show a Q m a x ≈ 614 and a figure of merit f ⋅ Q ≈ 5.6 THz. The material stack of these epi-AlN FBARs allows monolithic integration with AlN/GaN/AlN quantum well high-electron-mobility-transistors to a unique RF front end and also enable integration with epitaxial nitride superconductors for microwave filters for quantum computing. [ABSTRACT FROM AUTHOR]

Low resistance non-alloyed ohmic contacts are realized by a metal-first process on homoepitaxial, heavily n+ doped (010) β-Ga2O3. The resulting contacts have a contact resistance (Rc) as low as 0.23 Ω-mm on an as-grown sample and exhibit nearly linear ohmic behavior even without a post-metallization anneal. The metal-first process was applied to form non-alloyed contacts on n+ (010) β-Ga2O3 grown by metal-organic chemical vapor deposition (MOCVD) as well as suboxide molecular beam epitaxy. Identical contacts fabricated on similar MOCVD samples by conventional liftoff processing exhibit highly rectifying Schottky behavior. Re-processing using the metal-first process after removal of the poor contacts by conventional methods does not improve the contacts; however, addition of a Ga-flux polishing step followed by re-processing using a metal-first process again results in low resistance, nearly linear ohmic contacts. The liftoff process, therefore, does not reliably render nearly linear ohmic behavior in non-alloyed contacts. Furthermore, no interface contamination was detected by x-ray photoelectron spectroscopy. This suggests that during the initial liftoff processing, a detrimental layer may form at the interface, likely modification of the Ga2O3 surface, that is not removable during the contact removal process but that can be removed by Ga-flux polishing. [ABSTRACT FROM AUTHOR]

Aluminum scandium nitride (AlScN) has been receiving increasing interest for radio frequency microelectromechanical systems because of their higher achievable bandwidths owing to the larger piezoelectric response of AlScN compared to AlN. However, alloying scandium (Sc) with aluminum nitride (AlN) significantly lowers the thermal conductivity of AlScN due to phonon alloy scattering. Self-heating in AlScN devices potentially limits power handling, constrains the maximum transmission rate, and ultimately leads to thermal failure. We grew plasma-assisted molecular beam epitaxy (PAMBE) AlScN on AlN-Al2O3 and GaN-Al2O3 substrates, and compared the cross-plane thermal conductivity to current work on AlScN grown on Si substrates. AlScN grown on AlN-Al2O3 and GaN-Al2O3 substrates achieve a better lattice match and a comparable thermal conductivity to AlScN grown on Si substrates, but with significantly thinner films. [ABSTRACT FROM AUTHOR]

High-conductivity undoped GaN/AlN 2D hole gases (2DHGs), the p-type dual of the AlGaN/GaN 2D electron gases (2DEGs), have offered valuable insights into hole transport in GaN and enabled the first GaN GHz RF p-channel FETs. They are an important step toward high-speed and high-power complementary electronics with wide-bandgap semiconductors. These technologically and scientifically relevant 2D hole gases are perceived to be not as robust as the 2DEGs because structurally similar heterostructures exhibit wide variations of the hole density over Δ p s > --> 7 × 10 13 cm − 2 , and low mobilities. In this work, we uncover that the variations are tied to undesired dopant impurities such as silicon and oxygen floating up from the nucleation interface. By introducing impurity blocking layers (IBLs) in the AlN buffer layer, we eliminate the variability in 2D hole gas densities and transport properties, resulting in a much tighter control over the 2DHG density variations to Δ p s ≤ 1 × 10 13 cm − 2 across growths, and a 3 × boost in the Hall mobilities. These changes result in a 2–3 × increase in hole conductivity when compared to GaN/AlN structures without IBLs. [ABSTRACT FROM AUTHOR]

