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Precision agriculture (PA) has offered a multitude of benefits to farmers, such as cost reduction, accuracy and speed in decision making. Among the tools that work with PA, the aerial image mosaics have key role in accurate mapping of diseases and pests in crops. A mosaic is the combination of multiple images, creating a new image that covers the property or plots accurately. One of the important analysis for farmers is based on the properties of the reflectance in each range of the electromagnetic spectrum of vegetation. Performing mathematical combinations of the different spectral bands has a better understanding of the spectral response of the vegetation. These combinations are called vegetation index (VI) and are useful for the control of the biomass, water content in leaf, chlorophyll content and others. It is usually calculated VI after the construction of the mosaic, as well the farmer has an accurate analysis of its vegetation. However, building a mosaic of images, it has a high computational cost, taking hours to complete and then apply the VI and to have the first test results. In order to reduce the computational cost of this process, this work aims to present a mosaic of images constructed from images with the VI already pre-calculated providing faster analysis to the farmer, given the fact that applying VI on the image came a this reduction in density image and thus have the gain in computational cost to build the mosaic.

Actual optical systems have increasing requirements on accuracy and cost reduction at the same time. This leads to high demands for the process control during production. For high precision lenses it is not unusual that centering accuracies of single lenses and mounted components are the limiting tolerances for the overall system performance. At the same time it is important that also for less demanding systems the most cost efficient production process can be identified. By applying sensitivity analysis methods, typically used in optical design, it is easy to achieve a deeper understanding of the centering process of cemented components. The relevant centering parameters and their respective sensitivity can be calculated for different manufacturing methods and the optimum overall process can be chosen by comparison.

In a typical optical system, optical elements usually need to be precisely positioned and aligned to perform the correct optical function. This positioning and alignment involves securing the optical element in a holder or mount. Proper centering of an optical element with respect to the holder is a delicate operation that generally requires tight manufacturing tolerances or active alignment, resulting in costly optical assemblies. To optimize optical performance and minimize manufacturing cost, there is a need for a lens mounting method that could relax manufacturing tolerance, reduce assembly time and provide high centering accuracy. This paper presents a patent pending lens mounting method developed at INO that can be compared to the drop-in technique for its simplicity while providing the level of accuracy close to that achievable with techniques using a centering machine (usually < 5 μm). This innovative auto-centering method is based on the use of geometrical relationship between the lens diameter, the lens radius of curvature and the thread angle of the retaining ring. The autocentering principle and centering test results performed on real optical assemblies are presented. In addition to the low assembly time, high centering accuracy, and environmental robustness, the INO auto-centering method has the advantage of relaxing lens and barrel bore diameter tolerances as well as lens wedge tolerances. The use of this novel lens mounting method significantly reduces manufacturing and assembly costs for high performance optical systems. Large volume productions would especially benefit from this advancement in precision lens mounting, potentially providing a drastic cost reduction.

The decreasing size and increasing complexity of photomask features, driven by the push to ever smaller technology nodes, places more and more challenges on the mask house, particularly in terms of yield management and cost reduction. Particularly challenging for mask shops is the inspection, repair and review cycle which requires more time and skill from operators due to the higher number of masks required per technology node and larger nuisance defect counts. While the measurement throughput of the AIMS™ platform has been improved in order to keep pace with these trends, the analysis of aerial images has seen little advancement and remains largely a manual process. This manual analysis of aerial images is time consuming, dependent on the skill level of the operator and significantly contributes to the overall mask manufacturing process flow. AutoAnalysis, the first application available for the FAVOR® platform, offers a solution to these problems by providing fully automated analysis of AIMS™ aerial images. Direct communication with the AIMS™ system allows automated data transfer and analysis parallel to the measurements. User defined report templates allow the relevant data to be output in a manner that can be tailored to various internal needs and support the requests of your customers. Productivity is significantly improved due to the fast analysis, operator time is saved and made available for other tasks and reliability is no longer a concern as the most defective region is always and consistently captured. In this paper the concept and approach of AutoAnalysis will be presented as well as an update to the status of the project. The benefits arising from the use of AutoAnalysis will be discussed in more detail and a study will be performed in order to demonstrate.

Recent industrial results around directed self-assembly (DSA) of block copolymers (BCP) have demonstrated the high potential of this technique [1-2]. The main advantage being cost reduction thanks to a reduced number of lithographic steps. Meanwhile, the associated correction for mask creation must account for the introduction of this new technique, maintaining a high level of accuracy and reliability. In order to create VIA (Vertical Interconnect Layer) layer, graphoepitaxy DSA can be used. The technique relies on the creation of a confinement guides where the BCP can separate into distinct regions and resulting patterns are etched in order to obtain an ordered series of VIA contact. The printing of the guiding pattern requires the use of classical lithography. Optical proximity correction (OPC) is applied to obtain the best suited guiding pattern allowing to match a specific design target. In this study, an original approach for DSA full chip mask optical proximity correction based on a skeleton representation of a guiding pattern is proposed. The cost function for an OPC process is based on minimizing the Central Placement Error (CPE), defined as the difference between an ideal skeleton target and a generated skeleton from a guiding contour. The high performance of this approach for DSA OPC full chip correction and its ability to minimize variability error on via placement is demonstrated and reinforced by the comparison with a rigorous model. Finally this Skeleton approach is highlighted as an appropriate tool for Design rules definition.

