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Lithium is the key element for the development of battery and new technology and the development of an analytical technique to spatially and quantitatively resolve this element is of key importance. Detection of Li K in pure metallic lithium is now possible in the Scanning Electron Microscope (SEM) with newly designed Energy Dispersive Spectroscopy (EDS). However, this work is clearly showing, for the first time using EDS, the detection of Li K in several binary lithium compounds (LiH, Li3N, Li2S, LiF and LiCl). Experimental Li K X-rays intensity is compared with a specially modified Monte Carlo simulation program showing discrepancies between theoretical and experimental Li K measurements. The effect of chemical bounding on the X-rays emission using density functional theory with the all-electron linearized augmented plane wave is showing that the emission of Li K from the binary compounds studied should be, at least, 12 times lower than in metallic Li. SCANNING 38:571-578, 2016. © 2016 Wiley Periodicals, Inc. [ABSTRACT FROM AUTHOR]

The purpose of this in vivo study was to compare the morphology of the enamel surfaces before bracket bonding and 6 and 12 months after debonding. Replicas of thirty-two maxillary second premolars of 16 volunteers were made before bracket bonding (T0), after debonding (T1), 6 months (T2), and 12 months (T3) later. Scanning electron microscope (SEM) images of the labial enamel surfaces were taken at T0, T1, T2, and T3 at increasing magnifications and analyzed according to the enamel damage index EDI. Data evaluation by using Friedman test followed by Wilcoxon signed ranks test with Bonferroni adjustment did not reveal statistically significant differences in the mean EDI at T0, T2, and T3, whereas the mean EDI at T1 was significantly higher than at T0, T2, and T3 (p < 0.05). The debonding procedure tested in this study produces no clinically relevant enamel damage. These alterations are reversible indeed, as a progressive restoration to pretreatment condition is evident after 6 months already and even more after 12 months. SCANNING 37:322-326, 2015. © 2015 Wiley Periodicals, Inc. [ABSTRACT FROM AUTHOR]

This study investigated the effects of different surface treatments on the repair bond strength of yttrium-stabilized tetragonal zirconia polycrystalline ceramic (Y-TZP) zirconia to a composite resin. Sixty Y-TZP zirconia specimens were prepared and randomly divided into six groups (n = 10) as follows: Group 1, surface grinding with Cimara grinding bur (control); Group 2, sandblasted with 30 µm silica-coated alumina particles; Group 3, Nd:YAG laser irradiation; Group 4, Er,Cr:YSGG laser irradiation; Group 5, sandblasted + Nd:YAG laser irradiation; and Group 6, sandblasted + Er,Cr:YSGG laser irradiation. After surface treatments, the Cimara® System was selected for the repair method and applied to all specimens. A composite resin was built-up on each zirconia surface using a cylindrical mold (5 × 3 mm) and incrementally filled. The repair bond strength was measured with a universal test machine. Data were analyzed using a one-way ANOVA and a Tukey HSD test (p = 0.05). Surface topography after treatments were evaluated by a scanning electron microscope (SEM). Shear bond strength mean values ranged from 15.896 to 18.875 MPa. There was a statistically significant difference between group 3 and the control group (p < 0.05). Also, a significant increase in bond strength values was noted in group 6 (p < 0.05). All surface treatment methods enhanced the repair bond strength of the composite to zirconia; however, there were no significant differences between treatment methods. The results revealed that Nd:YAG laser irradiation along with the combination of sandblasting and Er,Cr:YSGG laser irradiation provided a significant increase in bond strength between the zirconia and composite resin. SCANNING 37:186-192, 2015. © 2015 Wiley Periodicals, Inc. [ABSTRACT FROM AUTHOR]

Debonding at the composite-adhesive interface is a major problem for indirect composite restorations. The aim of this study was to evaluate the bond strength (BS) of an indirect composite resin after various surface treatments (air-abrasion with Al2O3, phosphoric acid-etchig and different applications of NdYAG laser irradiations). Fifty composite disks were subjected to secondary curing to complete polymerization and randomly divided into five experimental groups ( n = 10) including Group 1, untreated (control); Group 2, phosphoric acid-etched; Group 3, air-abrasion with Al2O3; Group 4, Nd:YAG laser irradiated with non-contact and Group 5, Nd:YAG laser irradiated with contact. They were then bonded to resin cement and shear BS was determined in a universal testing device at a crosshead speed of 1 mm/min. One way analysis of variance (ANOVA) and Tukey post-hoc tests were used to analyze the BS values. The highest BS value was observed in Group 4 and followed by Group 3. Tukey test showed that there was no statistical difference between Group1, 2 and 5. Furthermore, differences in BSs between Group 4 and the other groups except Group 3 were significant ( p < 0.05) and also there were significant differences in BSs between Group 3 to 1 and Group 3 to 2 ( p < 0.05). This study reveals that air-abrasion with Al2O3 and Nd:YAG laser irradiation with non-contact provided a significant increase in BS between indirect composite and resin cement. SCANNING 37:89-94, 2015. © 2014 Wiley Periodicals, Inc. [ABSTRACT FROM AUTHOR]

