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Solid state semiconductor based neutron detectors have the potential to be energy efficient and compact, making them suitable for applications where low power consumption and size constraints are important considerations. Herein, neutron detection devices based on PIN structures consisting of BGaN/GaN superlattice (SL) are demonstrated. These SL structures enable to incorporate significant boron (B) content and achieve good crystalline quality epilayers crucial for better neutron detection. Further, by leveraging the built‐in electric field generated by the PIN structure, these devices can be operated without any applied bias, simplifying overall operation and enabling a more compact size system for detection. Their performance is evaluated by measuring real‐time current response under neutron irradiation (IN) and without it (ID). The neutron induced current density (ΔJ = JN − JD) is determined, reaching an impressive value of 0.67 pA cm−2 (two times JD) under thermal neutron flux of 1.2 × 104 n cm−2 s−1 without biasing, demonstrating their self‐powered capability. They exhibit a linear response to varying thermal neutron flux levels. Additionally, the detectors successfully detect low thermal neutron fluxes down to 300 n cm−2 s−1, showcasing their potential for diverse applications, including in low neutron environments, screening nuclear warheads, and preventing illegal trafficking of radiological materials. [ABSTRACT FROM AUTHOR]

The detection of hydrogen in the Earth's deep underground poses a major challenge due to the lack of oxygen and continuous changes in environmental conditions. An innovative class of hydrogen gas sensors based on AlGaN/GaN High Electron Mobility Transistors (HEMTs) with Platinum (Pt) gates as a functionalization layer, has been developed and optimized for geo-sensing. The study investigated the sensor characteristics using two carrier gases to simulate underground conditions, namely air (with 20 % O 2) and N 2 (with 0 % O 2), across a range of temperatures from 50 °C to 300 °C and with hydrogen concentrations varying from 25 ppm to 400 ppm. The detection limit was found to be approximately 1 ppm of hydrogen in the atmospheric air. The gas sensor transduction is based on the modification of the conductivity of a 2-Dimensional Electron Gas (2DEG). In this study, the principle was investigated using two gases, O 2 and H 2 , with different electronegativities relative to platinum. The adsorption competition between H 2 and O 2 on platinum was evaluated, and this allowed the calculation of the ratio of thermodynamic adsorption constants between these two gases. • Investigated the Pt-AlGaN/GaN HEMT-based sensor for detecting underground H 2 gas using N 2 and air as carrier gases. • Key parameters for hydrogen sensing included the effects of temperature and hydrogen concentration. • Demonstrated that hydrogen has 2000 times greater affinity than O 2 with the Pt-AlGaN/GaN sensor functional layer. • Presented and comprehensively explained the adsorption kinetics of hydrogen with the Pt functional layer. [ABSTRACT FROM AUTHOR]

We report an AlGaN/GaN HEMT gas sensor designed to enable NO, NO2, and NH3 detection from 100 °C–400 °C over a large concentration range. Device modeling is performed to optimize several HEMT device parameters for sensing, and the experimental results show that the optimized sensor has improved performance compared with the previously reported HEMT sensors. The device shows significant no sensitivity for the first time in an HEMT device, with sensitivity up to 7% at 400 °C. In addition, high sensitivities of up to 17% are reported for NO2, and NH3 is detected at concentrations as low as 150 ppb. [ABSTRACT FROM PUBLISHER]

We report improved sensitivity to NO, NO2 and NH3 gas with specially-designed AlGaN/GaN high electron mobility transistors (HEMT) that are suitable for operation in the harsh environment of diesel exhaust systems. The gate of the HEMT device is functionalized using a Pt catalyst for gas detection. We found that the performance of the sensors is enhanced at a temperature of 600 °C, and the measured sensitivity to 900 ppm-NO, 900 ppm-NO2 and 15 ppm-NH3 is 24%, 38.5% and 33%, respectively, at 600 °C. We also report dynamic response times as fast as 1 s for these three gases. Together, these results indicate that HEMT sensors could be used in a harsh environment with the ability to control an anti-pollution system in real time. [ABSTRACT FROM AUTHOR]

