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Empirical studies have emphasized that the equity implied volatility is characterized by a negative skew inversely proportional to the square root of the time-to-maturity. We examine the short-time-to-maturity behavior of the implied volatility smile for pure jump exponential additive processes. An excellent calibration of the equity volatility surfaces has been achieved by a class of these additive processes with power-law scaling. The two power-law scaling parameters are β , related to the variance of jumps, and δ , related to the smile asymmetry. It has been observed, in option market data, that β = 1 and δ = - 1 / 2 . In this paper, we prove that the implied volatility of these additive processes is consistent, in the short-time, with the equity market empirical characteristics if and only if β = 1 and δ = - 1 / 2 . [ABSTRACT FROM AUTHOR]

It is of great importance to predict the reliability of long lifetime electric devices. In a previous work, an adaptive Bayesian estimator is proposed to predict the reliability of such kind of devices based on sequential experiments. However, there is no general method to establish consistency of the estimator. In this paper, we focus on this adaptive Bayesian method with sequential design. Under some mild assumptions, we obtain the consistency of the estimator. [ABSTRACT FROM AUTHOR]

Three-dimensional printing is a useful and common process in additive manufacturing nowadays. The advantage of additive polymer technology is its rapidity and design freedom. Polymer materials' mechanical properties depend on the process parameters and the chemical composition of the polymer used. Mechanical properties are very important in product applicability. The mechanical properties of polymers can be enhanced by heat treatment. Additive-manufactured PLA's mechanical properties and structure can be modified via heat treatment after the 3D printing process. The goal of this research was to test the effect of heat treatment on the mechanical and structural parameters of additive-manufactured PLA. This was achieved via the FDM processing of standard PLA tensile test specimens with longitudinal and vertical printing orientations. After printing, the test specimens were heat-treated at 55 °C, 65 °C and 80 °C for 5 h and after being held at 20 °C for 15 h. The printed and heat-treated specimens were tested using tensile tests and microscopy. Based on the test results, we can conclude that the optimal heat treatment process temperature was 65 °C for 5 h. Under the heat treatment, the test specimens did not show any deformation, the tensile strength increased by 35% and the porosity of the PLA structure decreased. [ABSTRACT FROM AUTHOR]

In this paper, we present a very fast Monte Carlo scheme for additive processes: the computational time is of the same order of magnitude of standard algorithms for simulating Brownian motions. We analyze in detail numerical error sources and propose a technique that reduces the two major sources of error. We also compare our results with a benchmark method: the jump simulation with Gaussian approximation. We show an application to additive normal tempered stable processes, a class of additive processes that calibrates “exactly” the implied volatility surface. Numerical results are relevant. This fast algorithm is also an accurate tool for pricing path-dependent discretely-monitoring options with errors of one basis point or below. [ABSTRACT FROM AUTHOR]

We introduce a simple additive process for equity index derivatives. The model generalizes Lévy Normal Tempered Stable processes (e.g. NIG and VG) with time-dependent parameters. It accurately fits the equity index volatility surfaces in the whole time range of quoted instruments, including options with small time-horizon (days) and long time-horizon (years). We introduce the model via its characteristic function. This allows using classical Fourier pricing techniques. We discuss the calibration issues in detail and we show that, in terms of mean squared error, calibration is on average two orders of magnitude better than both Lévy and Sato processes alternatives. We show that even if the model loses the classical stationarity property of Lévy processes, it presents interesting scaling properties for the calibrated parameters. [ABSTRACT FROM AUTHOR]

