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13 results on '"Le Gouguec, Thierry"'

1. Design of a Slotted Waveguide Antenna Based on TE20 Mode in Ku-Band Suitable for Direct Metal Laser Sintering.

Author

Chairi, Youssef, Abedrrabba, Sarra, Allanic, Rozenn, Amiaud, Anne-Charlotte, El Oualkadi, Ahmed, Quendo, Cédric, Merlet, Thomas, Reklaoui, Kamal, and Le Gouguec, Thierry

Subjects
DIRECT metal laser sintering, WAVEGUIDE antennas, SLOT antennas, COPLANAR waveguides, ANTENNA arrays, SUBSTRATE integrated waveguides, METAL powders, REFLECTANCE
Abstract

This paper describes the design of a novel Ku-band slotted waveguide antenna (SWA), taking into consideration the advantages and drawbacks of using a 3D direct metal laser sintering (DMLS) process. Indeed, the DMLS process makes it possible to produce a SWA with 64 radiating slots and its feeding network in a single and monolithic process. However, considering the lack of accuracy of the process, the whole design must be completely thought out and planned to avoid sensitive dimensions. Coupling irises inside such structures are elements of major sensitivity in this regard, so the radiating waveguides in the present work were designed to be TE20 ones, avoiding this kind of iris. Thus, a TE10 to TE20 converter was designed to be implemented in the overall power supply structure of an antenna array made up of four linear SWAs with 16 slots each. Both the elementary 16-slot SWA and the complete SWA with the feeding network were manufactured using DMLS. At a resonant frequency of 15 GHz, the measured realized gain is 22.26 dB with sidelobe levels below 10.1 dB. The measured reflection coefficient is lower than −12.6 dB at the center frequency. These measured performances confirm the proof of concept. [ABSTRACT FROM AUTHOR]

Published
2022
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2. Ku-Band Lightweight Aluminium Waveguides Fabricated by Direct Metal Laser Sintering Process

Author

El Oualkadi Ahmed, Chairi Youssef, Amiaud Anne-Charlotte, Reklaoui Kamal, Le Gouguec Thierry, Rozenn Allanic, Merlet Thomas, Quendo Cedric, Abedrrabba Sarra, Lab-STICC_UBO_MOM_DIM, Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance (Lab-STICC), École Nationale d'Ingénieurs de Brest (ENIB)-Université de Bretagne Sud (UBS)-Université de Brest (UBO)-École Nationale Supérieure de Techniques Avancées Bretagne (ENSTA Bretagne)-Institut Mines-Télécom [Paris] (IMT)-Centre National de la Recherche Scientifique (CNRS)-Université Bretagne Loire (UBL)-IMT Atlantique Bretagne-Pays de la Loire (IMT Atlantique), Institut Mines-Télécom [Paris] (IMT)-École Nationale d'Ingénieurs de Brest (ENIB)-Université de Bretagne Sud (UBS)-Université de Brest (UBO)-École Nationale Supérieure de Techniques Avancées Bretagne (ENSTA Bretagne)-Institut Mines-Télécom [Paris] (IMT)-Centre National de la Recherche Scientifique (CNRS)-Université Bretagne Loire (UBL)-IMT Atlantique Bretagne-Pays de la Loire (IMT Atlantique), Institut Mines-Télécom [Paris] (IMT)-Institut Brestois du Numérique et des Mathématiques (IBNM), Université de Brest (UBO), Thales LAS France, Laboratoire des Technologies de l'Information et de la Communication (Labtic), and Ecole Nationale des Sciences Appliquées [Tanger] (ENSAT)

Subjects
Materials science, Direct metal laser sintering, business.industry, Additive manufacturing, Lightweight, 3D printing, 3D metal printing, Waveguide (optics), Ku band, law.invention, [SPI.TRON]Engineering Sciences [physics]/Electronics, Selective laser sintering, [SPI.ELEC]Engineering Sciences [physics]/Electromagnetism, law, Optoelectronics, Insertion loss, Waveguide, Radio frequency, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, business, Microwave
Abstract

International audience; This paper attempts to establish a good base for weight-reduction technique of microwave devices using 3D printing techniques. Experimental studies to minimize the weight of radiofrequency waveguides printed using additive manufacturing techniques are presented. Two types of Kuband rectangular waveguides (perforated and full-metal) have been printed using direct metal laser sintering (DMLS) process. The insertion losses increased by ~1.2 dB/m after applying 1 mm grids which reduces the weight of Ku-band rectangular waveguide by ~17.5%. Comparison between these measurements and those of a waveguide manufactured by conventional method was used to determine process loss. The insertion losses of full-metal waveguide manufactured using DMLS process increase by ~0.7 dB/m compared to the conventional one. Finally, RF measurements of waveguides manufactured using DMLS process show a good agreement with the simulation results.

