1. Towards large area and continuous MoS2 atomic layers via vapor-phase growth: thermal vapor sulfurization
- Author
-
J. F. Ying, Dongzhi Chi, K. K. Ansah Antwi, Soo Jin Chua, and Hongfei Liu
- Subjects
Materials science ,Mechanical Engineering ,Evaporation ,Analytical chemistry ,Bioengineering ,Nanotechnology ,Corundum ,Crystal growth ,General Chemistry ,Substrate (electronics) ,engineering.material ,Amorphous solid ,Mechanics of Materials ,engineering ,Sapphire ,General Materials Science ,Wafer ,Electrical and Electronic Engineering ,Deposition (law) - Abstract
We report on the effects of substrate, starting material, and temperature on the growth of MoS(2) atomic layers by thermal vapor sulfurization in a tube-furnace system. With Mo as the starting material, atomic layers of MoS(2) flakes are obtained on sapphire substrates while a bell-shaped MoS(2) layer, sandwiched by amorphous SiO(2), is obtained on native-SiO(2)/Si substrates under the same sulfurization conditions. An anomalous thickness-dependent Raman shift (A(1g)) of the MoS(2) atomic layers is observed in Mo-sulfurizations on sapphire substrates, which can be attributed to the competition between the effects of thickness and the surface/interface. Both effects vary with the sulfurizing temperatures for a certain initial Mo thickness. The anomalous frequency trend of A(1g) is missing when using MoO(3) instead of Mo as the starting material. In this case, the lateral growth of MoS(2) on sapphire is also largely improved. Furthermore, the area density of the resultant MoS(2) atomic layers is significantly increased by increasing the deposition temperature of the starting MoO(3) to 700 °C; the adjacent ultrathin MoS(2) grains coalesce in one or other direction, forming connected chains in wafer scale. The thickness of the so-obtained MoS(2) is generally controlled by the thickness of the starting material; however, the structural and morphological properties of MoS(2) grains, towards large area and continuous atomic layers, are strongly dependent on the temperature of the initial material deposition, and on the temperature of sulfurization, because of the competition between surface mobility and atom evaporation.
- Published
- 2014