The heteroepitaxial growth and phase formation of Ga2O3 on Al-polar AlN(0001) templates by molecular-beam epitaxy (MBE) are studied. Three different MBE approaches are employed: (i) conventional MBE, (ii) suboxide MBE (S-MBE), and (iii) metal-oxide-catalyzed epitaxy (MOCATAXY). We grow phase-pure β-Ga2O3(201) and phase-pure ∈/κ-Ga2O3(001) with smooth surfaces by S-MBE and MOCATAXY. Thin film analysis shows that the crystallographic and surface features of the β-Ga2O3(201)/AlN(0001) and ∈/κ-Ga2O3(001)/AlN(0001) epi-layers are of high crystalline quality. Growth and phase diagrams are developed to synthesize Ga2O3 on AlN by MBE and MOCATAXY and to provide guidance to grow Ga2O3 on several non-oxide surfaces, e.g., AlN, GaN, and SiC, by MBE, S-MBE, and MOCATAXY. [ABSTRACT FROM AUTHOR]

Aluminum nitride (AlN) offers novel potential for electronic integration and performance benefits for high‐power, millimeter‐wave amplification. Herein, load‐pull power performance at 30 and 94 GHz for AlN/GaN/AlN high‐electron‐mobility transistors (HEMTs) on silicon carbide (SiC) is reported. When tuned for peak power‐added efficiency (PAE), the reported AlN/GaN/AlN HEMT shows PAE of 25% and 15%, with associated output power (Pout) of 2.5 and 1.7 W mm−1, at 30 and 94 GHz, respectively. At 94 GHz, the maximum Pout generated is 2.2 W mm−1, with associated PAE of 13%. [ABSTRACT FROM AUTHOR]

We present a compositional dependence study of electrical characteristics of AlxGa1−xN quantum well channel-based AlN/AlGaN/AlN high electron mobility transistors (HEMTs) with x = 0.25 , 0.44 , and 0.58. This ultra-wide bandgap heterostructure is a candidate for next-generation radio frequency and power electronics. The use of selectively regrown n-type GaN Ohmic contacts results in contact resistance that increases as the Al content of the channel increases. The DC HEMT device characteristics reveal that the maximum drain current densities progressively reduce from 280 to 30 to 1.7 mA/mm for x = 0.25 , 0.44 , and 0.58, respectively. This is accompanied by a simultaneous decrease (in magnitude) in threshold voltage from −5.2 to −4.9 to −2.4 V for the three HEMTs. This systematic experimental study of the effects of Al composition x on the transistor characteristics provides valuable insights for engineering AlGaN channel HEMTs on AlN for extreme electronics at high voltages and high temperatures. [ABSTRACT FROM AUTHOR]

Polarization-induced carriers play an important role in achieving high electrical conductivity in ultrawide bandgap semiconductor AlGaN, which is essential for various applications ranging from radio frequency and power electronics to deep UV photonics. Despite significant scientific and technological interest, studies on polarization-induced carriers in N-polar AlGaN are rare. We report the observation and properties of polarization-induced two-dimensional electron gases (2DEGs) in N-polar AlGaN/AlN heterostructures on single-crystal AlN substrates by systematically varying the Al content in the 8 nm top layers from x = 0 to x = 0.6, spanning energy bandgaps from 3.56 to 4.77 eV. The 2DEG density drops monotonically with increasing Al content, from 3.8 × 1013/cm2 in the GaN channel, down to no measurable conductivity for x = 0.6. Alloy scattering limits the 2DEG mobility to below 50 cm2/V s for x = 0.49. These results provide valuable insights for designing N-polar AlGaN channel high electron mobility transistors on AlN for extreme electronics at high voltages and high temperatures, and for UV photonic devices. [ABSTRACT FROM AUTHOR]