Published
2020

3. Electromagnetic Characterization of the Intrachip Propagation Channel in $Ka$ - and $V$ -Bands.

Author

El Masri, Ihsan, Le Gouguec, Thierry, Martin, Pierre-Marie, Allanic, Rozenn, and Quendo, Cedric

Subjects
*DIPOLE antennas, *NETWORKS on a chip, *INTEGRATED circuit interconnections, *INTEGRATED circuits, *PARALLEL programming, *WIRELESS channels, *LITERATURE reviews
Abstract

This article presents the implementation of the intrachip propagation channel in the case of a wireless interconnect network-on-chip used for parallel computing applications. These wireless interconnects still require precise propagation models to demonstrate that they can be considered as a realistic efficient alternative to the wired interconnects. First, we show the advantages of wireless solutions for broadcast applications. As this type of circuit will be realized using silicon as the main component, we present in the literature review the problems and constraints of integrated antennas and channels on silicon. Then, a deep electromagnetic study for the intrachip transmission is conducted, with measurements done using two manufactured prototypes of printed dipole antennas on silicon in the Ka-band (26–40 GHz) and in the $V$ -band (40–75 GHz) with different scenarios. The good agreement between simulations and measurements validates the problems encountered due to the silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intrachip transmission on integrated circuits and to prove the feasibility of the wireless network on chip using integrated antennas. [ABSTRACT FROM AUTHOR]

Published
2019
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4. Study of Proximity-Coupling: Application to new RF-Interconnects

Author

Mombo Boussougou, Yves Constant, Le Gouguec, Thierry, Quéré, Yves, Huret, Fabrice, Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance (UMR 3192) (Lab-STICC), Université européenne de Bretagne - European University of Brittany (UEB)-Université de Bretagne Sud (UBS)-Université de Brest (UBO)-Institut Brestois du Numérique et des Mathématiques (IBNM), Université de Brest (UBO)-Télécom Bretagne-Institut Mines-Télécom [Paris] (IMT)-Centre National de la Recherche Scientifique (CNRS), Laboratoire d'Electronique et Systèmes de Télécommunications (LEST), Université de Brest (UBO)-Ecole Nationale Supérieure des Télécommunications de Bretagne-Centre National de la Recherche Scientifique (CNRS), Region Bretagne, and Mombo Boussougou, Yves Constant

Subjects
modulation, radiofrequency, multiplexing, [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, coupling, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, contactless interconnect, capacitive
Abstract

International audience; The new concept of RF Interconnect presented in this paper is aimed at replacing conventional interconnections in digital circuits. The study was, thus, focused on the transmission channel composed of contactless transitions. After a brief recall of the theory, an RF interconnection was modeled through use of multiplexing digital CDMA and amplitude modulation and characterized by using a co-simulation tool. The frequency response of a radiofrequency channel and the signal forms observed along the transmission system are presented to highlight the capabilities of this RF interconnect.

Published
2010

5. A Numerical Method for a Full-Ware Electromagnetic Analysis of Systems on Chip

Author

Tanguy, Noël, Bréhonnet, Pascale, Le Gouguec, Thierry, Martin, Pierre-Marie, Deschacht, Denis, Quéré, Yves, Vilbé, Pierre, Calvez, Léon-Claude, Huret, Fabrice, Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance (UMR 3192) (Lab-STICC), Université européenne de Bretagne - European University of Brittany (UEB)-Université de Bretagne Sud (UBS)-Université de Brest (UBO)-Télécom Bretagne-Institut Brestois du Numérique et des Mathématiques (IBNM), Université de Brest (UBO)-Institut Mines-Télécom [Paris] (IMT)-Centre National de la Recherche Scientifique (CNRS), Laboratoire d'Electronique et Systèmes de Télécommunications (LEST), Université de Brest (UBO)-Ecole Nationale Supérieure des Télécommunications de Bretagne-Centre National de la Recherche Scientifique (CNRS), Conception et Test de Systèmes MICroélectroniques (SysMIC), Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier (LIRMM), Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM)-Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM), Université européenne de Bretagne - European University of Brittany (UEB)-Université de Bretagne Sud (UBS)-Université de Brest (UBO)-Institut Brestois du Numérique et des Mathématiques (IBNM), and Université de Brest (UBO)-Télécom Bretagne-Institut Mines-Télécom [Paris] (IMT)-Centre National de la Recherche Scientifique (CNRS)

