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Ordered porous polyimide films were fabricated from (AB)m type of diblock copolymer polyimide-b-polystyrene (PI-b-PS). An increase in PS volume fraction (f VPS) is beneficial to decrease the relative dielectric constants and water contact angles of the obtained porous PI films: the relative dielectric constant decreases to 1.89 and water contact angle decreases to 43° when f VPS is 0.36, indicating porous PI films can be used as low-κ material and have good wettability. The solvent uptake of the porous PI films increases with increasing f VPS. A net-like morphology appears when f VPS reaches 0.36. The net-like porous PI film reaches equilibrium uptake of water within approximately 2.5 h, with a final equilibrium uptake ratio of 17.5%, and reaches equilibrium uptake of toluene within approximately 8 h, with a final equilibrium uptake ratio of 15.4%, displaying the highest and fastest solvent uptake compared with other microstructured porous PI films, which is ascribed to the specific characteristic of the interconnecting porous channels derived from the self-assembly of PI-b-PS with f VPS 0.36. Introducing thermally degradable segments to PI-based block copolymer is an effective method to prepare porous PI films and can enhance some of their properties. [ABSTRACT FROM AUTHOR]

The photosensitive resins for 3D printing technology have been widely applied throughout the advanced communication field due to their merits of high molding accuracy and fast processing speed. Regardless, they, in particular, should have better mechanical properties, heat resistance, and dielectric properties. Herein, photocurable fluorinated poly (phthalazinone ether) (FSt-FPPE) was utilized as a prepolymer to improve the performance of photosensitive resin. A series of UV-curable inks named FST/DPGs were prepared with FSt-FPPE and acrylic diluents of different mass fractions. The FST/DPGs were cured into films by UV curing and post-treatment. After curing, their properties were characterized in detail. In terms of heat resistance, glass transition temperature (Tg) could reach 233 °C and the 5% thermal decomposition temperature (Td5%) was 371 °C. The tensile strength surprisingly reached 61.5 MPa, and the dielectric constant (Dk) could be significantly reduced to 2.75. Additionally, FST/DPGs were successfully employed in UV-assisted direct writing (DIW) to print 3D objects that benefited from their commendable fluidity and rapid curing speed. A stiff cylinder sample with a smooth surface and distinct pattern was ultimately obtained, indicating their remarkable 3D printing adaptation. Such photosensitive resin for UV-assisted DIW exhibits tremendous potential in the electronic industry. [ABSTRACT FROM AUTHOR]

In order to reduce the infrared emissivity to meet the requirements of modern warfare for infrared stealth materials, we prepared the polymers containing Schiff base moieties using polyetheramine and 2,6-pyridinedicarboxaldehyde by solution polycondensation and coordinated with Ni2+, Cu2+, and Sm3+ ions to prepare organic coatings. The structure and the thermal and mechanical properties of the coatings were studied in detail. Meanwhile, the effect of the conductivity change of coordination polymers on infrared emissivity was studied systematically. The results showed the polymer coordinated with Sm3+ ions had the lowest energy band gap, which was 2.99 eV, and the best electrical conductivity of 3.54 × 10−4 S/cm compared with Ni2+ and Cu2+ coordination polymers. The infrared emissivity was the lowest in the 2–22 μm infrared waveband range, which reached 0.58, suggesting the polymers containing Schiff base moieties and their coordination polymers may have a great potential to be applied as infrared stealth materials in military applications. [ABSTRACT FROM AUTHOR]