Aluminum nitride (AlN) plays a key role in modern power electronics and deep-ultraviolet photonics, where an understanding of its thermal properties is essential. Here, we measure the thermal conductivity of crystalline AlN by the 3ω method, finding that it ranges from 674 ± 56 Wm−1 K−1 at 100 K to 186 ± 7Wm−1 K−1 at 400 K, with a value of 237 ± 6 Wm−1 K−1 at room temperature. We compare these data with analytical models and first-principles calculations, taking into account atomic-scale defects (O, Si, C impurities, and Al vacancies). We find that Al vacancies play the greatest role in reducing thermal conductivity because of the largest mass-difference scattering. Modeling also reveals that 10% of heat conduction is contributed by phonons with long mean free paths (MFPs), over ∼7 μm at room temperature, and 50% by phonons with MFPs over ∼0.3 μm. Consequently, the effective thermal conductivity of AlN is strongly reduced in submicrometer thin films or devices due to phonon-boundary scattering. [ABSTRACT FROM AUTHOR]

Bismuth-containing compounds inherit the high spin-orbit coupling and bandgap bowing effects of the Bi atom. Here, we report the growth of InBi films using molecular beam epitaxy. By growing in a Bi-rich regime, we obtain coalesced and crystalline films with a sharp interface to the high-resistivity Si(111) substrate. Temperature-dependent transport and resistivity measurements exhibit a nonlinear Hall effect and parabolic magnetoresistance, suggesting two-carrier semimetallic behavior. In In-rich films, metallic temperature-dependent resistivity is observed. In Bi-rich films, we observed semiconductorlike temperature-dependent resistivity as well as superconductivity. [ABSTRACT FROM AUTHOR]

The frozen internal polarization-induced electric fields due to broken inversion symmetry in all conventional blue and green nitride semiconductor light-emitting semiconductor quantum well heterostructures point in a direction opposite to what is desired for efficient flow of electrons and holes. This state of affairs has persisted because of the desire to have p-type hole injectors on top of the quantum well active region. Because of the internal polarization fields in nitride heterostructures, there exist four permutations of doping and polarization for the realization of such light emitters. Which permutation is the most desirable for efficient light emission? In this work, we answer this question by demonstrating a fundamentally new approach toward efficient light emission with "bottom-tunnel junctions." The bottom-tunnel junction design aligns the polarization fields in the desired direction in the quantum well while simultaneously eliminating the need for p-type contacts and allowing efficient current spreading. By preventing electron overshoot past quantum wells, it disables carrier recombination in undesired regions of the quantized heterostructures and opens up the possibility for new geometries of integrating and stacking multiple light emitters. [ABSTRACT FROM AUTHOR]

Recent observation of high density polarization-induced two-dimensional electron gases in ultra-thin N-polar GaN layers grown on single-crystal AlN has enabled the development of N-polar high electron mobility transistors (HEMTs) on AlN. Such devices will take advantage of thermal and power handling capabilities of AlN, while simultaneously benefitting from the merits of N-polar structures, such as a strong back barrier. We report the experimental demonstration of N-polar GaN/AlGaN/AlN HEMTs on single-crystal AlN substrates, showing an on-current of 2.6 A/mm with a peak transconductance of 0.31 S/mm. Small-signal RF measurements revealed speeds exceeding ft/fmax = 68/100 GHz. These results pave the way for developing RF electronics with excellent thermal management based on N-polar single-crystal AlN. [ABSTRACT FROM AUTHOR]

Due to its high breakdown electric field, the ultra-wide bandgap semiconductor AlGaN has garnered much attention recently as a promising channel material for next-generation high electron mobility transistors (HEMTs). A comprehensive experimental study of the effects of Al composition x on the transport and structural properties is lacking. We report the charge control and transport properties of polarization-induced 2D electron gases (2DEGs) in strained AlGaN quantum well channels in molecular-beam-epitaxy-grown AlN/AlxGa1−xN/AlN double heterostructures by systematically varying the Al content from x = 0 (GaN) to x = 0.74, spanning energy bandgaps of the conducting HEMT channels from 3.49 to 4.9 eV measured by photoluminescence. This results in a tunable 2DEG density from 0 to 3.7 × 1013 cm2. The room temperature mobilities of x ≥ 0.25 AlGaN channel HEMTs were limited by alloy disorder scattering to below 50 cm2/(V.s) for these 2DEG densities, leaving ample room for further heterostructure design improvements to boost mobilities. A characteristic alloy fluctuation energy of ≥ 1.8 eV for electron scattering in AlGaN alloy is estimated based on the temperature dependent electron transport experiments. [ABSTRACT FROM AUTHOR]

