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In this paper, we combined localized electrochemical deposition and electroless plating process for fabricating the metal pattern with the large area on flexible membrane. The pattern of the anode plate can rapidly transfer to the cathode membrane by localized electrochemical deposition. The thickness of the pattern can be increased by electroless plating process. The width of the mask pattern was close to the width of the final pattern. The anode plate can be used over fifty times for this process until the pattern was electrolyzed completely. This method provides a possible low cost approach to fabricate high metal structures on the flexible substrate with large area. It may have the potential to be applied in the fabrication of e-paper, flexible printed circuit and eventually adapted to roll-to-roll process.

A soft lithography process has been developed to transfer a pattern directly from a flat PDMS stamp to a stainless steel cylindrical substrate using an SAM ink, without any need to physically attach the stamp to a roller. The process uses standard semiconductor wafer processing equipment, along with specially designed elements to adapt to the cylindrical substrates. The entire process can be applied to batch processing and thus can be directly applied to manufacturing. This technique was demonstrated by fabricating a steel herringbone journal bearing with a diameter of 1.5 mm. The HGJB is an important element which is used for high-speed rotating spindles of electro-mechanical systems such as hard disk drives, CD-Rom drives, and DVD drives in the consumer electronics industry. In this case, the pattern had a dimension of 85 microns and depth of 3 microns. Features as deep as ten microns and as narrow as two microns have been also demonstrated.