Search

A fundamental, yet underexplored, materials system is the interface between biological molecules and inorganic surfaces. In an elemental approach to this problem, we have systematically examined the adhesion of amino acids to a series of inorganic surfaces including metals, insulators, and semiconductors. Significant differential adhesion is observed over the full complement of amino acids, determined largely by amino acid side-chain charge. Extensive mapping of the amino acid adhesion versus materials in multiple solutions is presented, with preliminary mechanisms derived from concentration and pH dependence. These results provide an empirical basis for building peptide to inorganic surface structures, and, using this adhesion data, we design inorganic nanostructures that are shown to selectively bind to prescribed primary peptide sequences.

Soft, conformable electrical contacts provide efficient, noninvasive probes for the transport properties of chemically and mechanically fragile, ultrathin organic semiconducting films. When combined with high-resolution printing and lamination techniques, these soft contacts also form the basis of a powerful technique for fabricating flexible plastic circuits. In this approach, a thin elastomeric film on a plastic substrate supports the electrodes and interconnections; laminating this substrate against another plastic substrate that supports the gate, dielectric and semiconductor levels establishes effective electrical contacts and completes the circuits. In addition to eliminating many of the problems associated with traditional layer-by-layer fabrication strategies, this lamination scheme possesses other attractive features: the transistors and circuit elements are naturally and efficiently encapsulated, and the active organic semiconductor layer is placed near the neutral mechanical plane. We demonstrate the features of soft, laminated contacts by fabricating large arrays of high-performance thin film transistors on plastic substrates by using a wide variety of organic semiconductors.

Electronic systems that use rugged lightweight plastics potentially offer attractive characteristics (low-cost processing, mechanical flexibility, large area coverage, etc.) that are not easily achieved with established silicon technologies. This paper summarizes work that demonstrates many of these characteristics in a realistic system: organic active matrix backplane circuits (256 transistors) for large (≈5 × 5-inch) mechanically flexible sheets of electronic paper, an emerging type of display. The success of this effort relies on new or improved processing techniques and materials for plastic electronics, including methods for ( i ) rubber stamping (microcontact printing) high-resolution (≈1 μm) circuits with low levels of defects and good registration over large areas, ( ii ) achieving low leakage with thin dielectrics deposited onto surfaces with relief, ( iii ) constructing high-performance organic transistors with bottom contact geometries, ( iv ) encapsulating these transistors, ( v ) depositing, in a repeatable way, organic semiconductors with uniform electrical characteristics over large areas, and ( vi ) low-temperature (≈100°C) annealing to increase the on/off ratios of the transistors and to improve the uniformity of their characteristics. The sophistication and flexibility of the patterning procedures, high level of integration on plastic substrates, large area coverage, and good performance of the transistors are all important features of this work. We successfully integrate these circuits with microencapsulated electrophoretic “inks” to form sheets of electronic paper.