Subjects
ComputingMilieux_MISCELLANEOUS
Abstract

International audience

Published
2008

6. An Efficient Model-Order Reduction for A Complete Full-Wave Electromagnetic Analysis of SOC-AMS

Author

Bréhonnet, Pascale, Le Gouguec, Thierry, Tanguy, Noël, Martin, Pierre-Marie, Deschacht, Denis, Vilbé, Pierre, Calvez, Léon-Claude, Huret, Fabrice, Laboratoire d'Electronique et Systèmes de Télécommunications (LEST), Université de Brest (UBO)-Ecole Nationale Supérieure des Télécommunications de Bretagne-Centre National de la Recherche Scientifique (CNRS), Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance (UMR 3192) (Lab-STICC), Université européenne de Bretagne - European University of Brittany (UEB)-Université de Bretagne Sud (UBS)-Université de Brest (UBO)-Télécom Bretagne-Institut Brestois du Numérique et des Mathématiques (IBNM), Université de Brest (UBO)-Institut Mines-Télécom [Paris] (IMT)-Centre National de la Recherche Scientifique (CNRS), Conception et Test de Systèmes MICroélectroniques (SysMIC), Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier (LIRMM), Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM)-Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM), IEEE, and Carvalho De Matos, Christine

Subjects
ComputingMilieux_MISCELLANEOUS
Abstract

International audience

Published
2008

7. A Simple Design Rule for Substrate Crosstalk Reduction of High-Speed VLSI Circuits

Author

Quéré, Yves, Le Gouguec, Thierry, Martin, Pierre-Marie, Deschacht, Denis, Huret, Fabrice, Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance (UMR 3192) (Lab-STICC), Université européenne de Bretagne - European University of Brittany (UEB)-Université de Bretagne Sud (UBS)-Université de Brest (UBO)-Télécom Bretagne-Institut Brestois du Numérique et des Mathématiques (IBNM), Université de Brest (UBO)-Institut Mines-Télécom [Paris] (IMT)-Centre National de la Recherche Scientifique (CNRS), Laboratoire d'Electronique et Systèmes de Télécommunications (LEST), Université de Brest (UBO)-Ecole Nationale Supérieure des Télécommunications de Bretagne-Centre National de la Recherche Scientifique (CNRS), Conception et Test de Systèmes MICroélectroniques (SysMIC), Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier (LIRMM), Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM)-Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM), and IEEE

Subjects
ComputingMilieux_MISCELLANEOUS
Abstract

International audience

Published
2008

9. Modeling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions.

Author

LE GOUGUEC, THIERRY, MAHDI, NAJIB, CADIOU, STEPHANE, QUENDO, CEDRIC, SCHLAFFER, ERICH, PESSL, WALTER, and LEFEVRE, ALAIN

Abstract

The recent developments in electronic cards such as the network equipment are characterized by the miniaturization of the board size and the increasing complexity of the layout. Because of these requirements, multi-layered printed circuit boards are commonly used and vias connecting signal lines on different layers, or integrated circuit devices to power and ground planes, are frequently used and often essential. However, a via is not an ideal transmission line. Besides, it creates discontinuities at high frequencies leading to high insertion loss degradation of signal which limits the performances of integrated circuit and systems. In this paper, the impacts of coupling between via and parallel-plates cavity on the response of microwave integrated devices are highlighted in the first part. Then, to describe the intrinsic interaction between the via transition and parallel-plate modes, the notion of parallel-plates matrix impedances is presented and new boundary conditions like open or plated through holes shielded boundaries of the cavities are introduced. Then, using this physics-based model, an intuitive equivalent circuit has been developed. Finally, the proposed approach and the equivalent circuits were validated by using comparisons with electromagnetic simulations and measurements in different scenarios. [ABSTRACT FROM AUTHOR]

Published
2016
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11. Microstrip line modelling in the presence of interfering metal strips according to their orientation.

