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As diamond possesses only deep dopants, certain conventional physics and characterization methods are not applicable to diamond devices, owing to the explicit or implicit assumption of shallow dopants. To resolve this limitation, the capacitance–voltage (C–V) characteristics of metal–insulator–semiconductor (MIS) capacitors formed on a semiconductor substrate with deep and compensating dopants were successfully formulated. Based on these equations, methods for accurately estimating the MIS capacitor properties were developed and validated through their application in the analysis of an actual MIS capacitor formed on a boron-doped hydrogen-terminated diamond substrate. The high-frequency C–V characteristic of the capacitor exhibited a prominent dip specific to deep dopants. However, the dip depth was considerably shallower than theoretically expected. This C–V characteristic was accurately reproduced theoretically, assuming the presence of a surficial diamond layer that contains acceptors with an activation energy of 0.23 eV, which is less than the value 0.37 eV for boron, and has a thickness of the extrinsic Debye length (40 nm in this study) or larger. The insulator charge of the MIS capacitor was estimated as −4.6 × 1012 cm−2 in units of electronic charge, which is sufficiently large to induce two-dimensional hole gas. The interface-state density was 1.4 × 1012 cm−2 eV−1 for interface-state energies of 0.3–0.5 eV above the valence band maximum. Hence, the proposed methodology and the possible presence of the reduced activation energy layer will guide the development of diamond-based devices. [ABSTRACT FROM AUTHOR]

In recent years, Gallium Nitride (GaN)-based metal-insulator-semiconductor high-electron-mobility transistors (MISHEMTs) have attracted interest in high-power and high-frequency applications. The breakdown mechanism in E-mode GaN MISHEMTs with carbon doping in the GaN buffer grown on a Silicon (Si) substrate (Sub) was investigated using technology computer-aided design simulations. Results showed that GaN MISHEMTs without Si Sub had a breakdown voltage (BV) of 600 V. However, after adding Si Sub to the GaN buffer layer, the electric field (EF) increased, creating a vertical breakdown through the total buffer thickness, therefore, BV was reduced to around 240 V. On the other hand, BV is increased to approximately >1100 V, and the Electric field is reduced after employing a carbon deep acceptor with the proper doping concentration in this device. The GaN MISHEMTs with Si Sub is presented as threshold voltage +1.5 V with transconductance of 700 mS/mm, which is an excellent result compared to GaN MISHEMTs without Si Sub. Eventually, the study device depicted higher BV performance compared to other C-doped GaN HEMT devices. This suggests that the designed GaN MISHEMTs device could effectively be used in power semiconductor devices with optimum performance. [ABSTRACT FROM AUTHOR]

The influence of Al2O3 atomic-layer deposition (ALD) temperature on the electric characteristics of Al / A l 2 O 3 / ( 2 ¯ 01) β-Ga2O3 capacitors was investigated focusing on the positive-bias instability (PBI) of the capacitors. The current in the capacitors increased with ALD temperature, mostly because of the reduced energy barrier height for the electron field emission from the substrate and less negative Al2O3 charge, as revealed by the analysis conducted assuming a space-charge-controlled field emission process. The PBI tests were conducted for cumulative voltage stressing times vastly ranging from 3 × 10−6 to 4 × 105 s. The capacitance–voltage (C–V) characteristics of the capacitors for an ALD temperature of 100 °C displayed negative shifts in the middle of voltage stressing, unlike those for the other ALD temperatures. The bias stability of the capacitors was found to be considerably improved by high-temperature (450 °C) ALD. Additionally, the C–V characteristic shifts caused by the voltage stressing were theoretically reproduced quite accurately, assuming a model proposed in this study. In the simulations, the trap distributions in the Al2O3 films were assumed to be uniform both spatially and energetically. Importantly, the experimental results for various stressing voltages were excellently fitted by the simulations that assumed the same trap distribution. The trap densities in the Al2O3 films thus estimated reduced from 1.2 × 1020 to 2.2 × 1019 cm−3 eV−1 for ALD temperatures of 100–450 °C. This reduction in the trap densities was a major cause of the bias stability enhancement for high-temperature ALD. Moreover, the trap density as a function of ALD temperature qualitatively agreed with the aforementioned Al2O3 charge generated by the current measurements. This agreement provides a strong basis for the validity of the PBI model proposed in this study. [ABSTRACT FROM AUTHOR]

