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Repositioning is a common guideline for the prevention of pressure injuries of bedridden or wheelchair patients. However, frequent repositioning could deteriorate the quality of patient's life and induce secondary injuries. This paper introduces a method for continuous multi-site monitoring of pressure and temperature distribution from strategically deployed sensor arrays at skin interfaces via battery-free, wireless ionic liquid pressure sensors. The wirelessly delivered power enables stable operation of the ionic liquid pressure sensor, which shows enhanced sensitivity, negligible hysteresis, high linearity and cyclic stability over relevant pressure range. The experimental investigations of the wireless devices, verified by numerical simulation of the key responses, support capabilities for real-time, continuous, long-term monitoring of the pressure and temperature distribution from multiple sensor arrays. Clinical trials on two hemiplegic patients confined on bed or wheelchair integrated with the system demonstrate the feasibility of sensor arrays for a decrease in pressure and temperature distribution under minimal repositioning.

Epidermal electronics with advanced capabilities in near field communications (NFC) are presented. The systems include stretchable coils and thinned NFC chips on thin, low modulus stretchable adhesives, to allow seamless, conformal contact with the skin and simultaneous capabilities for wireless interfaces to any standard, NFC-enabled smartphone, even under extreme deformation and after/during normal daily activities.

Spatially overlapping plates in tiled configurations represent designs that are observed widely in nature (e.g., fish and snake scales) and man-made systems (e.g., shingled roofs) alike. This imbricate architecture offers fault-tolerant, multifunctional capabilities, in layouts that can provide mechanical flexibility even with full, 100% areal coverages of rigid plates. Here, the realization of such designs in microsystems technologies is presented, using a manufacturing approach that exploits strategies for deterministic materials assembly based on advanced forms of transfer printing. The architectures include heterogeneous combinations of silicon, photonic, and plasmonic scales, in imbricate layouts, anchored at their centers or edges to underlying substrates, ranging from elastomer sheets to silicon wafers. Analytical and computational mechanics modeling reveal distributions of stress and strain induced by deformation, and provide some useful design rules and scaling laws.