There has been significant research in the area of modeling self-assembling molecular systems. Directed self-assembly (DSA) has proven to be a promising candidate for cost reduction of processes which use double patterning and an enabler of new technology nodes. Self-consistent field theory and Monte Carlo simulators have the capability to probe and explore the mechanisms driving the different phases of a diblock copolymer system. While such methods are appropriate to study the nature of the self-assembly process, they are computationally expensive and they cannot be used to perform mask synthesis operations nor full chip verification. In this case we focus our effort in establishing the minimum set of conditions that a compact model for the manufacture of contact holes using a grapho epitaxy process for a PS-b-PMMA diblock copolymer system needs. The compact model’s main objectives are to find the guiding pattern that produces the lowest possible placement error, as well as verifying that the intended target structures are present after processing. Given that masks are not perfect, and lithographic process variations are not negligible, it is necessary to understand the mask requirements and the types of Optical Proximity Correction techniques that will be used to build guiding patterns. This paper explores the guiding pattern conditions under which proper assembly is achieved, and how the compact model formulation is able to determine placement of reliably assembling structures as well as identification of the guiding patterns which lead to improper assembly. The research leading to these results has been performed in the frame of the industrial collaborative consortium IDeAL focused on the development of Directed Self-assembly technique by block copolymers.

In time when every penny counts, many organizations are facing the question of how much scientific impact a budget cut can have or, putting it in more general terms, which is the science impact of alternative (less costly) operational modes. In reply to such question posted by the governing bodies, the ALMA project had to develop a methodology (ALMA Concepts for Operations, CONOPS) that attempts to measure the impact that alternative operational scenarios may have on the overall scientific production of the Observatory. Although the analysis and the results are ALMA specific, the developed approach is rather general and provides a methodology for a cost-performance analysis of alternatives before any radical alterations to the operations model are adopted. This paper describes the key aspects of the methodology: a) the definition of the Figures of Merit (FoMs) for the assessment of quantitative science performance impacts as well as qualitative impacts, and presents a methodology using these FoMs to evaluate the cost and impact of the different operational scenarios; b) the definition of a REFERENCE operational baseline; c) the identification of Alternative Scenarios each replacing one or more concepts in the REFERENCE by a different concept that has a lower cost and some level of scientific and/or operational impact; d) the use of a Cost-Performance plane to graphically combine the effects that the alternative scenarios can have in terms of cost reduction and affected performance. Although is a firstorder assessment, we believe this approach is useful for comparing different operational models and to understand the cost performance impact of these choices. This can be used to take decision to meet budget cuts as well as in evaluating possible new emergent opportunities.

The semiconductor industry drives a lot of efforts in the field of cost reductions and quality improvements. The consequent use of IT tools is one possibility to support these goals. With the extensions of its 150mm Fab to 200mm Robert Bosch increased the systematic use of data analysis and Advanced Process Control (APC).

The laser as an industrial tool is an essential part of today’s solar cell production. Due to the on-going efforts in the solar industry, to increase the cell efficiency, more and more laser-based processes, which have been discussed and tested at lab-scale for many years, are now being implemented in mass production lines. In order to cope with throughput requirements, standard laser concepts have to be improved continuously with respect to available average power levels, repetition rates or beam profile. Some of the laser concepts, that showed high potential in the past couple of years, will be substituted by other, more economic laser types. Furthermore, requirements for processing with less-heat affected zones fuel the development of industry-ready ultra short pulsed lasers with pulse widths even below the picosecond range. In 2011, the German Ministry of Education and Research (BMBF) had launched the program “PV-Innovation Alliance”, with the aim to support the rapid transfer of high-efficiency processes out of development departments and research institutes into solar cell production lines. Here, lasers play an important role as production tools, allowing the fast implementation of high-performance solar cell concepts. We will report on the results achieved within the joint project FUTUREFAB, where efficiency optimization, throughput enhancement and cost reduction are the main goals. Here, the presentation will focus on laser processes like selective emitter doping and ablation of dielectric layers. An indispensable part of the efforts towards cost reduction in solar cell production is the improvement of wafer handling and throughput capabilities of the laser processing system. Therefore, the presentation will also elaborate on new developments in the design of complete production machines.

In 2011, the Amonix Advanced Technology Group was awarded DOE SunShot funding in the amount of $4.5M to design a new Balance of System (BOS) architecture utilizing Amonix MegaModules™ focused on reaching the SunShot goal of $0.06-$0.08/kWhr LCOE. The project proposal presented a comprehensive re-evaluation of the cost components of a utility scale CPV plant and identified critical areas of focus where innovation is needed to achieve cost reduction. As the world's premier manufacturer and most experienced installer of CPV power plants, Amonix is uniquely qualified to lead a rethinking of BOS architecture for CPV. The presentation will focus on the structure of the BOS-X approach, which looks for the next wave of cost reduction in CPV through evaluation of non-module subsystems and the interaction between subsystems during the lifecycle of a solar power plant. Innovation around nonmodule components is minimal to date because CPV companies are just now getting enough practice through completion of large projects to create ideas and tests on how to improve baseline designs and processes. As CPV companies increase their installed capacity, they can utilize an approach similar to the methodology of BOS-X to increase the competitiveness of their product. Through partnership with DOE, this holistic approach is expected to define a path for CPV well aligned with the goals of the SunShot Initiative.