The current conduction in negatively biased metal/Al2O3/diamond capacitors with various gate materials and diamond surface terminations was comprehensively characterized by assuming a space-charge-controlled field emission (SCC-FE) process, yielding the following results. The current-feeding carriers were field-emitted from the electrode that had a barrier height lower than that of the opposing electrode. Specifically, in an Au-gate oxygen-terminated diamond capacitor, holes were likely to be emitted from the Al2O3/diamond interface states, whereas, in Al-gate oxygen-terminated, Au-gate hydrogen-terminated, and Al-gate hydrogen-terminated diamond capacitors, electrons were emitted from the gate. The barrier heights at the Al/Al2O3 and Au/Al2O3 interfaces were estimated as 1.6–1.7 and 2.8 eV, respectively. However, the analysis of the hole emission from the interface states is left for future studies. Although the substrate of the oxygen-terminated diamond capacitor remained weakly depleted even for highly negative gate voltages, the conduction current was observed as mentioned earlier. To analyze the mechanism for this conduction, the diffusion and drift currents in the depleted substrate were quantitatively estimated, ascribing the current conduction to the diffusion current. As these results could not be obtained by using the conventional graphical methods based on model-specific plots, such as the Fowler–Nordheim and Poole–Frenkel plots, the SCC-FE analysis proved to be a powerful tool for investigating the current conduction in metal-insulator-semiconductor capacitors. [ABSTRACT FROM AUTHOR]

As previously reported, postdeposition annealing at 800 °C and higher simultaneously crystallizes atomic-layer-deposited (ALD) Al2O3 films and reduces the current in Al/ALD-Al2O3/(0001) GaN capacitors by two orders of magnitude. This current reduction is caused by the enhancement of conduction band offset from 1.4 to 1.8 eV, as revealed by the space-charge-controlled field emission analysis. Selected area electron diffraction (SAED) patterns demonstrate that the crystallized films consist of twinned (111)-oriented cubic γ-Al2O3 with an epitaxial relation of Al2O3 ⟨ 0 1 ¯ 1 ⟩ ∥ GaN ⟨ 2 1 ¯ 1 ¯ 0 ⟩. The SAED patterns additionally include spots that are specific to triaxially tripled γ-Al2O3. The aforementioned epitaxy is due to the similarity of hexagonal close-packed sublattices between oxygen on a (111) γ-Al2O3 plane and nitrogen on a (0001) GaN plane. However, the hexagonal close-packed lattice constant of γ-Al2O3 is 12% smaller than that of GaN, necessitating domain matching epitaxy. The thickness of the interfacial transition layer caused by the large misfit is estimated to be thinner than four monolayers of oxygen sublattice, by using the methodology developed here. Based on these results, the effect of Al2O3 crystallinity on the characteristics of Al2O3/GaN capacitors, such as conduction current, dielectric breakdown, interface states, and bias instability, was comprehensively captured. According to x-ray diffraction analyses, Al2O3 films crystallize at 700 °C, which is ∼100 °C lower than the threshold temperature estimated by transmission electron microscope observations. This difference was possibly caused by locally crystallized Al2O3 films, as confirmed by the slightly reduced current. These findings form a basis for improving ALD-Al2O3 films as gate insulator. [ABSTRACT FROM AUTHOR]

A dynamic space-charge-controlled field emission (SCC-FE) model that considers temporal insulator charge variations caused by voltage stress is developed for analyzing the current conduction in insulators in the entire voltage range of measurement, yielding good agreement between experiments and simulations. The usage of prestressed samples in this analysis is essential for accurately estimating the electron affinities of insulators, yielding 1.65 and 1.93 eV as the estimates for Al2O3 films formed on GaN by atomic-layer deposition (ALD) at 200 and 450 °C, respectively, and 1.65 and 1.83 eV for those on SiO2/Si, respectively. Through the bias instability analysis using the method developed here, the voltage-stress tolerance of both Si and GaN metal–insulator–semiconductor (MIS) capacitors with ALD Al2O3 films was found to be enhanced by the high-temperature (450 °C) ALD. The analysis also revealed the fact that the voltage-stress-induced flatband voltage shift of GaN capacitors with the high-temperature Al2O3 films is mainly caused by the Al2O3 charges near the substrate, hence providing a clue to even better bias stability of the GaN capacitors. With possible applications to other wide-bandgap semiconductor (WBGS) capacitors, the dynamic SCC-FE analysis developed here will play an essential role in analyzing not only gate insulator characteristics but also many reliability issues of various WBGS MIS field-effect transistors. [ABSTRACT FROM AUTHOR]

Diamond exhibits large application potential in the field of power electronics, owing to its excellent and desirable electronic properties. However, the main obstacles to its development originate from the small‐sized single‐crystal wafers and the instability of the electrical conductivity. This work presents a metal‐oxide‐semiconductor field‐effect transistor (MOSFET) on a diamond substrate derived from a five‐inch (110) highly preferred polycrystalline diamond film. The MOSFETs with excellent performance are fabricated by combining an H‐terminated channel and an epitaxially grown boron‐doped layer as the source/drain contacts of the diamond devices. According to the electrical statistical results of ≈110 devices on the polycrystalline diamond substrate, 44% of devices show normally‐off operation with a maximum current density of 400 mA mm−1, while 56% of devices demonstrate normally‐on operation with a maximum current density of 525 mA mm−1. The normally‐off characteristics are more related to the higher amounts of nitrogen concentration than the grain boundaries. The stable boron‐doped source and drain provide a high concentration of holes, which facilitate transport in the surface p‐type channel induced by the H‐termination. The characteristics of the MOSFETs are inspiring for the fabrication of complementary inverter circuits on large diamond wafers. [ABSTRACT FROM AUTHOR]

Diamond is a wide bandgap semiconductor (bandgap: 5.5 eV). However, through impurity doping, diamond can become a p-type or n-type semiconductor. The minimum resistivity of p-type semiconductor diamond is less than 10−3 Ω cm, which is no more than that of silicon (Si). In contrast, the minimum resistivity of n-type diamond is as high as 103 Ω cm. At present, the development of unipolar devices such as p-channel field-effect transistors (p-FETs) based on diamond is strongly anticipated. When the diamond surface is terminated using hydrogen (H) or Si atoms, the subsurface layer becomes a p-type accumulation layer or inversion layer that forms a two-dimensional hole gas (2DHG), which can then be used as a channel for a FET structure. As a p-FET, the performance of this device approaches that of other wide bandgap semiconductor n-channel FETs. One of the main advantages of this diamond p-FET is that the p-type accumulation or inversion layer is formed natively on the hydrogen terminated (C–H) diamond. This review describes the low metal contact resistance that induces 2DHG formation on the C–H diamond surface, on which negatively charged sites are formed. The negatively charged surface model explains the 2DHG formation clearly based on the FET's operating mechanism. Recent advances in 2DHG FETs are also discussed, particularly in terms of their current densities of >1 A mm−1 and their high frequency performance. Finally, we propose two types of complementary high-voltage circuit that combine diamond p-FETs with other wide bandgap semiconductor n-FETs. [ABSTRACT FROM AUTHOR]

High electron mobility transistor (HEMT) biosensors hold great potential for realizing label-free, real-time, and direct detection. Owing to their unique properties of two-dimensional electron gas (2DEG), HEMT biosensors have the ability to amplify current changes pertinent to potential changes with the introduction of any biomolecules, making them highly surface charge sensitive. This review discusses the recent advances in the use of AlGaN/GaN and AlGaAs/GaAs HEMT as biosensors in the context of different gate architectures. We describe the fundamental mechanisms underlying their operational functions, giving insight into crucial experiments as well as the necessary analysis and validation of data. Surface functionalization and biorecognition integrated into the HEMT gate structures, including self-assembly strategies, are also presented in this review, with relevant and promising applications discussed for ultra-sensitive biosensors. Obstacles and opportunities for possible optimization are also surveyed. Conclusively, future prospects for further development and applications are discussed. This review is instructive for researchers who are new to this field as well as being informative for those who work in related fields. [ABSTRACT FROM AUTHOR]

Electric dipoles at a metal-gate/Al2O3 interface are found to control the current conduction in negatively biased Al2O3 metal-insulator-semiconductor (MIS) capacitors by effectively increasing the Al2O3 electron affinity near the gate and thereby reducing the barrier height against electron field emission from the gate. By carrying out space-charge-controlled field emission analysis, the Al2O3 effective electron affinity in Al-gate capacitors was found to be larger than that for the Au gate by 0.38 eV, and the value for the Ni gate was similar to that for the Au gate. The cross-sectional transmission-electron-microscope images of the samples revealed the presence of an approximately 3-nm-thick layer intervening between the Al gate and the Al2O3 film. This layer is likely to have formed Al/Al2O3 interfacial dipoles that caused the aforementioned shift of the Al2O3 effective electron affinity. It was also confirmed that the conventional Fowler–Nordheim tunneling analysis yields remarkably erroneous results under the presence of these dipoles. These findings not only form the basis for investigating the band alignment of metal-gate MIS capacitors, but also alert us to a possibility of unexpectedly large leakage currents in negatively biased metal-gate MIS field-effect transistors. [ABSTRACT FROM AUTHOR]

To accurately analyze the deep states at the insulator/wide-bandgap semiconductor interface, this study reassessed and improved the conventional photoassisted capacitance–voltage (PACV) method. First, as previously pointed out, the illumination time under depletion should be long enough that the voltage shift caused by interface-state depopulation (in n-type semiconductors) saturates. Excessive illumination, however, causes insulator charging, thereby apparently increasing estimated values. To solve this problem, this study proposes to measure reference characteristics just after postillumination ones. Secondly, the postillumination measurements should be started without delay after turning off the light or may be carried out with the samples being illuminated. Thirdly, the depletion should be deep enough that the magnitude of band bending in the substrate at the beginning of the postillumination measurements is larger than 1 V. This guideline considerably relaxes a previous one that required a band bending of bandgap or larger. Furthermore, this study developed a method for compensating the interface-state depopulation (in n-type) during the reference measurements, in which the depopulation causes the so-called stretch-out. The results thus obtained from an Al/Al2O3/GaN capacitor agreed fairly well with those by a recently developed transient photoassisted capacitance method, supporting the validity of both methods. Being less sensitive to the gate-insulator charging, the advanced PACV method developed here has an advantage over the transient method and, therefore, will help advance the technology for fabricating high-performance, high-reliability insulator/wide-bandgap semiconductor insulators. [ABSTRACT FROM AUTHOR]

This paper presents reduced dislocation of the AlGaN/GaN heterostructure for high-voltage lateral high-electron-mobility transistor (HEMT) devices. AlGaN/GaN heterostructure was grown on sapphire substrate. Prior to the growth of the AlGaN layer, the GaN layer was grown via two-step growth. In the first step, the V/III ratio was applied at 1902 and then at 3046 in the second step. The FWHMs of the XRD (002) and (102) peaks of the GaN layer were around 205 arcsec ((002) peak) and 277 arcsec ((102) peak). Moreover, the surface of the GaN layer showed clear evidence of step flows, which resulted in the smooth surface of the layer as well as the overgrown of the AlGaN layer. Subsequently, the AlGaN/GaN heterostructure was fabricated into a lateral HEMT with wide gate-to-drain length (LGD). The device exhibited a clear working HEMT characteristic with high breakdown voltages up to 497 V. In comparison to many reported AlGaN/GaN HEMTs, no AlGaN interlayer was inserted in our AlGaN/GaN heterostructure. By improving the growth conditions for the two-step growth, the performance of AlGaN/GaN HEMTs could be improved further. [ABSTRACT FROM AUTHOR]

The emergence of gallium nitride high-electron-mobility transistor (GaN HEMT) devices has the potential to deliver high power and high frequency with performances surpassing mainstream silicon and other advanced semiconductor field-effect transistor (FET) technologies. Nevertheless, HEMT devices suffer from certain parasitic and reliability concerns that limit their performance. This paper aims to review the latest experimental evidence regarding HEMT technologies on the parasitic issues that affect aluminum gallium nitride (AlGaN)/GaN HEMTs. The first part of this review provides a brief introduction to AlGaN/GaN HEMT technologies, and the second part outlines the challenges often faced during HEMT fabrication, such as normally-on operation, self-heating effects, current collapse, peak electric field distribution, gate leakages, and high ohmic contact resistance. Finally, a number of effective approaches to enhancing the device's performance are addressed. [ABSTRACT FROM AUTHOR]

Recently, there has been increasing interest in electrochemical printed sensors for a wide range of applications such as biomedical, pharmaceutical, food safety, and environmental fields. A major challenge is to obtain selective, sensitive, and reliable sensing platforms that can meet the stringent performance requirements of these application areas. Two-dimensional (2D) nanomaterials advances have accelerated the performance of electrochemical sensors towards more practical approaches. This review discusses the recent development of electrochemical printed sensors, with emphasis on the integration of non-carbon 2D materials as sensing platforms. A brief introduction to printed electrochemical sensors and electrochemical technique analysis are presented in the first section of this review. Subsequently, sensor surface functionalization and modification techniques including drop-casting, electrodeposition, and printing of functional ink are discussed. In the next section, we review recent insights into novel fabrication methodologies, electrochemical techniques, and sensors' performances of the most used transition metal dichalcogenides materials (such as MoS2, MoSe2, and WS2), MXenes, and hexagonal boron-nitride (hBN). Finally, the challenges that are faced by electrochemical printed sensors are highlighted in the conclusion. This review is not only useful to provide insights for researchers that are currently working in the related area, but also instructive to the ones new to this field. [ABSTRACT FROM AUTHOR]

A new generation of high-efficiency power devices is being developed using wide bandgap (WBG) semiconductors, like GaN and SiC, which are emerging as attractive alternatives to silicon. The recent interest in GaN has been piqued by its excellent material characteristics, including its high critical electric field, high saturation velocity, high electron mobility, and outstanding thermal stability. Therefore, the superior performance is represented by GaN-based high electron mobility transistor (HEMT) devices. They can perform at higher currents, voltages, temperatures, and frequencies, making them suitable devices for the next generation of high-efficiency power converter applications, including electric vehicles, phone chargers, renewable energy, and data centers. Thus, this review article will provide a basic overview of the various technological and scientific elements of the current GaN HEMTs technology. First, the present advancements in the GaN market and its primary application areas are briefly summarized. After that, the GaN is compared with other devices, and the GaN HEMT device's operational material properties with different heterostructures are discussed. Then, the normally-off GaN HEMT technology with their different types are considered, especially on the recessed gate metal insulator semiconductor high electron mobility transistor (MISHEMT) and p-GaN. Hereafter, this review also discusses the reliability concerns of the GaN HEMT which are caused by trap effects like a drain, gate lag, and current collapse with numerous types of degradation. Eventually, the breakdown voltage of the GaN HEMT with some challenges has been studied. [ABSTRACT FROM AUTHOR]

Understanding the electrical contact properties of carbon nanotube (CNT) ends is important to use the high conductance of CNTs in the CNT on-axis direction in applications such as through-silicon via structures. In this study, we experimentally evaluated the contact resistivity between single-/multi-walled CNT ends and a metal nanoprobe using conductive atomic force microscopy (C-AFM). To validate the measured end contact resistivity, we compared our experimentally determined value with that obtained from numerical calculations and reported values for side contact resistivity. The contact resistivity normalized by the length of the CNT ends was 0.6–2.4 × 106 Ω nm for single-walled CNTs. This range is 1–2 orders of magnitude higher than that determined theoretically. The contact resistivity of a single-walled CNT end with metal normalized by the contact area was 2–3 orders of magnitude lower than that reported for the resistivity of a CNT sidewall/metal contact. For multi-walled CNTs, the measured contact resistivity was one order of magnitude higher than that of a CNT forest grown by remote plasma-enhanced chemical vapor deposition, whereas the contact resistivity of a top metal electrode was similar to that obtained for a single-walled CNT forest. [ABSTRACT FROM AUTHOR]