N-polar AlN epilayers were grown on the N-face of single-crystal bulk AlN substrates by plasma-assisted molecular beam epitaxy. A combination of in situ thermal deoxidation and Al-assisted thermal desorption at high temperature aided in removing native surface oxides and impurities from the N-polar surface of the substrate enabling successful homoepitaxy. Subsequent epitaxial growth of the AlN layer on the in situ cleaned substrates, grown in a sufficiently high Al droplet regime, exhibited smooth surface morphologies with clean and wide atomic steps. KOH etch studies confirmed the N-polarity of the homoepitaxial films. Secondary ion mass spectrometry profiles show Si and H impurity concentrations below the noise levels, whereas O and C impurity concentrations of ∼ 8 × 1 0 17 and ∼ 2 × 1 0 17 atoms/cm3 are observed, respectively. Although the structural defect densities are low, they interestingly appear as inversion domains of different dimensionalities. [ABSTRACT FROM AUTHOR]

The polarization difference and band offset between Al(Ga)N and GaN induce two-dimensional (2D) free carriers in Al(Ga)N/GaN heterojunctions without any chemical doping. A high-density 2D electron gas (2DEG), analogous to the recently discovered 2D hole gas in a metal-polar structure, is predicted in a N-polar pseudomorphic GaN/Al(Ga)N heterostructure on unstrained AlN. We report the observation of such 2DEGs in N-polar undoped pseudomorphic GaN/AlGaN heterostructures on single-crystal AlN substrates by molecular beam epitaxy. With a high electron density of ∼4.3 × 10 13 /cm2 that maintains down to cryogenic temperatures and a room temperature electron mobility of ∼450 cm2/V s, a sheet resistance as low as ∼320 Ω / ◻ is achieved in a structure with an 8 nm GaN layer. These results indicate significant potential of AlN platform for future high-power RF electronics based on N-polar III-nitride high electron mobility transistors. [ABSTRACT FROM AUTHOR]

Mueller matrix spectroscopic ellipsometry is applied to determine anisotropic optical properties for a set of single-crystal rhombohedral structure α-(AlxGa1−x)2O3 thin films (0 ≤ x ≤ 1). Samples are grown by plasma-assisted molecular beam epitaxy on m-plane sapphire. A critical-point model is used to render a spectroscopic model dielectric function tensor and to determine direct electronic band-to-band transition parameters, including the direction dependent two lowest-photon energy band-to-band transitions associated with the anisotropic bandgap. We obtain the composition dependence of the direction dependent two lowest band-to-band transitions with separate bandgap bowing parameters associated with the perpendicular ( b E g , ⊥ = 1.31 eV) and parallel ( b E g , | | = 1.61 eV) electric field polarization to the lattice c direction. Our density functional theory calculations indicate a transition from indirect to direct characteristics between α-Ga2O3 and α-Al2O3, respectively, and we identify a switch in band order where the lowest band-to-band transition occurs with polarization perpendicular to c in α-Ga2O3 whereas for α-Al2O3 the lowest transition occurs with polarization parallel to c. We estimate that the change in band order occurs at approximately 40% Al content. Additionally, the characteristic of the lowest energy critical point transition for polarization parallel to c changes from M1 type in α-Ga2O3 to M0 type van Hove singularity in α-Al2O3. [ABSTRACT FROM AUTHOR]