The Long Wave IR camera market has grown significantly in the last ten years thanks to the strong cost reduction brought by low cost IR detectors/ microbolometers. This led to the development of many new commercial markets and it is expected that IR camera volumes will be multiplied by 4 to reach 1.18 M units in 2016 thanks to the strong price reduction of the cameras meaning +29% CAGR in volume. The uncooled IR camera revenues will grow from $2.1B in 2010 to $3.4 B in 2016. In our paper, we have both analyzed market and technical trends for uncooled infrared imagers' civilian and military applications.

We propose and demonstrate a novel processing cycle for sheet-metal working based on the computerized image processing techniques. The interconnected test system based on the cross network communication enables the effective fabrication cycle that realizes automatic inspection, quick delivery, and cost reduction., Optoelectronic measurement technology and systems : 6-9 November 2011 : Beijing, China

MCT technologies under development in France address strategic operational needs. This includes better identification range as well as lighter weight requirement, operation at higher detector temperature and cost reduction issues. This paper describes the status of MCT IR technology in France at Leti and Sofradir. A focus will be made on hot detector technology for SWAP applications. Solutions for high performance detectors such as dual bands or megapixels will be discussed. In the meantime, the development of avalanche photodiodes, integrated optics, or TV format with digital interface is key to bring customers cutting-edge functionalities.

The design of cost-efficient medium-concentration PV (MCPV) systems requires the analysis of dozens of engineering, manufacturing and financial trade-offs. In 2007, Skyline Solar designed its first system, the HGS1000, based on a 7x concentration factor and 0.5 m aperture width. At the then-current cost of components, this was the optimum design. However, as the cost of silicon cells has fallen and the efficiency of cells has improved, the least-cost point has moved. This paper explains how we used the combination of field data and advanced performance modeling to re-optimize the design for lowest levelized cost of energy (LCOE) and achieve 40% cost reduction.x=14&up

Parametric cost models are used to plan missions, compare concepts and justify technology investments. This paper reviews an on-going effort to develop cost modes for space telescopes. This paper summarizes the methodology used to develop cost models and documents how changes to the database have changed previously published preliminary cost models. While the cost models are evolving, the previously published findings remain valid: it costs less per square meter of collecting aperture to build a large telescope than a small telescope; technology development as a function of time reduces cost; and lower areal density telescopes cost more than more massive telescopes.

Driven by dramatic cost reduction of detectors, the market volume for thermography and infrared vision will triple by 2015. In our paper, we have both analyzed market and technical trends for uncooled infrared imagers' applications.

Critical Dimension Scanning Electron Microscope (CD-SEM) recipe creation needs sample preparation necessary for matching pattern registration, and recipe creation on CD-SEM using the sample, which hinders the reduction in test production cost and time in semiconductor manufacturing factories. From the perspective of cost reduction and improvement of the test production efficiency, automated CD-SEM recipe creation without the sample preparation and the manual operation has been important in the production lines. For the automated CD-SEM recipe creation, we have introduced RecipeDirector (RD) that enables the recipe creation by using Computer-Aided Design (CAD) data and text data that includes measurement information. We have developed a system that automatically creates the CAD data and the text data necessary for the recipe creation on RD; and, for the elimination of the manual operation, we have enhanced RD so that all measurement information can be specified in the text data. As a result, we have established an automated CD-SEM recipe creation system without the sample preparation and the manual operation. For the introduction of the CD-SEM recipe creation system using RD to the production lines, the accuracy of the pattern matching was an issue. The shape of design templates for the matching created from the CAD data was different from that of SEM images in vision. Thus, a development of robust pattern matching algorithm that considers the shape difference was needed. The addition of image processing of the templates for the matching and shape processing of the CAD patterns in the lower layer has enabled the robust pattern matching. This paper describes the automated CD-SEM recipe creation technology for the production lines without the sample preparation and the manual operation using RD applied in Sony Semiconductor Kyusyu Corporation Kumamoto Technology Center (SCK Corporation Kumamoto TEC).

Driven by dramatic cost reduction of detectors, the market volume for thermography and infrared vision will triple by 2015. In our paper, we have both analyzed market and technical trends for uncooled infrared imagers' applications.

Current spectroscopic detector crystals contain defects that prevent economic production of devices with sufficient energy resolution and stopping power for radioisotope discrimination. This is especially acute for large monolithic crystals due to increased defect opportunity. The proposed approach to cost reduction starts by combining stereoscopic IR and ultrasound (UT) inspection coupled with segmentation and 3D mapping algorithms. A "smart dicing" system uses "random-access" laser-based machining to obtain tiles free of major defects. Application specific grading matches defect type to anticipated performance. Small pieces combined in a modular sensor pack instead of a monolith will make the most efficient use of wafer area.

Cost reduction and increased as-built performance can be achieved through both tolerance desensitization and use of compensators. We investigate how desensitization of selected parameters can further relax tolerances while using selective assembly as a compensator.

The photomask cost is becoming one of the challenging issues in the semiconductor industry, as the cost of photomasks has been rising year by year. ASET started Mask D2I (Mask Design, Drawing and Inspection Technology) project with the sponsorship from the NEDO (New Energy and Industrial Technology Development Organization) in 2006 for the purpose of the mask cost reduction. In earlier papers[1-5], we introduced the idea of photomask data prioritization method which is referred to as Mask Data Rank (MDR). We have built our software system to convert Design Intent (DI) to MDR with cooperation of STARC. Then we showed the results of experiments with mask data provided by semiconductor companies. In this paper we show the additional report of mask inspection experiments using real photomasks. Then we show the evaluation results about mask drawing time reduction using MDR flow. Finally we introduce detailed algorithm to extract design intent from analog circuits.