SEM analysis of endodontic instruments from a Ni-Ti rotary system was assessed, before and after using them, considering their defects and deformations. Twenty Twisted File®, BioRąCe®, Mtwo®, and EndoWave® instruments were micrographed at 190× magnification. The files were washed and micrographed again to view alterations as to the presence or absence of irregular edges, grooves, microcavities, and scraping. Simulated root canal preparations were performed using these instruments. The instruments were cleaned and received a microscopic analysis after being used five times. After analysis tests were tested using Fisher's exact test and Kappa to evaluate the concordance among examiners. There was a statistically significant difference with respect to deformations between Twisted File® and other instruments (p < 0.05). There was no statistically significant difference in strains between the other groups (p > 0.05). All Twisted File® instruments showed the same defects; however damage were lower than those found in BioRace® and Mtwo®. The Endowave® did not show the same defects. In accordance with the data we conclude that the presence of defects was higher in Twisted File® instruments as the instruments and BioRace® Mtwo® brand, the defect rate was smaller and Endowave® instruments had no defects. Regarding the presence of wear after five uses among the groups all instruments showed changes in their cutting blades. SCANNING 36:411-418, 2014. © 2014 Wiley Periodicals, Inc. [ABSTRACT FROM AUTHOR]

The scanning electron microscope (SEM) has gone through a tremendous evolution to become indispensable for many and diverse scientific and industrial applications. The improvements have significantly enriched and augmented the overall SEM performance and have made the instrument far easier to operate. But, the ease of operation also might lead, through operator complacency, to poor results. In addition, the user friendliness has seemingly reduced the need for thorough operator training for using these complex instruments. One might then conclude that the SEM is just a very expensive digital camera or another peripheral device for a computer. Hence, a person using the instrument may be lulled into thinking that all of the potential pitfalls have been eliminated and they believe everything they see on the micrograph is always correct. But, this may not be the case. An earlier paper (Part 1), discussed some of the potential issues related to signal generation in the SEM, instrument calibration, electron beam interactions and the need for physics-based modeling to understand the actual image formation mechanisms. All these were summed together in a discussion of how these issues effect measurements made with the instrument. This second paper discusses another major issue confronting the microscopist: electron-beam-induced specimen contamination. Over the years, NIST has done a great deal of research into the issue of sample contamination and its removal and elimination and some of this work is reviewed and discussed here. SCANNING 36:347-355, 2014. Published 2013. This article is a U.S. Government work and is in the public domain in the USA. [ABSTRACT FROM AUTHOR]

The scanning electron microscope (SEM) has gone through a tremendous evolution to become a critical tool for many and diverse scientific and industrial applications. The high resolution of the SEM is especially suited for both qualitative and quantitative applications especially for nanotechnology and nanomanufacturing. Quantitatively, measurement, or metrology is one of the main uses. It is likely that one of the first questions asked before even the first scanning electron micrograph was ever recorded was: '... how big is that?' The quality of that answer has improved a great deal over the past few years especially since today these instruments are being used as a primary measurement tool on semiconductor processing lines to monitor the manufacturing processes. The well-articulated needs of semiconductor production prompted a rapid evolution of the instrument and its capabilities. Over the past 20 years or so, instrument manufacturers, through substantial semiconductor industry investment of research and development (R&D) money, have vastly improved the performance of these instruments. All users have benefited from this investment, especially where quantitative measurements with an SEM are concerned. But, how good are these data? This article discusses some of the most important aspects and larger issues associated with imaging and measurements with the SEM that every user should know, and understand before any critical quantitative work is attempted. SCANNING 35:355-361, 2013. © 2013 Wiley Periodicals, Inc. SCANNING 35:???-???, 2013. © 2013 Wiley Periodicals, Inc. [ABSTRACT FROM AUTHOR]

Processing of gray scale images in order to determine the corresponding fractal dimension is very important due to widespread use of imaging technologies and application of fractal analysis in many areas of science, technology, and medicine. To this end, many methods for estimation of fractal dimension from gray scale images have been developed and routinely used. Unfortunately different methods (dimension estimators) often yield significantly different results in a manner that makes interpretation difficult. Here, we report results of comparative assessment of performance of several most frequently used algorithms/methods for estimation of fractal dimension. To that purpose, we have used scanning electron microscope images of aluminum oxide surfaces with different fractal dimensions. The performance of algorithms/methods was evaluated using the statistical Z-score approach. The differences between performances of six various methods are discussed and further compared with results obtained by electrochemical impedance spectroscopy on the same samples. The analysis of results shows that the performance of investigated algorithms varies considerably and that systematically erroneous fractal dimensions could be estimated using certain methods. The differential cube counting, triangulation, and box counting algorithms showed satisfactory performance in the whole investigated range of fractal dimensions. Difference statistic is proved to be less reliable generating 4% of unsatisfactory results. The performances of the Power spectrum, Partitioning and EIS were unsatisfactory in 29%, 38%, and 75% of estimations, respectively. The results of this study should be useful and provide guidelines to researchers using/attempting fractal analysis of images obtained by scanning microscopy or atomic force microscopy. SCANNING 35:402-411, 2013. © 2013 Wiley Periodicals, Inc [ABSTRACT FROM AUTHOR]

In an ultra-high vacuum scanning electron microscope, the edged branches of amorphous carbon film (∼10 nm thickness) can be continuously extended with an eye-identifying speed (on the order of ∼1 nm/s) under electron beam. Such unusual mobility of amorphous carbon may be associated with deformation promoted by the electric field, which resulted from an inner secondary electron potential difference from the main trunk of carbon film to the tip end of branches under electron beam. This result demonstrates importance of applying electrical effects to modify properties of carbon materials. It may have positive implications to explore some amorphous carbon as electron field emission device. SCANNING 35: 261-264, 2013. © 2012 Wiley Periodicals, Inc. [ABSTRACT FROM AUTHOR]