High hole densities are desired in p‐channel field effect transistors to improve the speed and on‐currents. Building on the recently discovered undoped, polarization‐induced GaN/AlN 2D hole gas (2DHG), this work demonstrates the tuning of the piezoelectric polarization difference across the heterointerface by introducing indium in the GaN channel. Using careful design and epitaxial growths, these pseudomorphic (In)GaN/AlN heterostructures result in some of the highest carrier densities of >1014 cm−2 in a III‐nitride heterostructure—just an order below the intrinsic crystal limit of ≈1015 cm−2. These ultra‐high density InGaN/AlN 2DHGs show room temperature mobilities of 0.5–4 cm2 V−1 s−1 and do not freeze out at low temperatures. A characteristic alloy fluctuation energy of 1.0 eV for hole scattering in InGaN alloy is proposed based on the experiments. [ABSTRACT FROM AUTHOR]

Polarization-induced (Pi) distributed or bulk doping in GaN, with a zero dopant ionization energy, can reduce temperature or frequency dispersions in impurity-doped p–n junctions caused by the deep-acceptor-nature of Mg, thus offering GaN power devices promising prospects. Before comprehensively assessing the benefits of Pi-doping, ideal junction behaviors and high-voltage capabilities should be confirmed. In this work, we demonstrate near-ideal forward and reverse I–V characteristics in Pi-doped GaN power p–n diodes, which incorporates linearly graded, coherently strained AlGaN layers. Hall measurements show a net increase in the hole concentration of 8.9 × 1016 cm−3 in the p-layer as a result of the polarization charge. In the Pi-doped n-layer, a record-low electron concentration of 2.5 × 1016 cm−3 is realized due to the gradual grading of Al0-0.72GaN over 1 μm. The Pi-doped p–n diodes have an ideality factor as low as 1.1 and a 0.10 V higher turn-on voltage than the impurity-doped p–n diodes due to the increase in the bandgap at the junction edge. A differential specific on-resistance of 0.1 mΩ cm2 is extracted from the Pi-doped p–n diodes, similar with the impurity-doped counterpart. The Pi-doped diodes show an avalanche breakdown voltage of ∼1.25 kV, indicating a high reverse blocking capability even without an ideal edge-termination. This work confirms that distributed Pi-doping can be incorporated in high-voltage GaN power devices to increase hole concentrations while maintaining excellent junction properties. [ABSTRACT FROM AUTHOR]

We determine the composition dependence of the transverse and longitudinal optical infrared-active phonon modes in rhombohedral α-(AlxGa1−x)2O3 alloys by far-infrared and infrared generalized spectroscopic ellipsometry. Single-crystalline high quality undoped thin-films grown on m-plane oriented α-Al2O3 substrates with x = 0.18, 0.37, and 0.54 were investigated. A single mode behavior is observed for all phonon modes, i.e., their frequencies shift gradually between the equivalent phonon modes of the isostructural binary parent compounds. We also provide physical model line shape functions for the anisotropic dielectric functions. We use the anisotropic high-frequency dielectric constants for polarizations parallel and perpendicular to the lattice c axis measured recently by Hilfiker et al. [Appl. Phys. Lett. 119, 092103 (2021)], and we determine the anisotropic static dielectric constants using the Lyddane–Sachs–Teller relation. The static dielectric constants can be approximated by linear relationships between those of α-Ga2O3 and α-Al2O3. The optical phonon modes and static dielectric constants will become useful for device design and free charge carrier characterization using optical techniques. [ABSTRACT FROM AUTHOR]

For utilization in environments where radiation causes concern, a material's photogeneration coefficient proves essential for device designers. To extract this parameter for gallium oxide, which exhibits higher breakdown voltage characteristics compared with other commonly used semiconductor materials, making it desirable for high‐power applications, Schottky diodes receive high‐dose‐rate radiation from an electron linear accelerator. Monitoring photogenerated charge versus dose rate reveals a photogeneration coefficient of 2.4 × 1015 pairs (cm−3‐rad(Si)−1) for epitaxially grown β‐phase gallium oxide. [ABSTRACT FROM AUTHOR]