The semiconductor industry has pursued a rapid pace of technology scaling to achieve an exponential component cost reduction. Over the years the goal of technology scaling has been distilled down to two discrete targets. Process engineers focus on sustaining wafer costs, while manufacturing smaller dimensions whereas design engineers work towards creating newer IC designs that can feed the next generation of electronic products. In doing so, the impact of process choices made by manufacturing community on the design of ICs and vice-versa were conveniently ignored. Hoever, with the lack of cost effective lithography solutions at the forefront, the process and design communities are struggling to minimize IC die costs by following the described traditional scaling practices. In this paper we discuss a framework for quantifying the economic impact of design and process decisions on the overall product by comparing the cost-per-good-die. We discuss the intricacies involved in computing the cost-per-good-die as we make design and technology choices. We also discuss the impact of design and lithography choices for the 32nm and 22nm technology node. The results demonstrate a strong volume dependence on the optimum design style and corresponding lithography and strategy. Most importantly, using this framework process and design engineers can collaborate to define design style and lithography solutions that will lead to continued IC cost scaling.

Double patterning (DP) is the first candidate for extension of ArF immersion lithography, and topcoat-less (TC-less) process is an attractive process candidate compared to a topcoat process because it can make DP process simpler and reduce the chip manufacturing cost. To make the DP process viable, TC-less process performance including defectivity, auto focus (AF) and overlay performance must be validated. Nikon's latest volume production immersion lithography tool (S620D), was used for TC-less process evaluation. While S620D shows good defectivity results with both topcoat and TC-less process at 700mm/s scan speed, TC-less process showed slight improvement in defectivity compared to topcoat process. One reason being that TC-less process can suppress topcoat originated defect such as topcoat blister. The second reason is that TC-less resist can attain higher hydrophobicity than topcoat. Higher hydrophobicity is advantageous for high speed scanning because of stable movement of water meniscus, resulting in better defectivity performance. Defectivity results showed clear correlation to dynamic receding contact angle (D-RCA). Blob defect reduction is one of the challenges with TC-less resist process, because hydrophobic surface repels rinse water applied during development rinse process hence generating blob defect. However, the recent material improvements of TC-less resist have overcome this challenge and showed excellent blob defect performance. The hydrophobicity control during development process is the key factor in defect reduction. Wafer edge process is also very important for immersion lithography. The preferable wafer edge treatment for both TCless and topcoat process is to maintain uniform hydrophobicity over the entire wafer including wafer edge. While topcoat can be removed perfectly by development, unexposed TC-less resist remains on the wafer edge. WEE (wafer edge exposure) process can remove the excess resist after exposure, it's effectiveness was confirmed through experimental results. AF and overlay repeatability was evaluated on both topcoat and TC-less process; similar and sufficient performance was obtained on both processes. Based on cost of ownership calculations it is believed a 30% material cost and 10% track hardware cost reduction is feasible. These evaluations provide convincing evidence that TC-less process is ready for 32nm generation and beyond.

To measure blood flow rate in ex-vivo circulation, we propose an optical Doppler flowmeter based on the self-mixing effect within a laser diode (SM-LD). Advantages in adopting SM-LD techniques derive from reduced costs, ease of implementation and limited size. Moreover, the provided contactless sensing allows sensor reuse, hence further cost reduction. Preliminary measurements performed on bovine blood are reported, thus demonstrating the applicability of the proposed measurement method.

Metro optical networks have undergone changes in design in recent years, driven by growing traffic demands and the establishment of new technologies driving network architectures. In this paper the drivers are described and the implications for optical amplifiers used in metro optical networks are discussed. Challenges for performance improvements and cost reduction in current networks driving metro amplifiers today, together with opportunities for future metro amplifiers are discussed.

Organic flexible electronics is an emerging technology with huge potential growth in the future which is likely to open up a complete new series of potential applications such as flexible OLED-based displays, urban commercial signage, and flexible electronic paper. The transistor is the fundamental building block of all these applications. A key challenge in patterning transistors on flexible plastic substrates stems from the in-plane nonlinear deformations as a consequence of foil expansion/shrinkage, moisture uptake, baking etc. during various processing steps. Optical maskless lithography is one of the potential candidates for compensating for these foil distortions by in-situ adjustment prior to exposure of the new layer image with respect to the already patterned layers. Maskless lithography also brings the added value of reducing the cost-of-ownership related to traditional mask-based tools by eliminating the need for expensive masks. For the purpose of this paper, single-layer maskless exposures at 355 nm were performed on gold-coated poly(ethylenenaphthalate) (PEN) flexible substrates temporarily attached to rigid carriers to ensure dimensional stability during processing. Two positive photoresists were employed for this study and the results on plastic foils were benchmarked against maskless as well as mask-based (ASML PAS 5500/100D stepper) exposures on silicon wafers. © 2009 Copyright SPIE - The International Society for Optical Engineering.

Advanced InP technology is the enabling technology to achieve monolithic integrated 300-pin MSA compatible 43 Gb/s (RZ-)DQPSK transponder module with high performance. The integrated platform offers footprint, power, and cost reduction for next generation products.

