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Laser damage performance of DKDP (KD 2x H 2(1-x) PO 4 ) crystal is largely determined by the surface microstructures generated in the manufacturing process, more specifically, single point diamond fly-cutting process. However, because of the lack of knowledge about the formation mechanism and damage performance of the microstructures, laser induced damage of DKDP crystal remains a key issue limiting the output energy of the high power laser systems. In this paper, the influence of fly-cutting parameters on the generation of DKDP surface and the underlying material deformation mechanism have been investigated. Except for cracks, two kinds of new microstructures, namely micro grains and ripples, have been found on the processed DKDP surfaces. GIXRD, nano-indentation and nano-scratch test results prove that the micro grains are generated by the slip motion of the crystal, while the simulation results show that the cracks are induced by the tensile stress formed behind the cutting edge. Moreover, the formation of micro grains can facilitate the plastic chip flow through the mechanism of grain boundary sliding, which will further lead to a periodic fluctuation of the chip separation point and the formation of micro ripples. Finally, laser damage test results demonstrate that cracks will degrade the damage performance of DKDP surface significantly, while the formation of micro grains and micro ripples has little impact. The results of this study can deepen the understanding of the formation mechanism of the DKDP surface during the cutting process and provide guidance to improve the laser-induced damage performance of the crystal.

The machining-induced cracks and other defects on the surface of fused silica would incur damage when irradiated by intense lasers, which greatly shortens the service life of the fused silica optical components. The high absorption coefficient of fused silica for far-infrared lasers makes it possible to use low-energy CO 2 lasers to melt and heal micro defects on the surface, and hence improve its damage threshold under the service conditions of extremely intense laser. However, the air in the cracks may evolve into bubbles during the laser healing process, but the law of crack morphology evolution and the bubble formation mechanism have not been clearly revealed. In this work, a simulation model of the healing process of fused silica surface cracks under the effect of low-energy CO 2 laser is established. Three bubble formation mechanisms (i.e., the uneven fluidity caused by temperature gradient, the collapse effect caused by inclined cracks, and the internal cracks) are identified based on the simulation results of cracks with various original morphologies and characteristic structural parameters. The simulated fused silica morphology is consistent with the results of the laser healing experiment. This work can provide theoretical guidance for the optimization of optical manufacturing parameters of fused silica, as well as the CO 2 laser healing and polishing strategies.

Anti-reflection (AR) coating is a critical technology and an ongoing challenge for terahertz systems. The subwavelength structure (SWS) is an effective AR method, whereas the current manufacturing techniques, such as chemical etching and ultrafast laser processing, are low-efficient and low-quality for processing structures at the hundred-micron scale on hard brittle materials. We present a study of broadband SWSs directly ablated on the surface of quartz crystal by precisely controlled CO 2 laser pulses, instead of commonly used ultra-fast lasers. The processing time of SWS can be shortened by two orders of magnitude compared with that by ultra-fast laser pulses. The SWS samples exhibit excellent AR properties with maximum transmittance of 97% at 0.71 THz, peak transmittance improvement of 13.5%, and optimal efficiency spectrum of 0.28-1.21 THz with transmittance >90%. The AR properties of SWS samples are in agreement with the simulated expectation and exist over a wide range of incidence angles up to ∼40°. The imaging of an object using SWS as the substrate shows an obvious improvement in imaging quality. We present an efficient and practical way to improve the transmission of optical components of materials, such as quartz crystal, alumina, and sapphire, in the terahertz band.

Ultrasonic vibration has been employed to improve the quality of machined surface in the grinding of brittle materials. In this report, we transplant the philosophy of ultrasonic vibration assisted grinding to chemo-mechanical bound-abrasive-pellet polishing in anticipation of the improvement in either surface roughness or material removal rate. The preliminary experimental results show that the ultrasonic vibration assisted chemo-mechanical pellet polishing can yield desired results that material removal rate can be significantly raised while surface roughness is not degraded. The experimental results also indicate different mechanisms between ultrasonic-vibration-assisted chemo-mechanical pellet polishing and conventional chemo-mechanical bound-abrasive polishing.