Search

Through Silicon Via(TSV), as a key interconnection technology in 3D integrated circuits, is used to connect input and output of chips in different layers. When multiple TSVs with alternating current close to each other, will produce the proximity effect, which increases the resistance of the TSV, thus affecting the transmission performance of TSV. Therefore, a method of calculating AC resistance of TSV array based on barycentric interpolation is presented. On the basis of triangulation of TSV cross section and determining the current intensity of vertices, the AC power consumption of TSV is calculated by interpolation method, the AC to DC resistance ratio of TSV is calculated by the AC to DC power ratio, and then the AC resistance value of TSV under the influence of proximity effect is obtained. This method can realize the calculation of AC resistance of TSV array in arbitrary scale and arrangement, and it will provide guidance and verification for the design of transmission structure in three dimensional integrated circuits. Finally, the numerical results of this method are compared with the results of commercial solver ANSYS Q3D. The experimental results show that the proposed method acquires better performance.