1. Whole-wafer fabrication process for three-terminal double stacked tunnel junctions
- Author
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Giovanni Piero Pepe, Rossana Scaldaferri, Loredana Parlato, Carmine Granata, G. Peluso, Emanuela Esposito, M. Russo, Pepe, GIOVANNI PIERO, Peluso, Giuseppe, R., Scaldaferri, Parlato, Loredana, C., Granata, E., Esposito, and M., Russo
- Subjects
Josephson effect ,Superconductivity ,Materials science ,Fabrication ,business.industry ,Niobium ,chemistry.chemical_element ,Condensed Matter Physics ,Electronic, Optical and Magnetic Materials ,Wafer fabrication ,chemistry ,Q factor ,Deposition (phase transition) ,Optoelectronics ,Wafer ,business - Abstract
A new fabrication process for three-terminal superconducting devices consisting of two Josephson junctions in a stacked configuration is reported. The process is based on the deposition of the whole Nb/AlxOy/Nb-Al/AlxOy/Nb multilayer on a Si crystalline wafer without any vacuum breaking. Lift-off techniques, anodization processes and a SiO film deposition have been adopted for patterning and insulating the two tunnel stacked junctions. Devices have been characterized in terms of current-voltage (I-V) curves and Josephson critical current vs. the externally applied magnetic field. They show high quality factors (V m values up to 65 mV at 4.2 K), and good current uniformity.
- Published
- 2001
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