Reliable p-doped hexagonal boron nitride (h-BN) could enable wide bandgap optoelectronic devices such as deep ultra-violet light emitting diodes (UV LEDs), solar blind photodiodes and neutron detectors. We report the study of Mg in h-BN layers as well as Mg h-BN/AlGaN heterostructures. Mg incorporation in h-BN was studied under different biscyclopentadienyl-magnesium (Cp2Mg) molar flow rates. 2θ-ω x-ray diffraction scans clearly evidence a single peak, corresponding to the (002) reflection plane of h-BN with a full-width half maximum increasing with Mg incorporation in h-BN. For a large range of Cp2Mg molar flow rates, the surface of Mg doped h-BN layers exhibited characteristic pleats, confirming that Mg doped h-BN remains layered. Secondary ion mass spectrometry analysis showed Mg incorporation, up to 4 × 1018 /cm3 in h-BN. Electrical conductivity of Mg h-BN increased with increased Mg-doping. Heterostructures of Mg h-BN grown on n-type Al rich AlGaN (58% Al content) were made with the intent of forming a p-n heterojunction. The I-V characteristics revealed rectifying behavior for temperatures from 123 to 423 K. Under ultraviolet illumination, photocurrent was generated, as is typical for p-n diodes. C-V measurements evidence a built-in potential of 3.89 V. These encouraging results can indicate p-type behavior, opening a pathway for a new class of wide bandgap p-type layers. [ABSTRACT FROM AUTHOR]

The mechanical release of III‐nitride devices using h‐BN is a promising approach for heterogeneous integration. Upscaling this technology for industrial level requires solutions that allow a simple pick‐and‐place technique of selected devices for integration while preserving device performance. An advance that satisfies both of these requirements is demonstrated in this work. It is based on a lateral control of the h‐BN quality, using patterned sapphire with a SiO2 mask, to achieve localized van der Waals epitaxy of high‐quality GaN based device structures. After process fabrication, the devices can be individually picked and placed on a foreign substrate without the need for a dicing step. In addition, this approach could reduce delamination of h‐BN on large diameter substrates because each h‐BN region is smaller, with independent device structures. Discrete InGaN LEDs on h‐BN are grown and fabricated on 2 in. patterned sapphire using a SiO2 mask. A set of devices are selectively released and transferred to flexible aluminum tape. The transferred LEDs exhibit blue light emission around 435 nm. The approach presented here is scalable on any wafer size, can be applied to other types of nitride‐based devices, and can be compatible with commercial pick‐and‐place handlers for mass production. [ABSTRACT FROM AUTHOR]

Highlights from the article: Keywords: 2D boron nitride; core/shell nanostructures; flexible electronics; nanorods; semiconductors; van der Waals epitaxy In article number 1900207, Suresh Sundaram, Abdallah Ougazzaden, and co-workers demonstrate self-organized GaN nanorods formation on layered h-BN templates by van der Waals epitaxial growth. Nanorods, semiconductors, flexible electronics, core/shell nanostructures, van der Waals epitaxy, 2D boron nitride.

Hexagonal boron nitride (h‐BN) is a promising 2D template that decouples substrate effects from the layer above it by van der Waals epitaxy, because there are only weak forces out of the h‐BN. It also permits convenient mechanical transfer of devices grown on their surface to an appropriate substrate. Here, van der Waals epitaxial growth resulting in the formation of self‐organized GaN nanorods on h‐BN templates is demonstrated. This approach to the growth of III‐N nanostructures avoids transfer processes and scaling issues seen with other 2D materials, since both the 1D (GaN nanorods) and 2D (h‐BN) are grown at the wafer‐scale and in one growth run. Further, this process is used to grow vertical core–shell p‐GaN/InGaN/n‐GaN nano‐PIN device structures on wafer‐scale 2D h‐BN on sapphire and silicon substrates. The high quality of the core–shell nanostructures is confirmed by detailed electron microscopy study, which gives more insight into the nanorod formation mechanism on 2D material. Mechanical transfer of nanostructures on sapphire substrates to copper tape is then demonstrated, with no resulting damage of nanorods. Use of MOVPE grown large‐area h‐BN to realize nanostructures is a significant advancement and can lead to new nanodevice architectures needed for next‐generation optoelectronic devices. [ABSTRACT FROM AUTHOR]