A technique developed to acquire fast optical signals using low frequency detection and acquisition is presented here. It is based on optical sampling that creates a replica of the fast signal on a much slower time scale by a simple strobe effect. High bandwidth detection and acquisition is totally suppressed leading to a better response and a substantial cost reduction. The performance is illustrated by comparative measurements using a Brillouin high resolution distributed fibre sensor.

The number of large plants (energy, industry, etc.) being planned and constructed in the world has increased tremendously in recent times. By reducing the construction costs involved in the development of these plants, authors can reduce the initial investment required, thereby ensuring a more economical use of monetary resources. However, construction work still requires considerable skill and labor. Hence, it is necessary to develop new systems and processes for construction cost reduction. In this investigation, efficient automatic measurement method for embedded plate fixed position was examined by linking digital photogrammetry and CAD data. The developed measurement system was applied to large plant construction field, and the verification about efficiency was performed. In this paper, these contents will be reported.

Mask set price is soaring along with technology node advancement. One reason is that the number of masks per set is increasing with the geometry scaling. Another reason is that low k1 lithography with highly complex OPCs tightens dimensional mask specifications as to result in higher mask-making tool costs and lower production yield. Under these circumstances, tool cost reduction and production yield improvement are immensely required to reduce mask cost. Expensive quality-assured tools are indispensable to achieve the desired accuracy. Then, higher throughput and technical applicability of the same tool over multiple generations are definitely needed to improve total tool CoO. Meanwhile, not only such conventional basic approaches as improving field level and process performance but optimizing mask specifications efficiently is emerging as a key factor for keeping mask production yield high. Usually mask specifications are determined by the error budget allocated from the total lithography budget. In order to cope with the tighter specifications some sensible approaches have recently been proposed. Mask DFM is receiving particular attention as a new method being strongly linked to lithography and wafer fabrication technologies (1)(2)(3)(4). In this presentation, logical way to define the main mask specifications such as CD, defect and image placement accuracy is shown and sensible ways to sustain them are referred.

Cost and complexity associated with OPC and masks are rapidly increasing to the point that they could limit technology scaling in the future. This paper focuses on demonstrating the advantages of regular design fabrics for OPC simplification to enable scaling and minimize costs for technologies currently in volume production. The application of such a simplified OPC flow results in much smaller mask data volumes due to significantly fewer edges compared to the conventional designs and OPC flows. Moreover, the proposed approach enables reduced mask write times, hence lower mask costs. We compare OPC performance and complexity on standard cell designs to that of layouts on a regular design fabric. We first demonstrate advantages and limitations within an industrial model-based OPC solution. Then, a simplified rulebased OPC solution is discussed for the Metal 1 layer. This simplified OPC solution demonstrates a 70X run time improvement and an order of magnitude reduction in both the output edge count per unit shape and shot count per unit shape while maintaining the printabalility advantages of regular design fabrics. The simplified OPC also demonstrates a 50% reduction in mask-write time. Finally, the benefit of regular design fabrics for OPC simplification and mask cost reduction at a 32nm node is discussed.

High power laser sources are used in various production tools for microelectronic products and solar cells, including the applications annealing, lithography, edge isolation as well as dicing and patterning. Besides the right choice of the laser source suitable high performance optics for generating the appropriate beam profile and intensity distribution are of high importance for the right processing speed, quality and yield. For industrial applications equally important is an adequate understanding of the physics of the light-matter interaction behind the process. In advance simulations of the tool performance can minimize technical and financial risk as well as lead times for prototyping and introduction into series production. LIMO has developed its own software founded on the Maxwell equations taking into account all important physical aspects of the laser based process: the light source, the beam shaping optical system and the light-matter interaction. Based on this knowledge together with a unique free-form micro-lens array production technology and patented micro-optics beam shaping designs a number of novel solar cell production tool sub-systems have been built. The basic functionalities, design principles and performance results are presented with a special emphasis on resilience, cost reduction and process reliability.

Micro-opto-electro-mechanical-systems (MOEMS) have proven to be a facilitating technology in the lithography industry. Recently, there have been significant advancements in digital micromirror device (DMD) based maskless lithography. These advancements have been in the areas of throughput, resolution, accuracy, and cost reduction. This progression in digital micromirror evolution provides considerable opportunities to displace existing lithographic techniques. Precise control of the individual mircormirrors, including scrolling, and full utilization of the FPGA, have allowed DMD-based lithography systems to reach new levels of throughput and repeatability, while reducing production and warranty costs. Throughput levels have far surpassed scanning laser techniques. Chip level cooling technologies allow for higher incident power to be reliably distributed over larger areas of the substrate. Resolution roadmaps are in place to migrate from the current 2400dpi (11μm) to 4800dpi (5.3μm). Without the constraints of mask requirements, mask alignment, storage, and defect analysis are not required, thus increasing accuracy and reducing cost. This contribution will examine the advancements in and benefits of DMD based maskless lithography.

Recent progresses in the photoresists and photolithography for LCD industry applications have been primarily driven by the following two factors: advancement in the material performances (high resolution, high contrast ratio, low dielectric constant) for higher display quality, and cost reduction in the fabrication process. Along with crucial demand for cost competitiveness by improving production efficiency, environmental consciousness has been a major priority at fabrication process design to minimize the amount of waste produced. Having said the above, integration of two or more fabrication processes into a single process by using multi-tone mask technology has been the interest of research, due to its obvious advantage of reducing fabrication processes and cost. For example, multi-tone mask technology application has been widely employed on the TFT side to reduce the different types of photomasks being used. Similar trend has been employed on the CF side as well, where application of multi-tone mask technology is being investigated to integrate fabrication of multiple CF micro-components into a single process. In this presentation, we demonstrate a new approach of fabricating photospacer and peripheral CF components (MVA protrusion, sub-photospacers) in a single integrated process through multi-tone mask technology.

Purpose: Cost reduction is a major focus of the solar industry. Thin film technologies and concentration systems are viable ways to reducing cost, with unique strengths and weakness for both. Most of the concentrating PV work focuses on high concentration systems for reducing energy cost. Meanwhile, many believe that low concentrators provide significant cost reduction potential while addressing the mainstream PV market with a product that acts as a flat panel replacement. This paper analyzes the relative benefit of asymmetric vs. symmetric optics for low-concentrators in light of specific PV applications. Approach: Symmetric and asymmetric concentrating PV module performance is evaluated using computer simulation to determine potential value across various geographic locations and applications. The selected optic design is modeled against standard cSi flat panels and thin film to determine application fit, system level energy density and economic value. Results: While symmetric designs may seem ideal, asymmetric designs have an advantage in energy density. Both designs are assessed for aperture, optimum concentration ratio, and ideal system array configuration. Analysis of performance across climate specific effects (diffuse, direct and circumsolar) and location specific effects (sunpath) are also presented. The energy density and energy production of low concentrators provide a compelling value proposition. More significantly, the choice of optics for a low concentrating design can affect real world performance. With the goal of maximizing energy density and return on investment, this paper presents the advantages of asymmetric optic concentration and illustrates the value of this design within specific PV applications.

The problem of mask cost has been highlighted recently due to the complex manufacturing process as the semiconductor node is getting smaller and smaller. It has been said that DFM methods can be useful for mask cost reduction. One of the ASET/Mask D2I target is the mask data prioritization and its effective uses for mask manufacturing issues from the viewpoints of mask DFM. The Mask D2I and STARC have been working together to build efficient data flow based on the information transition from the design to the manufacturing level. By converting design level information called as "Design Intent" to the priority information of mask manufacturing data called as "Mask Data Rank (MDR)", MDP or manufacturing process based on the importance of reticle patterns is possible. Our main purpose is to build a novel data flow with the priority information of mask patterns extracted from the design intent. In this paper, we introduce a design intent extraction flow which has been newly developed and we show the effectiveness of the fully automated MDR flow with actual chip data. In addition, we show how MDR flow can be applied to analog circuits.

HgCdTe (Mercury Cadmium Telluride / MCT) staring arrays for infrared detection do show constant improvements regarding their compactness and performances. New detectors are now proposed offering system solutions in the different IR wavebands and taking advantage of the latest technology improvements as well as MCT performance advantages and cost reduction. Based on 20 years of experience in 50μm to 15μm pitch Infrared (IR) detector production, the challenge of mass production of low-cost small-pixel pitch detectors are reviewed, from the IR chip manufacturing including detection material, hybridization, ROIC, to the integration in final packing. Taking advantage of its simple well known existing process, then the analyzes of all technological steps adapted to small pitch IR detector are presented, in terms of product performance, reliability, process statistics and capability in order to achieve high yield and low product cost. Answers given the low-cost small-pitch IR detector mass productions finally give benefits to application in terms of high performance, cost reduction, extended life time, and on the field system Life Cycle Support Among these new detectors, one can find the family of 15 μm pixel pitch detectors a TV format (640 x 512) integrated in dedicated tactical Dewars, taking advantages on last development in coolers manufacturing and Dewar assembly.

During the Design-to-Manufacturing tape out flow, Optical Proximity Correction (OPC) is commonly adopted to correct the systematic proximity-effects-caused patterning distortions in order to minimize the across-gate and across-chip linewidth variation. With the continued scaling of gate length, the OPC correction scheme inevitably becomes more aggressive nowadays; increasing the mask complexity and cost proportionally. This could partly be attributed to the purely geometry-based OPC algorithm which tries to match every edge in the layout, without considering its actual impact on circuit performance. Therefore, possibility exists for over-corrected OPC mask that bring slight improvement in circuit performance at the expense of disproportionate higher cost. To simplify the mask design, we present a device performance-based OPC (DPB-OPC) algorithm to generate the mask based on the performance matching criteria rather than the geometrical pattern matching criteria. Drive current (Ion) and leakage current (Ioff) of transistor are chosen to be the performance indexes in this DPB-OPC flow. When compared to the conventional OPC approaches, our proposed approach results in simpler mask that achieves closer circuit performance.

This paper discusses Electro-Optic research activities from Electromagnetic Remote Sensing Defence Technology Centre (EMRS DTC) funded programmes which have enhanced Selex Sensors and Airborne Systems Ltd products. EMRS DTC EO Theme programmes relating to Broadband OPOs to reduce the coherence of laser sources for active imaging at 1.5μm, Intra-cavity Adaptive Optics Control of Lasers, Cost Reduction in 2D IR Detectors, Photonic Fibres for Active Sensor Systems, Novel low voltage InAs avalanche photodiodes for affordable 2D IR photodetectors and Hyperspectral Algorithm Development have been included in the discussion.

