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Guided-mode resonance (GMR) gratings have emerged as a promising sensing technology, with a growing number of applications in diverse fields. This study aimed to identify the optimal design parameters of a simple-to-fabricate and high-performance one-dimensional GMR grating. The structural parameters of the GMR grating were optimized, and a high-refractive-index thin film was simulated on the grating surface, resulting in efficient confinement of the electric field energy within the waveguide. Numerical simulations demonstrated that the optimized GMR grating exhibited remarkable sensitivity (252 nm/RIU) and an extremely narrow full width at half maximum (2 × 10−4 nm), resulting in an ultra-high figure of merit (839,666) at an incident angle of 50°. This performance is several orders of magnitude higher than that of conventional GMR sensors. To broaden the scope of the study and to make it more relevant to practical applications, simulations were also conducted at incident angles of 60° and 70°. This holistic approach sought to develop a comprehensive understanding of the performance of the GMR-based sensor under diverse operational conditions.

This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm) without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments.