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The drain leakage current in n-channel bottom-gated nanocrystalline silicon (nc-Si) thin-film transistors is investigated systematically by conduction and low-frequency noise measurements. The presented results indicate that the leakage current, controlled by the reverse biased drain junction, is due to Poole-Frenkel emission at low electric fields and band-to-band tunneling at large electric fields. The leakage current is correlated with single-energy traps and deep grain boundary trap levels with a uniform energy distribution in the band gap of the nc-Si. Analysis of the leakage current noise spectra indicates that the grain boundary trap density of 8.5 times 1012 cm -2 in the upper part of the nc-Si film is reduced to 2.1 times 1012 cm-2 in the lower part of the film, which is attributed to a contamination of the nc-Si bulk by oxygen

A simple analytical expression for the above threshold voltage drain current is derived in nanocrystalline silicon thin-film transistors (TFTs), based on an exponential energy distribution of band tail states. When the characteristic temperature distribution of the band tails is equal to 1.5 times the lattice temperature, the derived expression leads to the basic “quadratic” metal-oxide-semiconductor current expression. By including the impact ionization effect and using the same trap distribution parameters, the model describes adequately the output characteristics of TFTs with different channel dimensions, making the proposed model suitable for the design of circuits with nc-Si TFTs.