The recent demonstration of ≈2 W mm−1 output power at 94 GHz in AlN/GaN/AlN high‐electron‐mobility transistors (HEMTs) has established AlN as a promising platform for millimeter‐wave electronics. The current state‐of‐art AlN HEMTs using ex situ‐deposited silicon nitride (SiN) passivation layers suffer from soft gain compression due to trapping of carriers by surface states. Reducing surface state dispersion in these devices is thus desired to access higher output powers. Herein, a potential solution using a novel in situ crystalline AlN passivation layer is provided. A thick, 30+ nm‐top AlN passivation layer moves the as‐grown surface away from the 2D electron gas (2DEG) channel and reduces its effect on the device. Through a series of metal‐polar AlN/GaN/AlN heterostructure growths, it is found that pseudomorphically strained ≤15 nm thin GaN channels are crucial to be able to grow thick AlN barriers without cracking. The fabricated recessed‐gate HEMTs on an optimized heterostructure with 50 nm AlN barrier layer and 15 nm GaN channel layer show reduction in dispersion down to 2−6% compared with 20% in current state‐of‐art ex situ SiN‐passivated HEMTs. These results demonstrate the efficacy of this unique in situ crystalline AlN passivation technique and should unlock higher mm‐wave powers in next‐generation AlN HEMTs. [ABSTRACT FROM AUTHOR]

Direct epitaxial integration of magnetic layers with wide bandgap nitride semiconductors will enable spin-controlled transport and photonic phenomena, seeding ideas for functional spintronic devices. Using plasma-assisted molecular beam epitaxy (MBE) in a previously unexplored window, significantly improved ferrimagnetic Mn4N layers are successfully grown on GaN with ~1 nm surface roughness. Distinct from earlier reports, the Mn4N layers grown on GaN are found to be [001] oriented with 12-fold in-plane symmetry in the diffraction pattern. This unique epitaxial registry originates from three equivalent rotational domains. The ferrimagnetic magnetotransport properties of low growth temperature Mn4N layers on GaN are comparable to those reported on cubic substrates such as MgO. However, a sign-flip of the Hall resistance is discovered for Mn4N layers grown above 300 °C. [ABSTRACT FROM AUTHOR]

Although the scanning microwave microscope (SMM) is based on the atomic force microscope (AFM), the SMM differs from the AFM by being able to sense subsurface electromagnetic properties of a sample. This makes the SMM promising for in-depth nondestructive characterization of nanoelectronic structures. However, the SMM raw data are convoluted with the sample topography, making it especially challenging for quantitative characterization of nonplanar structures. In this paper, using the topography information simultaneously obtained by the AFM and the in situ extracted probe geometry, we de-embed from the topography-corrupted SMM data the sheet resistance of 2D electron or hole gas (2DEG or 2DHG) buried at the interface of an AlN/GaN heterostructure, including the lateral depletion of the 2DEG from an etched step. The SMM results are validated by Hall-effect measurements. The limitation and possible improvement in the present technique are discussed. With improved setup, the SMM can be used to nondestructively monitor the local sheet resistance of 2DEG or 2DHG during device manufacture. These studies help to pave the way to 3D microwave tomography on the nanometer scale. [ABSTRACT FROM AUTHOR]

Wurtzite aluminum nitride (AlN) has attracted increasing attention for high-power and high-temperature operations due to its high piezoelectricity, ultrawide-bandgap, and large thermal conductivity k. The k of epitaxially grown AlN on foreign substrates has been investigated; however, no thermal studies have been conducted on homoepitaxially grown AlN. In this study, the thickness dependent k and thermal boundary conductance G of homoepitaxial AlN thin films were systematically studied using the optical pump–probe method of frequency-domain thermoreflectance. Our results show that k increases with the thickness and k values are among the highest reported for film thicknesses of 200 nm, 500 nm, and 1 μm, with values of 71.95, 152.04, and 195.71 W/(mK), respectively. Our first-principles calculations show good agreement with our measured data. Remarkably, the G between the epilayer and the substrate reported high values of 328, 477, 1180, and 2590 MW/(m2K) for sample thicknesses of 200 nm, 500 nm, 1 μm, and 3 μm, respectively. The high k and ultrahigh G of homoepitaxially grown AlN are very promising for efficient heat dissipation, which helps in device design and has advanced applications in micro-electromechanical systems, ultraviolet photonics, and high-power electronics. [ABSTRACT FROM AUTHOR]