Atomic-layer-deposited (ALD) Al2O3 films are the most promising surface passivation and gate insulation layers in non-Si semiconductor devices. Here, we carried out an extensive study on the time-dependent dielectric breakdown characteristics of ALD-Al2O3 films formed on homo-epitaxial GaN substrates using two different oxidants at two different ALD temperatures. The breakdown times were approximated by Weibull distributions with average shape parameters of 8 or larger. These values are reasonably consistent with percolation theory predictions and are sufficiently large to neglect the wear-out lifetime distribution in assessing the long-term reliability of the Al2O3 films. The 63% lifetime of the Al2O3 films increases exponentially with a decreasing field, as observed in thermally grown SiO2 films at low fields. This exponential relationship disproves the correlation between the lifetime and the leakage current. Additionally, the lifetime decreases with measurement temperature with the most remarkable reduction observed in high-temperature (450 °C) O3-grown films. This result agrees with that from a previous study, thereby ruling out high-temperature O3 ALD as a gate insulation process. When compared at 200 °C under an equivalent SiO2 field of 4MV/cm, which is a design guideline for thermal SiO2 on Si, high-temperature H2O-grown Al2O3 films have the longest lifetimes, uniquely achieving the reliability target of 20 years. However, this target is accomplished by a relatively narrow margin and, therefore, improvements in the lifetime are expected to be made, along with efforts to decrease the density of extrinsic Al2O3 defects, if any, to promote the practical use of ALD Al2O3 films. [ABSTRACT FROM AUTHOR]

Face recognition is one of the most sophisticated disciplines of biometric systems. The use of VCSEL in automotive applications is one of the most recent advances. The existing VCSEL package with a diffuser on top of a lens intended for automotive applications could not satisfy the criteria of the automotive TS16949: 2009 specification because the package was harmed and developed a lens fracture during 100 thermal cycle tests. In order to complete a cycle, the temperature rises from −40 °C to 150 °C and then rises again from 150 °C to 260 °C. The package then needs to be tested 500 times to ensure it fits the requirements without failing in terms of appearance or functionality. To this extent, the goal of this research is to develop packaging for 1 mm2 VCSEL chips with a diffuser on top that prevents fractures or damage to the package during heat cycle testing with multiple materials. The package was created using the applications SolidWorks 2017 and AutoCAD Mechanical 2017. The ANSYS Mechanical Structural FEA Analysis program simulated all packages for mechanical stress to guarantee that all packages generated were resilient to high temperature conditions. All packages exhibit no abnormalities and are robust for various temperatures ranging from low to high. Therefore, these packaged 1 mm2 VCSEL chips with a diffuser on top provide an effective approach for the application of VCSEL suitable in high temperature conditions. [ABSTRACT FROM AUTHOR]

A novel method to fabricate the oxidized silicon-terminated (C–Si–O) diamond metal-oxide-semi- conductor field-effect transistors (MOSFETs) by replacing the retained SiO2 masks with an atomic layer deposition (ALD)-Al2O3 film as the main gate insulator was proposed for the first time. Compositional analysis across the SiO2 masks and on the air-exposed C–Si–O (111) diamond surface has been carried out by utilizing secondary ion mass spectroscopy (SIMS) and Auger electron spectroscopy (AES) techniques, respectively. Furthermore, we revealed that, under selectively epitaxial growth of diamond through a SiO2 mask, a carbon-rich film was formed on SiO2 and C–Si bonding was realized at the SiO2/(111) diamond interface. The fabricated device with a source and drain distance (${L}_{SD}$) of $3 \,\mu \text{m}$ exhibits a distinct threshold voltage (${V}_{TH}$) of −5.6 V and a maximum drain current density (${I}_{D\_{}{MAX}}$) up to −311 mA/mm, which is a record value among normally-off single-crystalline diamond MOSFETs to date. In the case of having ALD-Al2O3 as the main gate insulator, normally-off operation of the C–Si–O diamond MOSFETs has a stark contrast with the typically normally-on performance of the hydrogen-terminated (C–H) diamond MOSFETs, which is mainly due to the smaller negative electron affinity of C–Si–O diamond compared with that of C–H diamond. These results indicate that the proposed C–Si–O (111) diamond MOSFETs with excellent normally-off operation and large drain current density are promising to fulfill the requirements of fail-safe and current drive capabilities in power device applications. [ABSTRACT FROM AUTHOR]