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Tunnel junctions (TJs) offer alternative designs and promise in some cases improved performances for nitride-based light-emitting diode (LEDs) and laser diodes (LDs) and are widely used in academic studies. However, the voltage penalty of the LEDs and LDs, in comparison with standard contact technologies, has been a major concern especially for commercial applications. In this study, we investigated methods to achieve low excess voltage. Using ammonia molecular beam epitaxy (NH3 MBE), GaN TJs were grown on commercial metalorganic chemical vapor deposition (MOCVD) grown blue LED wafers. Atom probe tomography (APT) and secondary ion mass spectrometry (SIMS) indicate 1 min buffered HF (BHF) clean of the regrowth interface reduced Mg and impurity incorporation into the n++ regrown TJ layers. The wafers were processed and measured in parallel to reference wafers using both university processes and industry processes. At 20 A cm−2, TJ LEDs grown with Si δ-doping at the junction interface processed in the university cleanroom had a forward voltage of 3.17 V in comparison to 2.86 V for LEDs processed with a standard indium tin oxide (ITO) contact. Unencapsulated TJ LEDs processed by industrial process without ITO or current blocking layer had about 0.3 V excess voltage compared to reference LEDs. The TJ LEDs also had more uniform light emission profile. The low excess voltage and consistent results acquired in both settings suggest that TJ can be scaled for industrial processes.

Ohmic contacts to both c-plane and n-GaN are demonstrated using a pure aluminum layer which was vacuum annealed to prevent oxidation. Specific contact resistivities of 4.4 × 10−7 and 2.3 × 10−5 Ωcm2 were obtained without annealing for c-plane and samples respectively. A reflectivity of over 85% at 450 nm was measured for both samples. After a 300 °C anneal specific contact resistivities of 1.5 × 10−7 and 1.8 × 10−7 Ωcm2 were obtained for c-plane and samples respectively and the reflectivities remained higher than 80%.

Growth of InGaN/GaN light-emitting devices on nonpolar or semipolar planes offers a viable approach to reducing or eliminating the issues associated with polarization-related electric fields present in c-plane III-nitride heterostructures. Although progress in device performance has been rapid since the introduction of high-quality free-standing nonpolar and semipolar GaN substrates, a full appreciation of the materials challenges unique to nonpolar and semipolar III-nitride semiconductors has been slower to emerge. Only recently have researchers begun to understand issues such as the origins of the pyramidal hillocks typically observed on nominally on-axis m-plane GaN films, the effects of m-plane substrate misorientation on surface morphology and device performance, the mechanics of anisotropic cracking in tensile strained m-plane AlGaN films, the formation of basal-plane stacking faults in long-wavelength m-plane InGaN quantum wells, and the mechanisms for stress relaxation in semipolar AlGaN and InGaN films. In this paper, we review the materials and growth issues unique to high-performance nonpolar and semipolar light-emitting devices grown on high-quality free-standing GaN substrates and provide an outlook for the opportunities and challenges that lie ahead. (Some figures in this article are in colour only in the electronic version)