Search

Abstract: Sn whiskers are thin filaments that grow spontaneously out of the surface of coatings on Cu and have become a critical reliability problem in Pb-free electronics. In this review, we focus on what creates the driving force for whiskers (or more rounded “hillocks”), and what determines where on the surface they will form. Experimental studies are reviewed that quantify the relationship between the Cu–Sn intermetallic (IMC) formation, stress in the layer and whisker/hillock density. Measurements of the mechanical properties show how stress relaxation in the Sn layer is intimately related to how much stress develops due to the IMC formation. Real-time scanning electron microscope (SEM)/focused ion beam (FIB) studies are described that illustrate the whisker/hillock growth process in detail. Whiskers are found to grow out of a single grain on the surface with little lateral growth while hillock growth is accompanied by extensive grain growth and crystallite rotation. Electron-backscattering detection (EBSD) shows the grain structure around where the whiskers/hillocks form, indicating that whiskers can grow out of pre-existing grains and do not require the nucleation of new grains. This has led to a picture in which stress builds up due to IMC growth and causes whiskers/hillocks to form at “weak grains”, i.e., grains that have a stress relaxation mechanism that becomes active at a lower stress than its neighbors. FEA (finite element analysis) calculations are used to simulate the evolving stress and whisker growth for several different mechanisms that may lead to “weak” grains. [Copyright &y& Elsevier]

We use finite element simulations to quantitatively evaluate different mechanisms for the generation of stress in Sn films due to growth of the Cu6Sn5 intermetallic phase at the Cu-Sn interface. We find that elastic and plastic behavior alone are not sufficient to reproduce the experimentally measured stress evolution. However, when grain boundary diffusion is included, the model results agree well with experimental observations. Examination of conditions necessary to produce the observed stresses provides insight into potential strategies for minimizing stress generation and thus mitigating Sn whisker growth. [ABSTRACT FROM AUTHOR]

Whiskers/hillocks grow out of Pb-free Sn coatings used in electronics manufacturing. To determine which grains form whiskers/hillocks, we use scanning electron microscopy and backscattering diffraction to simultaneously monitor the surface morphology and grain structure. To reduce surface roughness, we developed a 'peel-off' method to prepare ultra-flat samples that were measured repeatedly while whiskers/hillocks formed. We find grains that form into whiskers/hillocks are present in the as-deposited film (i.e., not re-nucleated) and many have horizontal grain boundaries beneath them. Grain rotation during whisker/hillock formation means that measurements performed after the features grow do not indicate their initial grain orientations. [ABSTRACT FROM AUTHOR]

Sn whisker formation was studied in a "bimetal ledge specimen" that consisted of a uniform layer of Sn that was covered by Cu on only half the sample. Whiskers are observed to grow in the Cu-free region of the sample, which is attributed to stress generated by the diffusion of Sn atoms along the network of columnar grain boundaries. The Sn diffusion is driven by intermetallic growth, but the whisker density extends out much further than any measurable Cu concentration. Whiskers were also observed to grow in the Cu-coated region by punching through the overlayer, leaving a Cu-grain on the tip of the Sn whisker. [ABSTRACT FROM AUTHOR]