1. High-directionality fiber-chip grating coupler with interleaved trenches and subwavelength index-matching structure
- Author
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Carlos Alonso-Ramos, Daniel Benedikovic, Shurui Wang, Jean-Marc Fedeli, Siegfried Janz, Jean Lapointe, Jens H. Schmid, Alejandro Ortega-Moñux, Dan-Xia Xu, Robert Halir, Laurent Vivien, Pavel Cheben, Milan Dado, J. Gonzalo Wangüemert-Pérez, and Íñigo Molina-Fernández
- Subjects
Materials science ,Holographic grating ,Silicon ,business.industry ,Photonic integrated circuit ,chemistry.chemical_element ,Substrate (electronics) ,Grating ,Atomic and Molecular Physics, and Optics ,law.invention ,Optics ,chemistry ,law ,Blazed grating ,business ,Diffraction grating ,Waveguide - Abstract
We present the first experimental demonstration of a new fiber-chip grating coupler concept that exploits the blazing effect by interleaving the standard full (220 nm) and shallow etch (70 nm) trenches in a 220 nm thick silicon layer. The high directionality is obtained by controlling the separation between the deep and shallow trenches to achieve constructive interference in the upward direction and destructive interference toward the silicon substrate. Utilizing this concept, the grating directionality can be maximized independent of the bottom oxide thickness. The coupler also includes a subwavelength-engineered index-matching region, designed to reduce the reflectivity at the interface between the injection waveguide and the grating. We report a measured fiber-chip coupling efficiency of −1.3 dB , the highest coupling efficiency achieved to date for a surface grating coupler in a 220 nm silicon-on-insulator platform fabricated in a conventional dual-etch process without high-index overlays or bottom mirrors.
- Published
- 2015