51. Influence of the Cu2O morphology on the metallization of Al2O3 ceramics.
- Author
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Zheng, Jing-Wu, Gao, Deng-Ming, Qiao, Liang, Ying, Yao, Li, Wang-Chang, Jiang, Li-Qiang, and Che, Sheng-Lei
- Subjects
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COPPER oxide , *COPPER compounds , *ALUMINUM compounds , *THIN films , *HYDROGEN-ion concentration - Abstract
In this study, thin Cu 2 O films were first produced on a Cu foil by cathodic electro-deposition at different pH values. Then the Cu 2 O side of the Cu foil was closely attached to an Al 2 O 3 ceramic substrate and heated to 1075 °C under N 2 atmosphere. The effect of the pH value on the microstructure of the Cu 2 O film was investigated by scanning electron microscopy (SEM). The shape of the Cu 2 O grains changed from a 4-sided pyramid to a triangular prism to a 3-faced pyramid when increasing the pH value from 9 to 11 and 12, respectively. The X-ray diffraction (XRD) results showed that both CuAlO 2 and CuAl 2 O 4 were formed at the Cu/Al 2 O 3 interface after reacting for 4 h, in contrast to results reported in previous papers. When the bonding time was extended to 7 h, discontinuous interfacial reaction products were found on the cross-section of the Cu/Al 2 O 3 interface. The effect of the Cu 2 O morphology on the bonding strength of the Cu/Al 2 O 3 was discussed considering the results of the flexural strength tests, and the results indicated that a uniform and dense Cu 2 O morphology would be beneficial for improving the bonding strength during the metallization process. [ABSTRACT FROM AUTHOR]
- Published
- 2016
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