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Start Over Author "Tu, K.N." Journal scripta materialia
12 results on '"Tu, K.N."'

12. Fracture reliability concern of (Au, Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing.

Author

Liu, Yingxia, Chen, Yi-Ting, Gu, Sam, Kim, Dong-Wook, and Tu, K.N.

Subjects
*GOLD, *INTEGRATED circuits, *SOLDER joints, *SURFACE finishing, *PHASE transitions, *THREE-dimensional modeling
Abstract

Au surface finishing on Ni layer in solder joints can lead to the replacement of β-Sn by (Au, Ni)Sn 4 phase in microbumps. A thorough crack in (Au, Ni)Sn 4 is found after the sample being annealed at 150 °C for 1000 h. Phase transformation of (Au, Ni)Sn 4 to Ni 3 Sn 4 and AuNi 2 Sn 4 is observed. This transformation will lead to − 10.5% volume shrinkage and may result in tensile stress, which becomes the reason for a thorough crack formation. Kirkendall voids have been found at the interface between Ni 3 Sn 4 and electroplated Ni layer. Marker movement indicates that there was a dominant Ni diffusing flux. [ABSTRACT FROM AUTHOR]

Published
2016
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