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The high-hardness and transparent PMMA-based composites play a significant role in modern optical devices. However, a well-known paradox is that conventional PMMA-based composites with high loadings of nanoparticles usually possess high surface hardness at the cost of poor transparency and toughness due to the aggregation of nanoparticles. In this work, ideal optical materials (SiO2/PMMA composites) with high transparency and high surface hardness are successfully fabricated through the introduction of the flow modifier Si-DPF by conventional melt blending. Si-DPF with low surface energy and high transparency, which is located at the SiO2/PMMA interface, and nano-SiO2 particles are homogeneously dispersed in the PMMA matrix. As an example, the sample SiO2/PMMA/Si-DPF (30/65/5) shows outstanding transparency (>87.2% transmittance), high surface hardness (462.2 MPa), and notched impact strength (1.18 kJ/m2). Moreover, SiO2/PMMA/Si-DPF (30/65/5) also presents a low torque value of composite melt (21.7 N⋅m). This work paves a new possibility for the industrial preparation of polymer-based composites with excellent transparency, surface hardness, processability, and toughness. [ABSTRACT FROM AUTHOR]

In this study, a fluorine-containing flow modifier (Si-DF) with low surface energy is successfully synthesized, which is applied to fabricate ideal electronic packaging materials (BN/PPS composites) with high thermal conductivity, excellent dielectric properties, processability, and toughness by conventional melt blending. Si-DPF is located at the interface between the BN fillers and the PPS matrix, which not only improves the dispersion of BN fillers but also strengthens the interaction. With the help of 5 wt% Si-DF, BN/PPS/Si-DF (70/25/5) still exhibits the high thermally conductive coefficient (3.985 W/m·K) and low dielectric constant (3.76 at 100 MHz) although BN fillers are loaded as high as 70 wt%. Moreover, the sample processes a lower stable torque value (2.5 N·m), and the area under the stress–strain curves is also increased. This work provides an efficient way to develop high-performance polymer-based composites with high thermally conductive coefficients and low dielectric constants for electronic packaging applications. [ABSTRACT FROM AUTHOR]