The breakdown mechanisms of >1kV $\beta $ -Ga2O3 trench-MOS Schottky-barrier (SB) diodes (SBDs) are investigated during step-stressed voltage measurements. We demonstrate the use of current leakage noise to characterize leakage mechanisms. Comparing the normalized current noise characteristics of a set of trench-MOS SBDs to a metal-oxide-semiconductor capacitor (MOS-CAP) and a planar SBD test structure, the origin of two leakage mechanisms can be discerned. At low biases, leakage is dominated by barrier tunneling at the SB interface. At higher biases, non-reversible soft-breakdown events are observed, with a sharp increase in leakage current associated with breakdown at the oxide interface. Beyond these non-reversible soft-breakdown events, localized Al2O3 leakage paths dominate the leakage noise signature. Changes in the dominant leakage mechanism, under reverse bias stress, have implications for the voltage ratings and lifetimes of reduced surface electric field (RESURF) devices that incorporate oxide layers for enhanced breakdown fields. [ABSTRACT FROM AUTHOR]

This report classifies emission inhomogeneities that manifest in InGaN quantum well blue light-emitting diodes grown by plasma-assisted molecular beam epitaxy on free-standing GaN substrates. By a combination of spatially resolved electroluminescence and cathodoluminescence measurements, atomic force microscopy, scanning electron microscopy and hot wet potassium hydroxide etching, the identified inhomogeneities are found to fall in four categories. Labeled here as type I through IV, they are distinguishable by their size, density, energy, intensity, radiative and electronic characteristics and chemical etch pits which correlates them with dislocations. Type I exhibits a blueshift of about 120 meV for the InGaN quantum well emission attributed to a perturbation of the active region, which is related to indium droplets that form on the surface in the metal-rich InGaN growth condition. Specifically, we attribute the blueshift to a decreased growth rate of and indium incorporation in the InGaN quantum wells underneath the droplet which is postulated to be the result of reduced incorporated N species due to increased N2 formation. The location of droplets are correlated with mixed type dislocations for type I defects. Types II through IV are due to screw dislocations, edge dislocations, and dislocation bunching, respectively, and form dark spots due to leakage current and nonradiative recombination. [ABSTRACT FROM AUTHOR]

A rigorous theoretical and computational model is developed for the plasma-wave propagation in high electron mobility transistor structures with electron injection from a resonant tunneling diode at the gate. We discuss the conditions in which low-loss and sustainable plasmon modes can be supported in such structures. The developed analytical model is used to derive the dispersion relation for these plasmon-modes. A non-linear full-wave-hydrodynamic numerical solver is also developed using a finite difference time domain algorithm. The developed analytical solutions are validated via the numerical solution. We also verify previous observations that were based on a simplified transmission line model. It is shown that at high levels of negative differential conductance, plasmon amplification is indeed possible. The proposed rigorous models can enable accurate design and optimization of practical resonant tunnel diode-based plasma-wave devices for terahertz sources, mixers, and detectors, by allowing a precise representation of their coupling when integrated with other electromagnetic structures. [ABSTRACT FROM AUTHOR]

A high-conductivity two-dimensional (2D) hole gas is the enabler of wide-bandgap p-channel transistors. Compared to commonly used AlN template substrates with high dislocation densities, the recently available single-crystal AlN substrates are promising to boost the speed and power handling capability of p-channel transistors based on GaN/AlN 2D hole gases (2DHGs) thanks to the much lower dislocation densities and the absence of thermal boundary resistance. Using plasma-assisted molecular beam epitaxy, we report the observation of polarization-induced high-density 2DHGs in undoped pseudomorphic GaN/AlN heterostructures on the single-crystal AlN substrates with high structural quality and atomic steps on the surface. The high-density 2DHG persists down to cryogenic temperatures with a record high mobility exceeding 280 cm2/V s and a density of 2.2 × 1013/cm2 at 10 K. These results shed light on aspects of improving 2D hole mobilities and indicate significant potential of GaN/AlN 2DHG grown on bulk AlN substrates for future high performance wide-bandgap p-channel transistors. [ABSTRACT FROM AUTHOR]

