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The aim of this paper is to improve surface and subsurface workpiece properties in steel grinding by using nearly spherical ceramic grains in an elastic bond system. To characterize and evaluate the potential of this rather new tool concept, the resulting workpiece microtopography and the subsurface characteristics are analysed and cover residual stresses, micrographic cross sections, and EBSD images. The results include the effect of the different process parameters on increased mechanical process loads resulting in favorable surface properties characterized by mechanically induced plastic deformation and compressive residual stresses. With regard to the metallographic analyses, an increased grain refinement was identified in micrographs and EBSD images, which results from the changed chip generation mechanisms. The sum of the above effects shows an increase in the residual compressive stresses introduced into the workpiece. This reveals the potential of spherical ceramic grains in an elastic bonding system. [ABSTRACT FROM AUTHOR]