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Copyright of Micronanoelectronic Technology is the property of Micronanoelectronic Technology Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Electronic Components & Materials is the property of Electronic Components & Materials and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Electronic Components & Materials is the property of Electronic Components & Materials and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

For the problems of the current flexible metal interconnect conductor based on the inkjet printing - based printed electronics technology, such as easy clogging of nozzles, poor accuracy of conductor lines, and the process requires heating, a reliable and low - cost flexible metal interconnect conductor is proposed, which is the method of preparing metal interconnect conductor by combining the roll - to - roll printing process and the chemical deposition technique. The flexible substrate material used herein is Teslin paper, which has more excellent mechanical strength and water resistance than ordinary paper. A roll - to - roll flexography machine is used to print the metal interconnect conductor pattern on the flexible substrate material. The ink film on the substrate is dried by ultraviolet curing technology, and the metal copper conductor is obtained on the substrate surface by chemical deposition technology. The advantage of this craft is that the prepared metal copper conductor has high accuracy and the process do not require high temperature equipment. In addition, since a roll - to - roll 1lexography printing machine is utilized, it has the prospect of large - scale flow production in the industry. The SEM, XRD, EDS and adhesion test of the metal layer of the metal interconnect conductor prove that the surface of the metal layer of the interconnect conductor has advantages including dense surface, high crystallinity, good adhesion, low resistivity ( 2.62 x10-8 Ω· cm), and excellent mechanical prope1iies (1000 bending test) . [ABSTRACT FROM AUTHOR]

With the rapid development of printing and electronic industry, it has become a hot research topic to find conductive ink that can meet requirements of products as many as possible, simplify the process and control the cost. Graphene, with its excellent conductivity, thermodynamics, optics and mechanical properties, endows flexible electronic products with higher flexibility and easy processing, which ensures the conductivity and reduces the cost. In this paper, the preparation methods of graphene ink, and the various means of graphene conductive ink adhering to substrate, as well as the existing problems were briefly introduced. The new development of graphene and its related derivative-based conductive inks were emphatically introduced. [ABSTRACT FROM AUTHOR]