Ultra-wide bandgap β-gallium oxide (Ga2O3) vertical device technologies are of significant interest in the context of the development of next-generation kV-range power switching devices. In this work, thermal analysis of vertical fin channel-based metal–oxide–semiconductor field-effect transistors (or fin field-effect transistors—FinFETs) was performed using infrared thermal microscopy and coupled electro-thermal modeling. FinFETs with different fin width and channel spacing were characterized to study the thermal design trade-off when attempting to minimize the footprint of multi-fin FinFET arrays. A 50 × 50 μm2 scaled FinFET cell array exhibited an ∼23× higher temperature rise as compared to a 5-fin device. Devices with different orientations were fabricated and characterized. By rotating the fin channel aligned along the [010] direction by 90º, the channel temperature rise reduced by 30%, due to the anisotropy of the Ga2O3 thermal conductivity (κ). Electro-thermal modeling shows that a 20% reduction in the temperature rise is possible by fabricating devices on a (010)-oriented substrate as compared to the tested devices built on a (001) substrate. These results indicate the importance of the electro-thermal co-design process for Ga2O3 vertical FinFET cell arrays. [ABSTRACT FROM AUTHOR]

A Mueller matrix spectroscopic ellipsometry approach was used to investigate the anisotropic dielectric constants of corundum α-(AlxGa1−x)2O3 thin films in their below bandgap spectral regions. The sample set was epitaxially grown using plasma-assisted molecular beam epitaxy on m-plane sapphire. The spectroscopic ellipsometry measurements were performed at multiple azimuthal angles to resolve the uniaxial dielectric properties. A Cauchy dispersion model was applied, and high-frequency dielectric constants are determined for polarization perpendicular ( ε ∞ , ⊥ ) and parallel ( ε ∞ , ∥ ) to the thin film c-axis. The optical birefringence is negative throughout the composition range, and the overall index of refraction substantially decreases upon incorporation of Al. We find small bowing parameters of the high-frequency dielectric constants with b ⊥ = 0.386 and b ∥ = 0.307. [ABSTRACT FROM AUTHOR]

β-Ga2O3 is a promising ultra-wide bandgap semiconductor whose properties can be further enhanced by alloying with Al. Here, using atomic-resolution scanning transmission electron microscopy, we find the thermodynamically unstable γ-phase is a ubiquitous structural defect in both β-(AlxGa1−x)2O3 films and doped β-Ga2O3 films grown by molecular beam epitaxy. For undoped β-(AlxGa1−x)2O3 films, we observe γ-phase inclusions between nucleating islands of the β-phase at lower growth temperatures (∼500–600 °C). In doped β-Ga2O3, a thin layer of the γ-phase is observed on the surfaces of films grown with a wide range of n-type dopants and dopant concentrations. The thickness of the γ-phase layer was most strongly correlated with the growth temperature, peaking at about 600 °C. Ga interstitials are observed in the β-phase, especially near the interface with the γ-phase. By imaging the same region of the surface of a Sn-doped β-(AlxGa1−x)2O3 after ex situ heating up to 400 °C, a γ-phase region is observed to grow above the initial surface, accompanied by a decrease in Ga interstitials in the β-phase. This suggests that the diffusion of Ga interstitials toward the surface is likely the mechanism for growth of the surface γ-phase and more generally that the more-open γ-phase may offer diffusion pathways to be a kinetically favored and early forming phase in the growth of Ga2O3. However, more modeling and simulation of the γ-phase and the interstitials are needed to understand the energetics and kinetics, the impact on electronic properties, and how to control them. [ABSTRACT FROM AUTHOR]