33 results on '"Schiller S"'
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2. A new sputter cleaning system for metallic substrates
3. Pretreatment of metallic substrates by mechanical activation
4. Comparison between electron beam evaporation and high rate sputtering with a plasmatron
5. CrSi resistive films produced by magnetron-plasmatron sputtering
6. Features of and IN SITU measurements on absorbing TiOx films produced by reactive d.c. magnetron-plasmatron sputtering
7. Advances in mechanical activation as a pretreatment process for vacuum deposition
8. New sputter-cleaning system for metallic substrates
9. Deposition of hard wear-resistant coatings by reactive D.C. Plasmatron sputtering
10. Surface modification by electron beams
11. Metallization of semiconductor devices by high rate sputtering of aluminum
12. Pretreatment of metallic substrates with the plasmatron
13. Influence of deposition parameters on the optical and structural properties of TiO2 films produced by reactive d.c. plasmatron sputtering
14. Advances in high rate sputtering with magnetron-plasmatron processing and instrumentation
15. The role of plasmatron/magnetron systems in physical vapor deposition techniques
16. Plasmatron sputtering for the production of high stability NiCr resistive films
17. Reactive D.C. sputtering with the magnetron-plasmatron for tantalum pentoxide and titanium dioxide films
18. Complete thin film system for hybrid circuits sputtered with the plasmatron
19. On the investigation of d.c. plasmatron discharges by optical emission spectrometry
20. Vacuum coating of large areas
21. Use of the ring gap plasmatron for high rate sputtering
22. Metallization of ceramics for electronic components by magnetron-plasmatron coating
23. Properties of cadmium stannate thin films produced by reactive high rate d.c. magnetron-plasmatron sputtering
24. On the use of ring gap discharges for high rate vacuum coating
25. Dispersion-strengthened copper-based materials formed by high rate magnetron/plasmatron sputtering
26. High speed scanning electron beam annealing of ion-implanted silicon layers
27. High rate electron beam evaporation
28. Pretreatment of metallic substrates with the plasmatron
29. Reactive high rate D.C. sputtering: Deposition rate, stoichiometry and features of TiOx and TiNx films with respect to the target mode
30. Reactive high rate D.C. sputtering: Deposition rate, stoichiometry and features of TiO x and TiN x films with respect to the target mode
31. Influence of deposition parameters on the optical and structural properties of TiO 2 films produced by reactive d.c. plasmatron sputtering
32. Features of and IN SITU measurements on absorbing TiO x films produced by reactive d.c. magnetron-plasmatron sputtering
33. Deposition by electron beam evaporation with rates of up to 50 μm s −1
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