In a series of interviews with Clelia Tuscano in the 1990s, Giancarlo De Carlo revealed his admiration for Aldo van Eyck and the influence the Dutch architect had on him. Albeit starting with a disagreement during the Congrès Internationaux d'Architecture Moderne (Ciam) that took place in Otterlo in 1959, the relationship between the two will subsequently evolve in a crescendo of mutual esteem and exchange, until reaching a sort of ideal mutual understanding that will strengthen one of the most oriented lines of research within the variegated Team 10 group. The central issue into which the two architects channelled most of the energies they spent at the international level responded to the challenges posed by mass society, or to what has been called ‘architecture of the great number’. This theme acquired international relevance within the Ciam, starting with the success of the North African grids presented at Ciam IX (1953), including the one emblematically titled “L’habitat du plus grand nombre”, and then accompanied the evolution of Team 10 until the XIV Triennale di Milano (1968), dedicated to the “Grande numero”. This essay is grounded on the consideration that, in De Carlo’s architectural evolution, there is a before and an after Otterlo ‘59, a real ‘turning point’, not only because from then on the Italian architect became one of the main protagonists of Team 10, expanding the range of his design tools, but also on account of the theoretical and design potential that the event unleashed in the imagination of the attendees.

We prove characterizations of positive dependence for a general class of timeinhomogeneous Markov processes called Feller evolution processes (FEPs) and for jump-FEPs. General FEPs can be analyzed through their time and state-space dependent (extended) generators. We will use the time and state-space dependent (extended) generators and time and state-space dependent Lévy measures to characterize the positive dependence of general FEPs and jump-FEPs, respectively. We conclude with applications of these results to additive processes, which are timeinhomogeneous Lévy processes, often arising as useful examples in financial modeling. [ABSTRACT FROM AUTHOR]

• A conductive polythiophene composite film containing copper and silver is formed. • Cu/Ag-PT film serves as seed layer to directly electrodeposit on insulating substrate. • A multi-dimensional conductive pattern is obtained by Cu/Ag-PT direct electroplating. Conductive polymer direct electroplating technology is one of the research hotspots in printed circuit board manufacturing. In this work, we designed a simple, efficient and environmental friendly chemical polymerization method to form a conductive polymer-based metal-mixed composite film where the polymer was polythiophene and the metals included copper and silver (PT-based Cu/Ag composite film). The work function of the PT-based Cu/Ag composite film decreased from 4.822 eV of pure PT to 4.638 eV, which serves as a seed layer to prepare conductive circuits by the additive process. The method without the metal etching and photolithography steps solves the problems of conventional subtractive processes for forming conductive patterns. Besides, the PT-based Cu/Ag composite film is able to increase the roughness of the substrate to improve the bonding force between the electroplated copper layer and the substrate. Moreover, due to the particularity of oxidation solution for preparing the PT-based Cu/Ag composite film, conductive lines and patterns can be selectively formed on insulating substrate with arbitrary shapes by the additive process. [Display omitted] [ABSTRACT FROM AUTHOR]

Highlights • The robust copper patterns were fabricated by selective activation of substrate and subsequent electroless deposition. • The deposition copper lines show outstanding conductivity due to remarkable crystallinity and dense copper grains. • Conductive patterns show excellent fatigue resistance after repetitive bending. • The smooth deposition copper lines may attenuate the signal loss at high frequency region. Abstract In this work, selective surface activation by means of an alkaline reagent and silver-ion catalyst precursor is proposed for fabricating adhesion-enhanced and fatigue-resistant copper patterns on polyimide (PI) film through electroless deposition (ELD). Results from peel strength measurements and cyclical bending tests demonstrate that the deposited copper patterns are holding significantly enhanced adhesion strength over PI substrate. Meanwhile, a low resistivity of 2.82 × 10−6 Ω cm, i.e. 1.6 times of the value for the bulk copper is obtained by this approach combined with related parameters optimization. Analyses based on morphological and elemental characterizations indicate that the excellent conductive and mechanical features of the copper patterns are resulted from elevated crystallinity and highly densified metallic grains. Graphical abstract Image, graphical abstract [ABSTRACT FROM AUTHOR]

The fractional nonhomogeneous Poisson process was introduced by a time change of the nonhomogeneous Poisson process with the inverse α -stable subordinator. We propose a similar definition for the (nonhomogeneous) fractional compound Poisson process. We give both finite-dimensional and functional limit theorems for the fractional nonhomogeneous Poisson process and the fractional compound Poisson process. The results are derived by using martingale methods, regular variation properties and Anscombe's theorem. Eventually, some of the limit results are verified in a Monte Carlo simulation. [ABSTRACT FROM AUTHOR]

In this article, we proved that, under weak and natural requirements, uncorrelated scattering (in particular WSSUS) channels can be modeled as stochastic integrals. Moreover, if we assume (not only uncorrelated but also) independent scattering, then the stochastic integral kernel is an additive stochastic process. This allows us to decompose an IS channel into a sum of independent channels; one deterministic, one with a Gaussian kernel, and two others described by the Levy measure of the additive process. [ABSTRACT FROM AUTHOR]

We study the processes of additive formation of spherically shaped rigid bodies due to the uniform accretion of additional matter to their surface in an arbitrary centrally symmetric force field. A special case of such a field can be the gravitational or electrostatic force field. We consider the elastic deformation of the formed body. The body is assumed to be isotropic with elasticmoduli arbitrarily varying along the radial coordinate.We assume that arbitrary initial circular stresses can arise in the additional material added to the body in the process of its formation. In the framework of linear mechanics of growing bodies, the mathematical model of the processes under study is constructed in the quasistatic approximation. The boundary value problems describing the development of stress--strain state of the object under study before the beginning of the process and during the entire process of its formation are posed. The closed analytic solutions of the posed problems are constructed by quadratures for some general types of material inhomogeneity. Important typical characteristics of the mechanical behavior of spherical bodies additively formed in the central force field are revealed. These characteristics substantially distinguish such bodies from the already completely composed bodies similar in dimensions and properties which are placed in the force field and are described by problems of mechanics of deformable solids in the classical statement disregarding the mechanical aspects of additive processes. [ABSTRACT FROM AUTHOR]

Dilative stability generalizes the property of selfsimilarity for infinitely divisible stochastic processes by introducing an additional scaling in the convolution exponent. Inspired by results of Iglói (2008), we will show how dilatively stable processes with independent increments can be represented by integrals with respect to time-changed Lévy processes. Via a Lamperti-type transformation these representations are shown to be closely connected to translatively stable processes of Ornstein–Uhlenbeck-type, where translative stability generalizes the notion of stationarity. The presented results complement corresponding representations for selfsimilar processes with independent increments known from the literature. [ABSTRACT FROM AUTHOR]

We consider a class of multi-type particle systems whose structure is similar to that of a contact process and show that additivity is equivalent to the existence of a dual process, extending a result of Harris. We prove a necessary and sufficient condition for the model to preserve positive correlations. We then show that complete convergence on Zd holds for a large subclass of models including the two-stage contact process and a household model, and give examples. [ABSTRACT FROM AUTHOR]

This article discusses: model of the two-link mechanism; generalized scheme of mechatronic simulation model of 3D-printer with the positioning units of electric DC; mathematical model of the actuator of the printer unit in the form of a system of differential equations; 3D-printer programming model implemented in the Matlab-Simulink environment using the c standard library blocks and SimMechanics library; virtual (animated) 3D printer model on the basis of the library Simulink 3D Animation, supports the visualization of the movements of the designed mechanism of the basic units. We present the initial data and the results of simulation of 3D-printer type Scara as a waveform positioning actuator (extruder) in the manufacture of test items by fusing plastic.