Author

Le Gouguec, Thierry and Martin, Pierre-Marie

Abstract

In the context of PCB technology, this paper deals with the measurement and simulation of propagation from a microstrip line disturbed by a metal ribbon placed just above it. We investigate the influence of the angular orientation of the interfering strip and we highlight the presence of disturbances on transmission S-parameters. Lastly, we propose a model of these ribbon orientation effects, which is validated by the experimental results. [ABSTRACT FROM PUBLISHER]

Published
2012
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12. Frequency Domain Analysis of Transmission Zeroes on High-Speed Interconnects in the Presence of an Orthogonal Metal Grid Underlayer.

Author

Quéré, Yves, Le Gouguec, Thierry, Martin, Pierre-Marie, Le Berre, Denis, and Huret, Fabrice

Subjects
*MULTICHIP modules (Microelectronics), *STRIP transmission lines, *ORTHOGONAL functions, *SIMULATION methods & models, *RESONANCE
Abstract

This paper addresses the topic of high-speed interconnects in high density systems [systems on chip (SoCs), systems in package (SiPs), systems on package (SoPs), and multichip modules (MCMs)]. These microstrip or coplanar lines have, often, an underlayer of orthogonal metal grids liable to affect transmission characteristics. The characterization proposed in this paper relies on S-parameter measurements and electromagnetic simulations. The grids under study are of two kinds: grounded (CC) and floating (CO). In both cases, the signal is distorted in the time domain further to the occurrence of transmission zeroes whose position depend mainly on the grid length and, of course, on the grid charge, i.e., CC or CO. In order to easily estimate this position, we developed a simple equivalent circuit model and validated it by measurements and electromagnetic simulations. Then it was used to develop a set of expressions enabling one to analytically pinpoint the location of transmission zeroes in the frequency domain, while remaining valid for any underlayer of orthogonal metal lines or grids. [ABSTRACT FROM AUTHOR]

Published
2008
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13. Impact by an Orthogonal Metal Grid upon Differential- and Common-Mode Characteristics of Coupled Lines in PCB Technology Structures

Author

T. Le Gouguec, Pierre-Marie Martin, Lab-STICC_UBO_MOM_DIM, Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance (Lab-STICC), École Nationale d'Ingénieurs de Brest (ENIB)-Université de Bretagne Sud (UBS)-Université de Brest (UBO)-Télécom Bretagne-Institut Brestois du Numérique et des Mathématiques (IBNM), Université de Brest (UBO)-Université européenne de Bretagne - European University of Brittany (UEB)-École Nationale Supérieure de Techniques Avancées Bretagne (ENSTA Bretagne)-Institut Mines-Télécom [Paris] (IMT)-Centre National de la Recherche Scientifique (CNRS)-École Nationale d'Ingénieurs de Brest (ENIB)-Université de Bretagne Sud (UBS)-Université de Brest (UBO)-Télécom Bretagne-Institut Brestois du Numérique et des Mathématiques (IBNM), Université de Brest (UBO)-Université européenne de Bretagne - European University of Brittany (UEB)-École Nationale Supérieure de Techniques Avancées Bretagne (ENSTA Bretagne)-Institut Mines-Télécom [Paris] (IMT)-Centre National de la Recherche Scientifique (CNRS), IEEE, and Le Gouguec, Thierry

Subjects
Electromagnetic field, Engineering, EM analysis, [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, 02 engineering and technology, Topology, Microstrip, differential and common mode, 03 medical and health sciences, Printed circuit board, 0302 clinical medicine, 0202 electrical engineering, electronic engineering, information engineering, Perpendicular, Electronic engineering, Common-mode signal, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, Coupled lines, business.industry, [SPI.ELEC] Engineering Sciences [physics]/Electromagnetism, 020206 networking & telecommunications, Grid, [SPI.TRON] Engineering Sciences [physics]/Electronics, [SPI.TRON]Engineering Sciences [physics]/Electronics, [SPI.ELEC]Engineering Sciences [physics]/Electromagnetism, Electric power transmission, Transmission (telecommunications), transmission zeros, business, 030217 neurology & neurosurgery
Abstract

4 pages; International audience; This paper deals with a rigorous study of the impact by perpendicular metal grids on the characteristics of microstrip and coplanar coupled transmission lines. An electromagnetic analysis shows the variations of the propagation parameters in common and differential modes for each type of lines, in the presence of a metal grid. As transmission zeroes are liable to occur at certain frequencies, in particular in the common mode, we investigated the part played by the most influential grid parameters on these disturbances.

Published
2010

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