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Start Over Author "I. Bakish" Journal optical fiber communication conference
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1. Low Temperature Wafer Bonding of Silicon to InP and Silicon to LiNbO3 Using Self-Assembled Monolayers

Author

Y. Ben-Ezra, Chaim N. Sukenik, E. Shekel, S. Zach, I. Bakish, Moran Shubely, Vlada Artel, Avi Zadok, and T. Kraus

Subjects
Materials science, Silicon, Absorption spectroscopy, business.industry, Wafer bonding, Hybrid silicon laser, chemistry.chemical_element, Infrared spectroscopy, Self-assembled monolayer, chemistry, Anodic bonding, Optoelectronics, Deposition (phase transition), business
Abstract

Procedures for wafer bonding between silicon and InP and between silicon and LiNbO3 at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.

Published
2012
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