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In this study, a thermal conductivity of 0.22 W·m -1 ·K -1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al 2 O 3 ) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al 2 O 3 -BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m -1 ·K -1 , increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (T g ), decomposition temperature (T d ), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.