For any strictly positive martingale S = ex for which X has a characteristic function, we provide an expansion for the implied volatility. This expansion is explicit in the sense that it involves no integrals, but only polynomials in the log-strike. We illustrate the versatility of our expansion by computing the approximate implied volatility smile in three well-known martingale models: one finite activity exponential Levy model, Merton (1976), one infinite activity exponential Levy model (variance gamma), and one stochastic volatility model, Heston (1993). Finally, we illustrate how our expansion can be used to perform a model-free calibration of the empirically observed implied volatility surface. [ABSTRACT FROM AUTHOR]

Shape idealization transformations are very common operations when adapting a CAD component to FEA requirements. Here, an idealization approach is proposed that is based on generative shape processes used to decompose an initial B-Rep solid, i.e., extrusion processes with material addition are used to segment a solid. The corresponding extrusion primitives form the basis of candidate sub-domains for idealization and their connections conveyed through the generative processes they belong to, bringing robustness to set up the appropriate connections between idealized sub-domains. This is made possible because the connections between extrusion primitives have an explicit geometric representation and can be used to bound the connections between idealized sub-domains. Taking advantage of an existing construction tree as available in a CAD software does not help much because it may be complicated to use it for idealization processes because this tree structure is not unique. Using generative processes attached to an object that is no longer reduced to a single construction tree but to a graph containing all non-trivial construction trees, is more useful for the engineer to evaluate variants of idealization. From this automated decomposition, each primitive is subjected to a morphological analysis to define whether it can idealized or not. Subsequently, geometric interfaces between primitives form also a graph that can be used to process the connections between the idealized sub-domains generated from the primitives. These interfaces are taken into account to determine more precisely the idealizable sub-domains and their contours when primitives are incrementally merged to come back to produce the global morphological analysis of the initial object. A user-defined threshold is used to tune the morphological analysis with respect to further user parameters. Finally, the idealizable sub-domains and their connections are processed to locate the mid-surfaces and connect them using generic criteria that the user can tune locally using complementary criteria. [ABSTRACT FROM AUTHOR]

Research is devoted to the music of contemporary composer Philip Glass, which he wrote specifically for the movies including feature and documentary films by American, British and Australian directors (M.Scorsese, E.Morris, S.Daldry, P.Weir etc.). It makes a connection of the composition technologies between his filmmusic and his artmusic written in the aesthetics of minimalism (the repetition and additive processes). The works in collaboration with director G.Reggio highlights as top Glass’ creative at the film industry. It also covers the principles of compilation the composer’s music for a variety of screen opuses, movies and commercials.

[Display omitted] • An additive method of metallization skipping the step of preparing bridging layers. • Aldehyde groups were formed to reduce silver ammonia ion to Ag particles. • Metallic silver was in-situ generated in the substrate for electroless plating. • Customized circuit patterns were printed with the via of computer programs. • The deposited copper layer exhibits lower roughness with low resistivity of 3.83 × 10-6 Ω·cm. In this paper, a facile method of fully additive process to manufacture copper lines on flexible polyimide (PI) substrates was developed. The selective modification on film, involving silver ammonia solution and plasma treatment, was performed to produce Ag particles that catalyze electroless copper plating. It was found that reductive aldehyde groups (R-CHO) were generated at the treated PI surface to reduce silver ammonia ion to Ag particles, which is supported by the of chemical and morphological characterizations. The obtained solid copper deposition demonstrates highly reliable features including limited oxidation, lower roughness and compact crystalline grain with low resistivity of 3.83 × 10-6 Ω·cm. The practical fabricated flexible circuits with designed pattern have passed the mechanical and electrical property tests, confirming the compatibility of the developed additive method with the flexible PI substrate. [ABSTRACT FROM AUTHOR]

Abstract: For Gaussian random fields defined as additive processes based on standard Brownian motions and Brownian bridges, we find their Karhunen–Loève expansions and make connections with related mean centered processes in distribution. Moreover, Pythagorean type distribution identities are established for additive Brownian motions and Brownian bridges. As applications, the corresponding Laplace transform and small deviation estimates are given. [Copyright &y& Elsevier]

Abstract: A microneedle is a three-dimensional (3D) micromechanical structure and has been in the spotlight recently as a drug delivery system (DDS). Because a microneedle delivers the target drug after penetrating the skin barrier, the therapeutic effects of microneedles proceed from its 3D structural geometry. Various types of microneedles have been fabricated using subtractive micromanufacturing methods which are based on the inherently planar two-dimensional (2D) geometries. However, traditional subtractive processes are limited for flexible structural microneedles and makes functional biomedical applications for efficient drug delivery difficult. The authors of the present study propose drawing lithography as a unique additive process for the fabrication of a microneedle directly from 2D planar substrates, thus overcoming a subtractive process shortcoming. The present article provides the first overview of the principal drawing lithography technology: fundamentals and biomedical applications. The continuous drawing technique for an ultrahigh-aspect ratio (UHAR) hollow microneedle, stepwise controlled drawing technique for a dissolving microneedle, and drawing technique with antidromic isolation for a hybrid electro-microneedle (HEM) are reviewed, and efficient biomedical applications by drawing lithography-mediated microneedles as an innovative drug and gene delivery system are described. Drawing lithography herein can provide a great breakthrough in the development of materials science and biotechnology. [Copyright &y& Elsevier]

In this paper, we will consider exponential additive processes as a financial market model. Under a mild condition, we will determine the minimal entropy martingale measures (MEMMs) for the exponential additive processes. To this end, we will prepare several results on the exponential moment of additive processes and integrals based on them. As an application of our result, we will deduce optimal strategy for exponential utility maximization problem. We will also investigate our result through several examples, such as time-dependent versions of double Poisson model, Merton model and Kou model. [ABSTRACT FROM AUTHOR]

We study the tail behavior of regularly varying infinitely divisible random vectors and additive processes, i.e. stochastic processes with independent but not necessarily stationary increments. We show that the distribution of an infinitely divisible random vector is tail equivalent to its Lévy measure and we study the asymptotic decay of the probability for an additive process to hit sets far away from the origin. The results are extensions of known univariate results to the multivariate setting; we exemplify some of the difficulties that arise in the multivariate case. [ABSTRACT FROM AUTHOR]

We consider risk processes that locally behave like Brownian motion with some drift and variance, these both depending on an underlying Markov chain that is also used to generate the claims arrival process. Thus, claims arrive according to a renewal process with waiting times of phase type. Positive claims (downward jumps) are always possible but negative claims (upward jumps) are also allowed. The claims are assumed to form an independent, identically distributed sequence, independent of everything else. As main results, the joint Laplace transform of the time to ruin and the undershoot at ruin, as well as the probability of ruin, are explicitly determined under the assumption that the Laplace transform of the positive claims is a rational function. Both the joint Laplace transform and the ruin probability are decomposed according to the type of ruin: ruin by jump or ruin by continuity. The methods used involve finding certain martingales by first finding partial eigenfunctions for the generator of the Markov process composed of the risk process and the underlying Markov chain. We also use certain results from complex function theory as important tools. [ABSTRACT FROM AUTHOR]

To solve the problems of a conventional subtractive process for preparing conductive circuits, numerous alternative additive processes have been investigated, such as screen or inkjet printing, selective electroless plating, laser-induced forward transfer, etc. They all lead to a simpler procedure, less pollution, and finer line width but are still faced with difficulties like low conductivity and thickness, poor adhesion, and high cost. PDMS is a kind of material with low surface energy, leading to low adhesion with adhesive. Under these circumstances, a simple template transfer process for additively preparing conductive circuits is reported. The process to form the template includes the preparation of a photolithographic mask on the carrier copper foil and adsorption of PDMS anti-adhesion coating. Followed by metal deposition through electroplating on the template, the conductive circuits are transferred to the target substrate. Thus, the designed conductive circuits on various substrates including paper and cloth are formed. The template can be used again after being reimmersed into PDMS anti-adhesion coating. The components and the concentration of the coating are carefully discussed, and the mechanism of anti-adhesion is also researched by EIS and XPS. The copper circuits show a line width of 10 μm, a peeling strength of 7.11 N/cm, and a resistivity of 1.93 μΩ·cm, which is similar to that of bulk copper. With low pollution and cost, high versatility, and good electrical and adhesion performance, the template transfer process shows a good application prospect in the large-scale production of flexible electronics like sensors, RFID tags, etc.