HgCdTe (Mercury Cadmium Telluride / MCT) staring arrays for infrared detection do show constant improvements regarding their compactness and performances. New detectors are now proposed offering system solutions in the different IR wavebands and profiting of the latest technology improvements as well as MCT performance advantages and cost reduction. Among these new detectors, one can find the family of 15 µm pixel pitch detectors including a mid-TV format (384 x 288), a TV format (640 x 512) and a twice-TV format (1280 x 1024). The latest development concerning the mid-TV format is performed according to very challenging specifications regarding small cost and low power consumption. These Focal Plane Arrays (FPA) are integrated in dedicated tactical Dewars, taking advantages on last development in coolers manufacturing and Dewar assembly. Another development axis at CEA\LETI-LIR and Sofradir concerns the avalanche photodiodes for FPA sensitivity improvement. This very promising technology is dedicated for low flux applications as active imagery, hyperspectral applications or small aperture systems. New development results are presented and future trends are discussed.

Efforts at the U.S. Army Research, Development and Engineering Center (ARDEC) at Picatinny, New Jersey are focused on developing methods to counter GPS jamming and electronic warfare (EW) threat by eliminating GPS dependency entirely. In addition, the need for munitions cost reduction requires alternatives to expensive high-grade inertia components. Efforts at ARDEC include investigations of novel methods for onboard measurement of munitions full position and angular orientation independent of GPS signals or high-grade inertia components. Currently, two types of direct angular measurement sensors are being investigated. A first sensor, Radio Frequency Polarized Sensor (RFPS), uses an electromagnetic field as a reference. A second sensor is based on magnetometers, using the Earth magnetic field for orientation measurement. Magnetometers, however, can only provide two independent orientation measurements. The RFPS may also be used to make full object position and angular orientation measurement relative to a reference coordinate system, which may be moving or stationary. The potential applications of novel RFPS sensors is in providing highly effective inexpensive replacement for GPS, which could be used in a "Layered Navigation" scheme employing alternate referencing methods and reduce the current dependency on GPS as a primary reference for guided gun-fired munitions. Other potential applications of RFPSs is in UAVs, UGVs, and robotic platforms.

With an annual volume of more than 5 million units of 2" equivalent substrates, GaN-based LED is the main eater of nitride materials targeting a $3.5B market at devices level. The next big challenge for LED business is to take market shares over the general lighting industry and dollar per lumen ($/lm) ratio is the key parameter. Numerous technological improvements are under investigation: - At die level, photonic crystals and surface texturing technologies are jointly developed to increase the light extraction. External Quantum Efficiency EQE has now reached > 75% at R&D level. - At material level, there is a rapid emergence of new substrates for GaN epitaxy and composite substrates in 6" diameter. That is opening new doors to higher LED luminous efficiency and cost reduction toward the gigantic SSL general illumination business.

This paper proposes a new virtual lithography system to improve the productivity of high-mix / low-volume production. In the case of the conventional technique, product mask and wafer are used to determine a focus-exposure-matrix (FEM) exposure condition. The conventional technique is a "send-ahead" process involving exposure, metrology and data analysis that decreases productivity of manufacturing. In the case of low-volume/high-mix ASIC manufacturing, such a send-ahead process is particularly time-consuming and costly. Moreover, the exposure condition setting imposes a huge workload that is desirable to be avoided from the viewpoints of cost and TAT. Thus, a new methodology to determine exposure dose conditions for each mask in high-mix / low-volume production is required. In this paper, we propose a virtual lithography system to eliminate send-ahead exposure. Firstly, to improve wafer CD prediction accuracy, we rebuild the system, thereby transforming it from a training-based system to a simulation-based system. To make simulation models, we use a golden mask, which is not a product mask. Secondly, exposure conditions are determined by considering 2D patterns including hotspot patterns. Thirdly, the lithography simulation is carried out for each exposure tool. Using the golden mask, we calibrate simulation models for each exposure tool 1-3 . Various patterns including hotspots likely to become fatal errors for circuit reliability due to process proximity effects are considered. The virtual system provides optimal exposure parameters according to product and layer, considering long-term variation of exposure tool conditions. By developing this system, TAT and cost for the determination of exposure parameters will be improved. Elimination of send-ahead wafers can reduce TAT from mask delivery to exposure condition setup in high-mix / low-volume production. Drastic cost reduction is realized in high-mix / low-volume production.

The research on self repair of airplane components, under an SBIR phase II with Wright Patterson Air Force Base, has investigated the attributes and best end use applications for such a technology. These attributes include issues related to manufacturability, cost, potential benefits such as weight reduction, and cost reduction. The goal of our research has been to develop self-repairing composites with unique strength for air vehicles. Our revolutionary approach involves the autonomous release of repair chemicals from within the composite matrix itself. The repair agents are contained in hollow, structural fibers that are embedded within the matrix. Under stress, the composite senses external environmental factors and reacts by releasing the repair agents from within the hollow vessels. This autonomous response occurs wherever and whenever cracking, debonding or other matrix damage transpires. Superior performance over the life of the composite is achieved through this self-repairing mechanism. The advantages to the military would be safely executed missions, fewer repairs and eventually lighter vehicles. In particular the research has addressed the issues by correlating the impact of the various factors, such as 1) delivery vessel placement, shape/size and effect on composite strength, chemicals released and their effect on the matrix, release trigger and efficacy and any impact on matrix properties 2) impact of composite processing methods that involve heat and pressure on the repair vessels. Our self repairing system can be processed at temperatures of 300-350F, repairs in less than 30 seconds and does not damage the composite by repair fiber insertion or chemical release. Scaling up and manufacture of components has revealed that anticipating potential problems allowed us to avoid those associated with processing temperatures and pressures. The presentation will focus on compression after impact testing and the placement of repair fibers/tubes into prepreg laminates.

