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We demonstrate that paraxial ring-Airy beams can approach the wavelength limit, while observing a counterintuitive, strong enhancement of their focal peak intensity. Using numerical simulations, we show that this behavior is a result of the coherent constructive action of paraxial and nonparaxial energy flow. A simple theoretical model enables us to predict the parameter range over which this is possible.

A three-dimensional (3D) holographic focal volume engineering method is proposed and employed for advanced multiphoton polymerization. A large number of foci are closely positioned in space according to a designed geometry, avoiding undesired interference effects by phase engineering. Through all-optical micro-displacements in space, the discrete foci bundle leads to the realization of complete 3D arbitrary structures. The microstructures are fabricated by direct laser writing without additional optical or mechanical motion support. We report a 20-times faster fabrication time in comparison to point-by-point laser polymerization techniques.

We report the development of a new microstereophotolithography technique for creation of three-dimensional microcomponents by use of a planar, layer-by-layer process of exposure, in which a spatial light modulator is used as a dynamic lithographic mask. The system operates in the UV to take advantage of the wide supply of commercially available photopolymers designed for conventional stereolithography. With this novel procedure it is possible to build components with feature sizes as small as a few micrometers. The experimental setup is briefly described, and the first microcomponent fabricated by this system is shown.

We report the fabrication of three-dimensional structures of submicrometer resolution by three-photon polymerization. This resolution has been achieved by polymerizing ORMOCER, a UV photocurable organic–inorganic hybrid material, with an ultrafast laser irradiation at 1028?nm. To our knowledge, this is the first demonstration of three-photon polymerization, a process that may allow the fabrication of components of very high resolution.