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The recently described transient hot-strip method for measuring thermal transport properties of solid insulators has been developed for simultaneously measuring the resistivity ϱF and the temperature coefficient of resistivity (TCR) αF of metallic thin films. The experimental arrangement is similar to the well-known four-probe technique but the constant current pulse passed through the thin film is sufficiently high to increase its mean temperature by about 1 K. By measuring the time-varying increase or decrease in the resistance, information is obtained not only about the resistivity but also about the TCR. The main advantage of the method is the possibility to measure ϱF and αF simultaneously without increasing or decreasing the temperature of the film by more than 1 K, i.e. without measurably changing the properties of the film. The method has been tested on unannealed copper films at room temperature.