Silicon-containing material has recently attracted attention as new hard mask material. We have studied the applicability of MFHM (Multi-Functional Hard Mask)/SOC (Spin on Carbon) materials as an alternative to the BARC/SiON/ amorphous carbon (a-C) process. This process is very useful in terms of cost reduction and process simplicity compared to a-C process. Evaluation results have showed good lithographic and etch performances. However, this MFHM process has showed specific defects related to material. This paper will focus on defect type and suggest its solution.

Recent developments in IC design technology for high-speed communications have led to highly improved optoelectronic (O/E) system design. Specifically, signal integrity management is a specific area of communications circuit design that is promising in playing a role in optoelectronic packaging and component cost. This paper explores the potential of these techniques in impacting O/E component design and possibilities for cost reduction. It is argued that a judicious tradeoff in system parameters such as link length and component bandwidth could impact overall cost significantly.

The increasing awareness of sustainable development concept and its economic benefits are making environmentally proactive companies to consider how they can achieve eco-efficiency improvement through material exchange and by partnering with academic, governmental and non-governmental agencies. This paper reports the experiences and achievements of a tripartite partnership initiated by the author with a number of companies in Calgary and a Calgarian NGO. The network is a form of eco-industrial network that is being developed to benefit the participating companies and to develop industrial ecology students' skill in eco-industrial network modeling. The paper highlights the initial difficulties, how they were overcome and a conceptual model developed for assessing the sustainability of the material exchange loop. The preliminary results obtained revealed that the companies are enthusiastic in taking part if it will help them achieve waste management cost reduction, improvement in their corporate environmental performance and corporate goodwill, and protection of their proprietary information. It also reveals that such corporate exposure to students develop their skills in balancing their academic view with what works in the corporate world.

After many years of debate fiber in access is now a high priority for network transformation. Today broadband services in access networks are a key requirement, initially fuelled by the Internet and more recently pushed even harder by video services. Diffusive video initially and interactive video later are likely to generate even faster bandwidth growth. Networks will need to adapt and change if such new services are to be delivered profitably. Fiber in access offers the potential solution to profitable delivery of high bandwidth services as the medium can offer increase bandwidth and reduced network costs at the same time. This is because of its inherent advantage: a high bandwidth-distance product. However fiber in access does imply both a significant financial investment and a technology challenge. For instance, high bandwidth systems such as DWDM-PON will require a high degree of integration and cost reduction for the basic optical devices. This paper looks at such challenges and sets the scene for the technology roadmap required for this new breed of access networks and devices.

Hundreds of mirror segment, thousands of high precision actuators, highly complex mechanical, hydraulic, electrical and other technology subsystems, and highly sophisticated control systems: an ELT system consists of millions of individual parts and components, each of them may fail and lead to a partial or complete system breakdown. The traditional maintenance concepts characterized by predefined preventive maintenance activities and rigid schedules are not suitable for handling this large number of potential failures and malfunctions and the extreme maintenance workload. New maintenance strategies have to be found suitable to increase reliability while reducing the cost of needless maintenance services. The Reliability Centred Maintenance (RCM) methodology is already used extensively by airlines, and in industrial and marine facilities and even by scientific institutions like NASA. Its application increases the operational reliability while reducing the cost of unnecessary maintenance activities and is certainly also a solution for current and future ELT facilities. RCM is a concept of developing a maintenance scheme based on the reliability of the various components of a system by using "feedback loops between instrument / system performance monitoring and preventive/corrective maintenance cycles." Ideally RCM has to be designed within a system and should be located in the requirement definition, the preliminary and final design phases of new equipment and complicated systems. However, under certain conditions, an implementation of RCM into the maintenance management strategy of already existing astronomical infrastructure facilities is also possible. This presentation outlines the principles of the RCM methodology, explains the advantages, and highlights necessary changes in the observatory development, operation and maintenance philosophies. Presently, it is the right time to implement RCM into current and future ELT projects and to save up to 50% maintenance and operation costs.

There is a critical need, not just in the Department of Defense (DOD) but the entire space industry, to reduce the development time and overall cost of satellite missions. To that end, the DOD is actively pursuing the capability to reduce the deployment time of a new system from years to weeks or even days. The goal is to provide the advantages space affords not just to the strategic planner but also to the battlefield commanders. One of the most challenging aspects of this problem is the satellite's thermal control system (TCS). Traditionally the TCS must be vigorously designed, analyzed, tested, and optimized from the ground up for every satellite mission. This "reinvention of the wheel" is costly and time intensive. The next generation satellite TCS must be modular and scalable in order to cover a wide range of applications, orbits, and mission requirements. To meet these requirements a robust thermal control system utilizing forced convection thermal switches was investigated. The problem was investigated in two separate stages. The first focused on the overall design of the bus. The second stage focused on the overarching bus architecture and the design impacts of employing a thermal switch based TCS design. For the hot case, the fan provided additional cooling to increase the heat transfer rate of the subsystem. During the cold case, the result was a significant reduction in survival heater power.